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CN-122011991-A - Single-component epoxy conductive adhesive material and preparation method and application thereof

CN122011991ACN 122011991 ACN122011991 ACN 122011991ACN-122011991-A

Abstract

The invention relates to the technical field of conductive shielding, in particular to a single-component epoxy conductive bonding material, a preparation method and application thereof, wherein the single-component epoxy conductive bonding material comprises, by mass, 5-25 parts of epoxy resin, 60-90 parts of conductive filler, 0.5-5 parts of diluent, 1-8 parts of curing agent, 0.5-2 parts of silane coupling agent and 1-5 parts of toughening agent, and the epoxy resin comprises one or more of 0164 epoxy resin, E44 epoxy resin, polyurethane modified epoxy resin, organosilicon modified epoxy resin and bisphenol F epoxy resin. The single-component epoxy conductive adhesive material has the advantages that the low-molecular-weight liquid epoxy resin is used as a matrix, the addition of a curing agent is matched, the apparent activation energy of the single-component epoxy conductive adhesive material is reduced by utilizing a proton transfer mechanism, meanwhile, the viscosity of the system is reduced by utilizing a thinner through plasticization, the segment movement capability is improved, the curing reaction can reach a higher conversion rate at about 80-120 ℃, and the single-component epoxy conductive adhesive material has excellent bonding reliability under the mild curing condition.

Inventors

  • LIN XIANGTIAN
  • DAI YUHONG

Assignees

  • 深圳市飞荣达科技股份有限公司

Dates

Publication Date
20260512
Application Date
20260324

Claims (10)

  1. 1. The single-component epoxy conductive adhesive material is characterized by comprising, by mass, 5-25 parts of epoxy resin, 60-90 parts of conductive filler, 0.5-5 parts of diluent, 1-8 parts of curing agent, 0.5-2 parts of silane coupling agent and 1-5 parts of toughening agent; wherein the epoxy resin comprises one or more of 0164 epoxy resin, E44 epoxy resin, polyurethane modified epoxy resin, organosilicon modified epoxy resin and bisphenol F type epoxy resin.
  2. 2. The one-component epoxy conductive adhesive material according to claim 1, wherein the conductive filler comprises one or more of flake silver powder, spherical nickel powder, nickel-coated graphite powder, silver aluminum powder, resin-like silver copper powder, sphere-like silver copper powder, resin-like silver nickel powder, sphere-like silver nickel powder, silver-plated glass bead powder, and conductive graphene powder.
  3. 3. The one-component epoxy conductive adhesive material according to claim 2, wherein the flake silver powder has a D50 particle size of 5 μm to 15 μm, the spherical silver powder has a D50 particle size of 0.8 μm to 10 μm, the spherical nickel powder has a D50 particle size of 3 μm to 30 μm, the nickel-coated graphite powder has a D50 particle size of 25 μm to 100 μm, the silver aluminum powder has a D50 particle size of 23 μm to 70 μm, the resinous silver copper powder and the spherical silver copper powder have a D50 particle size of 3 μm to 15 μm, the resinous silver nickel powder and the spherical silver nickel powder have a D50 particle size of 3 μm to 30 μm, the silver glass powder has a D50 particle size of 8 μm to 40 μm, and the conductive graphene powder has a D50 particle size of 15 μm to 25 μm.
  4. 4. The one-part epoxy conductive adhesive material of claim 1, wherein the diluent comprises one or more of n-butyl glycidyl ether, 1-4 butanediol diglycidyl ether, propylene oxide butyl ether, diglycidyl ether.
  5. 5. The one-part epoxy conductive adhesive material of claim 1, wherein the curing agent comprises one or more of polyamide, 1-cyanoethyl-2-ethyl-4-methylimidazole, polyetheramine D230, polyetheramine D400, RFD-270, 2-ethyl-4-methylimidazole, polyetheramine 2000, dicyandiamide.
  6. 6. The one-component epoxy conductive adhesive material of claim 1, wherein the silane coupling agent comprises one or more of 3-aminopropyl triethylsilane, gamma- (2, 3-glycidoxy) propyl trimethoxysilane, gamma-methacryloxypropyl trimethoxysilane, JSC-376, HY-1410; And/or the toughening agent comprises one or more of carboxyl-terminated nitrile rubber, a toughening agent WD-401, a toughening agent WD-403, acrylic rubber and organic silicon rubber.
  7. 7. A method of preparing a one-component epoxy conductive adhesive material as claimed in any one of claims 1 to 6, comprising the steps of: according to the parts by weight, performing first heating and stirring treatment on the epoxy resin and the toughening agent to obtain a first sizing material; Adding conductive filler into the first sizing material for multiple times, and performing second heating and stirring treatment to obtain a second sizing material; carrying out first stirring and mixing treatment on the second sizing material, the diluent and the silane coupling agent to obtain a third sizing material; And (3) carrying out second stirring and mixing treatment on the third sizing material and the curing agent, and carrying out vacuumizing treatment to obtain the single-component epoxy conductive adhesive material.
  8. 8. The method for preparing a one-component epoxy conductive adhesive material according to claim 7, wherein the temperature of the first heating and stirring treatment is 50 ℃ to 125 ℃, the rotating speed of the first heating and stirring treatment is 40r/min to 80r/min, and the time of the first heating and stirring treatment is 10min to 30min; And/or the temperature of the second heating and stirring treatment is 80-125 ℃, the rotating speed of the second heating and stirring treatment is 20-60 r/min, and the time of the second heating and stirring treatment is 10-60 min.
  9. 9. The method for preparing a one-component epoxy conductive adhesive material according to claim 7, wherein the rotational speed of the first stirring and mixing treatment is 20r/min-60r/min, and the time of the first stirring and mixing treatment is 10min-60min; And/or the rotating speed of the second stirring and mixing treatment is 20r/min-60r/min, and the time of the second stirring and mixing treatment is 10min-30min.
  10. 10. Use of the one-component epoxy conductive adhesive material according to any one of claims 1 to 6 in a vehicle camera module.

Description

Single-component epoxy conductive adhesive material and preparation method and application thereof Technical Field The invention relates to the technical field of conductive shielding, in particular to a single-component epoxy conductive adhesive material, a preparation method and application thereof. Background The epoxy conductive adhesive glue is mainly used for a vehicle-mounted camera module, is mainly a composite material combining conductivity and adhesiveness, and is prepared from epoxy resin E51, bisphenol F type epoxy resin and the like, and is prepared from pure silver powder, nickel powder, silver-copper powder and the like. The epoxy resin has high molecular chain rigidity and low epoxy group activity, and needs to be matched with aromatic amine or anhydride curing agents, so that the curing initial temperature is generally higher than 150 ℃, and meanwhile, in order to reach the glass transition temperature (Tg) required by complete crosslinking, the post-curing treatment often needs to be over 180 ℃, which is difficult to meet in application scenes of camera modules and the like which are sensitive to heat. In addition, after the epoxy conductive glue is heated and cured, the conductive fillers are in close contact with each other to form a conductive path due to shrinkage of the epoxy resin during curing, and the cured epoxy resin forms a three-dimensional crosslinked network to provide adhesion force with the upper shell and the lower shell of the camera module. However, bisphenol A resin such as E51 has high crosslinking density but high brittleness after curing, internal stress is difficult to release, and interfacial debonding is easy to occur under temperature cycle or mechanical impact. Therefore, the current epoxy conductive adhesive glue has the problems of high curing temperature, poor adhesive force and the like. Accordingly, the prior art is still in need of improvement and development. Disclosure of Invention In view of the defects of the prior art, the invention aims to provide a single-component epoxy conductive bonding material, and a preparation method and application thereof, and aims to solve the problems of high curing temperature and poor bonding force of the existing epoxy conductive bonding material. The technical scheme of the invention is as follows: the single-component epoxy conductive adhesive material comprises, by mass, 5-25 parts of epoxy resin, 60-90 parts of conductive filler, 0.5-5 parts of diluent, 1-8 parts of curing agent, 0.5-2 parts of silane coupling agent and 1-5 parts of toughening agent; wherein the epoxy resin comprises one or more of 0164 epoxy resin, E44 epoxy resin, polyurethane modified epoxy resin, organosilicon modified epoxy resin and bisphenol F type epoxy resin. The single-component epoxy conductive adhesive material comprises one or more of flake silver powder, spherical nickel powder, nickel-coated graphite powder, silver aluminum powder, resin-shaped silver copper powder, spherical silver copper powder, resin-shaped silver nickel powder, spherical silver nickel powder, silver-plated glass bead powder and conductive graphene powder. The single-component epoxy conductive adhesive material comprises a D50 particle size of the flake silver powder, a D50 particle size of the spherical nickel powder, a D50 particle size of the nickel-coated graphite powder, a D50 particle size of the resin-shaped silver copper powder and a D50 particle size of the spherical silver copper powder, a D50 particle size of the resin-shaped silver copper powder and a D50 particle size of the spherical silver nickel powder, a D50 particle size of the resin-shaped silver nickel powder and a D50 particle size of the spherical silver nickel powder, a D50 particle size of the silver-coated glass powder and a D50 particle size of the spherical silver nickel powder, and a D50 particle size of the conductive graphene powder, wherein the D50 particle size of the spherical silver powder is 5-15 microns, the spherical silver nickel powder and the spherical silver nickel powder is 0.8-10 microns, the spherical silver powder is 8-40 microns, and the conductive graphene powder is 15-25 microns. The single-component epoxy conductive adhesive material comprises one or more of n-butyl glycidyl ether, 1-4-butanediol diglycidyl ether, epoxypropane butyl ether, diglycidyl ether and diglycidyl ether. The single-component epoxy conductive adhesive material comprises one or more of polyamide, 1-cyanoethyl-2-ethyl-4-methylimidazole, polyetheramine D230, polyetheramine D400, RFD-270, 2-ethyl-4-methylimidazole, polyetheramine 2000 and dicyandiamide. The single-component epoxy conductive adhesive material comprises one or more of 3-aminopropyl triethylsilane, gamma- (2, 3-epoxypropoxy) propyl trimethoxysilane, gamma-methacryloxypropyl trimethoxysilane, JSC-376 and HY-1410; And/or the toughening agent comprises one or more of carboxyl-terminated nitrile rubber, a toughening agent WD-401, a toug