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CN-122012017-A - Thermosetting temporary bonding adhesive and preparation method and application thereof

CN122012017ACN 122012017 ACN122012017 ACN 122012017ACN-122012017-A

Abstract

The invention provides a thermosetting temporary bonding adhesive and a preparation method and application thereof, wherein the thermosetting temporary bonding adhesive comprises, by mass, 20-80 parts of an organic solvent, 5-35 parts of vinyl raw rubber, 5-35 parts of hydrogen-containing silicone oil and 0.01-5 parts of an auxiliary agent, the auxiliary agent comprises an antioxidant, a leveling agent, an inhibitor and a catalyst, the ratio of the molar quantity of vinyl in the vinyl raw rubber to the molar quantity of hydrogen in the hydrogen-containing silicone oil is 1.1-1.4, and the mass ratio of the inhibitor to the catalyst is (50-500): 1. The thermosetting temporary bonding adhesive of the invention realizes the performance balance of ' high temperature resistance above 150 ℃ and ' one-time no residue degumming after soaking by cleaning agent ' of a thermosetting system aiming at the short board which is difficult to clean after the existing thermosetting temporary bonding adhesive manufacturing process, and is suitable for the wafer HBM processing requirement.

Inventors

  • CAO WENBING
  • YE ZHENWEN
  • HUANG MINGQI
  • LIU ZHONGSHENG

Assignees

  • 深圳市芸卓新材料科技有限公司

Dates

Publication Date
20260512
Application Date
20260203

Claims (10)

  1. 1. The thermosetting temporary bonding adhesive is characterized by comprising, by mass, 20-80 parts of an organic solvent, 5-35 parts of vinyl raw rubber, 5-35 parts of hydrogen-containing silicone oil and 0.01-5 parts of an auxiliary agent, wherein the auxiliary agent comprises an antioxidant, a leveling agent, an inhibitor and a catalyst, the ratio of the molar amount of vinyl in the vinyl raw rubber to the molar amount of hydrogen in the hydrogen-containing silicone oil is 1.1-1.4, and the mass ratio of the inhibitor to the catalyst is (50-500): 1.
  2. 2. The thermosetting temporary bonding adhesive of claim 1, wherein the organic solvent is selected from one or a combination of at least two of toluene, xylene, trimethylbenzene, petroleum ether, n-hexane, cyclohexane, ethylcyclohexane, chloroform, or carbon tetrachloride.
  3. 3. The thermosetting temporary bonding adhesive according to claim 1 or 2, wherein the vinyl raw rubber has a vinyl content of 0.1-5%, preferably 0.5% -4.5%; Preferably, the weight average molecular weight of the vinyl raw rubber is 30000-1200000, preferably 50000-1000000.
  4. 4. A thermosetting temporary bonding adhesive according to any one of claims 1 to 3, wherein the hydrogen-containing silicone oil has a hydrogen value of 0.001 to 3%, preferably 0.002 to 2.5%; Preferably, the weight average molecular weight of the hydrogen-containing silicone oil is 1000 to 500000, preferably 5000 to 400000.
  5. 5. The thermosetting temporary bonding adhesive according to any one of claims 1 to 4, wherein the ratio of the molar amount of vinyl in the vinyl-based rubber to the molar amount of hydrogen in the hydrogen-containing silicone oil is 1.11 to 1.35.
  6. 6. The thermosetting temporary bonding adhesive according to any one of claims 1 to 5, wherein the antioxidant is selected from one or a combination of at least two of hindered phenolic antioxidants, hindered amine antioxidants, phosphite antioxidants or sulphur-containing antioxidants, preferably one or two of hindered phenolic antioxidants or hindered amine antioxidants, more preferably hindered phenolic antioxidants; preferably, the leveling agent is selected from one or a combination of at least two of acrylic leveling agents, organic silicon leveling agents and fluorocarbon leveling agents, and preferably one or two of organic silicon leveling agents; preferably, the inhibitor is selected from one or a combination of at least two of alkynol compounds, phosphorus/nitrogen-containing organic compounds and cyclic siloxane compounds, and is preferably alkynol compounds; Preferably, the catalyst is selected from one or a combination of at least two of a platinum-based catalyst and a nickel-based catalyst, preferably a platinum-based catalyst, more preferably a Kanster catalyst; preferably, the mass ratio of the inhibitor to the catalyst is (80-300): 1.
  7. 7. The method of producing a thermosetting temporary bonding adhesive according to any one of claims 1 to 6, characterized in that the method of producing comprises the steps of: (1) Adding vinyl crude rubber into an organic solvent, and stirring until the vinyl crude rubber is completely dissolved to obtain a premix; (2) Adding hydrogen-containing silicone oil into the premix liquid obtained in the step (1), and stirring and mixing to obtain a mixed liquid; (3) Adding an inhibitor into the mixed solution obtained in the step (2), and stirring and mixing to obtain a mixed solution; (4) Adding an antioxidant and a leveling agent into the mixed solution obtained in the step (3), and stirring and mixing to obtain a mixed solution; (5) And (3) adding a catalyst into the mixed solution obtained in the step (4), stirring and mixing, and then defoaming to obtain the thermosetting temporary bonding adhesive.
  8. 8. The method according to claim 7, wherein the stirring in the step (1) is performed at 25 to 40 ℃; preferably, the stirring speed in the step (1) is 100-500 r/min; preferably, the stirring time in the step (1) is 12-48 hours; preferably, the stirring and mixing in the step (2) are carried out at 25-40 ℃; preferably, the stirring and mixing in the step (2) are carried out at a stirring rate of 100-500 r/min; preferably, the stirring and mixing time in the step (2) is 30-60 min.
  9. 9. The method of claim 7, wherein the stirring and mixing in step (3) is performed at 25-40 ℃; Preferably, the stirring and mixing in the step (3) are performed at a stirring rate of 100-300 r/min; preferably, the stirring and mixing time in the step (3) is 20-60 min; preferably, the stirring and mixing of step (4) is carried out at 25-40 ℃; preferably, the stirring and mixing in the step (4) are performed at a stirring rate of 100-300 r/min; preferably, the stirring and mixing time in the step (4) is 20-60 min; preferably, the stirring and mixing of step (5) is carried out at 25-40 ℃; preferably, the stirring and mixing in the step (5) are performed at a stirring rate of 100-300 r/min; preferably, the stirring and mixing time in the step (5) is 20-60 min; preferably, the defoaming in the step (5) is performed for 10-20 min under the condition that the vacuum degree is minus 0.08 to minus 0.1 MPa.
  10. 10. Use of a thermosetting temporary bonding glue according to any of claims 1-6 in a wafer HBM process temporary bonding process.

Description

Thermosetting temporary bonding adhesive and preparation method and application thereof Technical Field The invention belongs to the technical field of semiconductor materials, and relates to thermosetting temporary bonding adhesive, and a preparation method and application thereof. Background With the rapid development of semiconductor technology, a High Bandwidth Memory (HBM) is used as a novel stacked memory, and is widely applied to the fields of high performance computing, artificial intelligence, data centers and the like by virtue of the advantages of high bandwidth and low power consumption. In the processing process of the wafer HBM, a temporary bonding process is a critical link, and the process needs to temporarily bond an ultrathin wafer to be processed on a carrier wafer so as to provide enough supporting strength and ensure the smooth proceeding of subsequent processing procedures such as cutting, grinding, bonding and the like. The temporary bonding glue is a core material of the temporary bonding process, and the performance of the temporary bonding glue directly influences the precision and the yield of wafer processing. The temporary bonding adhesive on the market has many defects, the high temperature resistance of part of the bonding adhesive is insufficient, the high temperature process above 150 ℃ in the processing process cannot be tolerated, the problems of softening, falling, air bubbles and the like are easy to occur, the wafer processing is failed, and the part of the bonding adhesive has excellent high temperature resistance, but the degumming and cleaning are difficult after the processing is finished, the residual is easy to occur on the surface of the wafer, and the subsequent packaging and using performances are affected. Therefore, developing a temporary bonding adhesive with high temperature resistance and easy cleaning performance becomes a technical problem to be solved in the wafer HBM processing field. The current thermosetting temporary bonding adhesive field has dual technical pain points that firstly, an epoxy resin system is heat-resistant but is complicated in post-treatment, repeated spin coating and cleaning are needed (the time consumption is more than or equal to 10min, the solvent consumption is large), colloidal particles are easy to remain, the cleaning agent consumption is large, and the environmental protection pressure is large, secondly, the existing silicon-based two-layer non-crosslinked temporary bonding adhesive, such as CN114096633A, is only focused on TTV improvement of wafer processing, the core contradiction between high-temperature stability and high-efficiency degumming is not overcome, key performance quantification indexes such as degumming time, solvent consumption and the like are not disclosed, and the accurate performance requirements of a high-end process on bonding materials cannot be met. In the invention CN120158266A, in an organosilicon temporary bonding material system, vinyl MQ resin, methyl MQ resin, octamethyl cyclotetrasiloxane and other reinforcing agents are specially introduced, and the components can obviously enhance the integral mechanical strength of the cured adhesive film and the bonding fastness with a wafer and a carrier interface by improving the crosslinking density of the adhesive film, but also enhance the contact resistance of the adhesive film and a cleaning agent due to the strengthening of a crosslinking structure, delay the swelling and demolding rate, and the cleaning time is 3.5-6 min, and the cleaning time is required to be 3.5-6 min, and is required to rely on ultrasonic assistance or additional photoresist removal to treat small molecule residues. Disclosure of Invention Aiming at the defects of the prior art, the invention aims to provide a thermosetting temporary bonding adhesive, and a preparation method and application thereof. The thermosetting temporary bonding adhesive of the invention realizes the performance balance of ' high temperature resistance above 150 ℃ and ' one-time no residue degumming after soaking by cleaning agent ' of a thermosetting system aiming at the short board which is difficult to clean after the existing thermosetting temporary bonding adhesive manufacturing process, and is suitable for the wafer HBM processing requirement. To achieve the purpose, the invention adopts the following technical scheme: In one aspect, the invention provides a thermosetting temporary bonding adhesive, which comprises the following components in parts by mass: 20-80 parts (e.g., 20 parts, 26 parts, 32 parts, 38 parts, 44 parts, 50 parts, 56 parts, 62 parts, 68 parts, 70 parts, 72 parts, 75 parts, 78 parts, or 80 parts, etc.) of an organic solvent, 5-35 parts (e.g., 5 parts, 9 parts, 13 parts, 17 parts, 21 parts, 25 parts, 33 parts, or 35 parts, etc.), 5-35 parts (e.g., 5 parts, 9 parts, 13 parts, 17 parts, 21 parts, 25 parts, 29 parts, 33 parts, or 35 parts, etc.), and 0.01-5 parts (e.g., 0.01 pa