CN-122012000-A - Adhesive composition and structure

Abstract

The invention provides an adhesive composition and a structure. The adhesive composition comprises (a) a thermoplastic resin having a urethane bond, (b) a radical polymerizable compound, (c) a radical polymerization initiator, (d) polyurethane beads, and (e) nonconductive inorganic fine particles selected from one or more of the group consisting of silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles, wherein the content of the nonconductive inorganic fine particles is 5 to 20 mass% based on the total mass of the adhesive component, and the radical polymerizable compound comprises a radical polymerizable compound having a phosphate structure represented by the following general formula (1), Wherein p represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group.

Inventors

• KUDO TADASHI
• KAWABATA YASUNORI
• Mitaka Shota
• MORIJIRI SHIRAKAWA

Assignees

• 株式会社力森诺科

Dates

Publication Date

20260512

Application Date

20180328

Priority Date

20170329

Claims (6)

1. 1. An adhesive composition comprising: (a) Thermoplastic resin having urethane bond, (B) A radical polymerizable compound, (C) A radical polymerization initiator, (D) Polyurethane beads (E) The non-conductive inorganic particles are formed of a non-conductive inorganic material, The non-conductive inorganic fine particles are selected from one or more of the group consisting of silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles, and the content of the non-conductive inorganic fine particles is 5 to 20% by mass based on the total mass of the binder component, The radical polymerizable compound comprises a radical polymerizable compound having a phosphate structure represented by the following general formula (1), Wherein p represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group.
2. 2. The adhesive composition according to claim 1, wherein the content of the (a) thermoplastic resin having a urethane bond is greater than or equal to the content of the (d) polyurethane beads on a mass basis.
3. 3. The adhesive composition according to claim 1 or 2, further comprising (f) conductive particles.
4. 4. The adhesive composition according to claim 1 or 2, for use in electrical circuit connection.
5. 5. A structure comprising the adhesive composition according to any one of claims 1 to 4 or a cured product thereof.
6. 6. A structure is provided with: a first circuit member having a first circuit electrode, Second circuit member having second circuit electrode, and A circuit connection member disposed between the first circuit member and the second circuit member, The first circuit electrode is electrically connected with the second circuit electrode, The circuit connecting member comprises the adhesive composition according to any one of claims 1 to 4 or a cured product thereof.

Description

Adhesive composition and structure The application relates to a Chinese patent application with the filing date of 2018, 3 month and 28 days, the filing number of 201880021694.3 and the name of adhesive composition and structure. Technical Field The present disclosure relates to adhesive compositions and structures. Background In semiconductor devices and liquid crystal display devices (display devices), various adhesives have been conventionally used for the purpose of bonding various members in the devices. The properties required for the adhesive include adhesion, heat resistance, and reliability in a high-temperature and high-humidity state. As the adherend used for bonding, a printed wiring board, an organic substrate (polyimide substrate, etc.), a metal (titanium, copper, aluminum, etc.), a substrate having a surface state such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide ), IGZO (Indium Gallium Zinc Oxide, indium gallium zinc Oxide), siN X、SiO2, etc., and the like are used, and it is necessary to design the molecule of the adhesive according to each adherend. Conventionally, thermosetting resins (epoxy resins, acrylic resins, etc.) exhibiting high adhesion and high reliability have been used as adhesives for semiconductor devices or liquid crystal display devices. As a constituent of an adhesive using an epoxy resin, an epoxy resin and a latent curing agent that generates a cationic species or an anionic species reactive with the epoxy resin by heat or light are generally used. The latent curing agent is an important factor for determining the curing temperature and curing speed, and various compounds are used from the viewpoints of storage stability at normal temperature and curing speed upon heating. In an actual process, for example, the desired adhesion is obtained by curing under curing conditions of a temperature of 170 to 250 ℃ for 10 seconds to 3 hours. In recent years, with the high integration of semiconductor elements and the high definition of liquid crystal display elements, the pitch between elements and between wirings has been narrowed, and there is a concern that heat during curing may adversely affect peripheral members. Further, in order to reduce the cost, it is necessary to improve the productivity, and it is necessary to bond at a low temperature (90 to 170 ℃) and in a short time (within 1 hour, preferably within 10 seconds, more preferably within 5 seconds), in other words, it is necessary to bond at a low temperature and in a short time by curing (rapid curing at a low temperature). In order to achieve such low-temperature short-time curing, it is necessary to use a thermally latent catalyst having low activation energy, but it is known that it is very difficult to have both storage stability at around normal temperature. Accordingly, in recent years, attention has been paid to a radical curing adhesive or the like using a (meth) acrylate derivative in combination with a peroxide as a radical polymerization initiator. In the case of a radical curing system, since radicals as reactive species are very reactive, a short-time curing can be achieved, and at a decomposition temperature of less than or equal to a radical polymerization initiator, since peroxides exist stably, a curing system having both a low-temperature short-time curing and storage stability (for example, storage stability in the vicinity of normal temperature) is provided. For example, radical curable adhesive compositions as shown in the following patent documents 1 to 3 are known. Prior art literature Patent literature Patent document 1 Japanese patent laid-open No. 2006-22231 Patent document 2 Japanese patent application laid-open No. 2009-1765 Patent document 3 International publication No. 2009/063827 Disclosure of Invention Problems to be solved by the invention In recent years, the connection portion between the semiconductor element and the liquid crystal display element has been further reduced in size, and an adhesive having sufficient adhesive strength even in a smaller connection area has been demanded. However, the conventional adhesive cannot obtain a sufficient adhesive strength. Accordingly, an object of the present disclosure is to provide an adhesive composition which is a radical curable adhesive capable of being connected at a low temperature for a short period of time (cured at a low temperature for a short period of time) and which can obtain a sufficient adhesive strength even when the connection area is small, and a structure using the adhesive composition. Means for solving the problems The present inventors focused on polyurethane beads during the course of the study. In addition, the present inventors have found that, in the course of examining an adhesive composition containing polyurethane beads, the adhesive strength is particularly high particularly when a resin containing urethane bonds is used as a thermoplastic resin. Further, it was found that the adhesive strength was furt