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CN-122012034-A - Cooling liquid, liquid cooling module and electronic equipment

CN122012034ACN 122012034 ACN122012034 ACN 122012034ACN-122012034-A

Abstract

The application provides a cooling liquid, a liquid cooling module and electronic equipment. The cooling liquid comprises a heat exchange medium and a first surfactant which is miscible with the heat exchange medium, wherein the HLB (hydrophile-lipophile balance) of the first surfactant is more than or equal to 8, and the static surface tension of the cooling liquid is 13-30 mN/m. The cooling liquid can reduce the problem of pump blockage caused by bubbles and improve the reliability of the flow of the cooling liquid in the liquid cooling module.

Inventors

  • TIAN XIANGYU
  • WANG YINGXIAN
  • JIN LINFANG
  • CHEN HONGYU
  • ZHENG JIALONG

Assignees

  • 华为技术有限公司

Dates

Publication Date
20260512
Application Date
20250731

Claims (19)

  1. 1. The cooling liquid is characterized by comprising a heat exchange medium and a first surfactant which is miscible with the heat exchange medium, wherein the HLB (hydrophile-lipophile balance) of the first surfactant is more than or equal to 8, and the static surface tension of the cooling liquid is 13-30 mN/m.
  2. 2. The cooling liquid according to claim 1, wherein the first surfactant has a hydrophilic-lipophilic balance (HLB) of 11 or more.
  3. 3. The cooling liquid according to claim 1 or 2, characterized in that the mass ratio of the first surfactant in the cooling liquid is 2% or less.
  4. 4. A cooling fluid according to any one of claims 1-3, wherein the heat exchange medium comprises water, silicone oil or a fluorinated fluid.
  5. 5. The cooling fluid of claim 4, wherein the heat exchange medium is water and the first surfactant has a molecular formula of Rf 1 -X 1 -M 1 , wherein, Rf 1 is a perfluoroalkylene group with CF 3 -R 1 -,R 1 of C3-C15; X 1 is selected from-SO 3 -、-COO-、-(R 2 O) m -,R 2 and is alkylene of C2-C6, and the value of m is 1-30; The M 1 is selected from H, a monovalent metal cation, or a monovalent organic cation.
  6. 6. The cooling fluid of claim 5, further comprising an antifoaming agent having a surface tension of less than 25mN/m.
  7. 7. The cooling liquid according to claim 5 or 6, wherein the defoaming agent comprises a hydrophobic solvent and hydrophobic particles dispersed in the hydrophobic solvent, the mass ratio of the hydrophobic particles in the defoaming agent is 60% -90%, and/or, The hydrophobic solvent comprises at least one of fatty derivatives or polysiloxanes, and/or, The hydrophobic particles are selected from silica particles, wax particles or inorganic particles modified by hydrophobic groups.
  8. 8. The cooling liquid according to any one of claims 5 to 7, wherein the defoaming agent accounts for 1% or less of the cooling liquid by mass.
  9. 9. The cooling liquid according to any one of claims 5 to 8, further comprising a second surfactant having a hydrophile-lipophile balance (HLB) of less than 8, wherein the mass ratio of the second surfactant in the cooling liquid is 2% or less.
  10. 10. The cooling liquid according to claim 9, wherein the second surfactant comprises at least one of an alkynol surfactant, or a gemini surfactant, and/or, And the mass ratio of the second surfactant in the cooling liquid is less than or equal to 0.5 percent.
  11. 11. The cooling fluid according to any one of claims 1 to 10, wherein the static surface tension of the cooling fluid is 18 to 25mn/m.
  12. 12. The cooling fluid according to any one of claims 1 to 11, wherein the dynamic surface tension of the cooling fluid is 35mN/m or less.
  13. 13. The cooling fluid of claim 4, wherein the heat exchange medium is a fluorinated fluid, the first surfactant comprises a fluorocarbon surfactant having a formula of Rf 2 -X 2 -M 2 , Rf 2 is a perfluoroalkylene group with CF 3 -R 3 -,R 3 of C3-C15; X 2 is selected from- (R 4 O) m -,R 4 is alkylene of C2-C6, and the value of m is 1-30; And M 2 is selected from H or C1-C5 alkyl.
  14. 14. The cooling fluid of claim 13, wherein the first surfactant further comprises a fluorinated acrylate copolymer having the formula: Wherein, the Ra is H or methyl; Rb is alkylene of C1-C6, - (R 5 O) x -,R 5 is alkylene of C2-C6, and x has a value of 1-3; Rc is a C3-C12 perfluoroalkyl group.
  15. 15. The cooling liquid according to claim 13 or 14, wherein the fluorinated liquid is at least one selected from the group consisting of C1-C12 perfluoroalkanes, C1-C12 perfluoroalkenes, C1-C12 cyclic perfluoroalkenes, CF 2 -A m -B n -OCF 3 、R f -O-R h , R f -C(O)-R h , and R f -N(R h )-R g , In the CF 2 -A m -B n -OCF 3 , A is selected from-OCF 2 -、-OCF 2 CF 2 -, or-OCF (CF 3 )CF 2 -, B is selected from-OCF (CF 3 )-、-OCF 2 CF(CF 3 ) -, m and n are each independently selected from integers of 0-50, and m+n is more than or equal to 1; In the R f -O-R h , the R f and the R h are respectively and independently selected from C1-C8 linear perfluoroalkyl, C1-C8 branched perfluoroalkyl and C1-C4 hydrofluoroalkyl; In the R f -C(O)-R h , the Rf and the Rh are independently selected from C3-C8 linear perfluoroalkyl, C3-C12 branched perfluoroalkyl and C3-C12 perfluoroalkyl containing a cyclic structure; In the R f -N(R h )-R g , R f 、R h and R g are independently selected from C3-C8 linear perfluoroalkyl, C3-C12 branched perfluoroalkyl, or C3-C12 perfluoroalkyl containing a cyclic structure.
  16. 16. The cooling fluid according to any one of claims 13 to 15, wherein the static surface tension of the cooling fluid is 13 to 20mn/m.
  17. 17. The cooling fluid of claim 4, wherein the heat exchange medium is silicone oil and the first surfactant is a siloxane-based surfactant.
  18. 18. The liquid cooling module is characterized by comprising a micro pump and a heat exchange pipeline, wherein the heat exchange pipeline is communicated with the micro pump to form a closed heat exchange passage, the heat exchange pipeline is filled with the cooling liquid according to any one of claims 1-17, and the micro pump is used for driving the cooling liquid to flow in the heat exchange pipeline.
  19. 19. An electronic apparatus comprising a heat source element and the liquid cooling module according to claim 18, wherein a partial region of the liquid cooling module is in contact with the heat source element or is connected to the heat source element via a heat conductive member.

Description

Cooling liquid, liquid cooling module and electronic equipment Technical Field The application relates to the field of heat exchange, in particular to a cooling liquid, a liquid cooling module and electronic equipment. Background With the development of high integration of electronic devices, the amount of heat generated by internal heat generating elements has also increased dramatically. In order to cope with the continuous improvement of high performance demands and heat flux density of mobile terminal products, the micropump liquid cooling technology is one of the future development trends. The liquid cooling module is a key component in the micropump liquid cooling technology. Under the application scene of the extremely thin and light architecture of the whole electronic equipment, the flow channel of the liquid cooling module can be thinned, the flow resistance can be increased, the evaporation process of the cooling liquid, the film material and the residual gas of the cooling liquid can be slowly converged into large bubbles in the flow channel, when the large bubbles flow through the liquid inlet of the micropump, the large bubbles can be blocked and inhibit the cooling liquid from entering the cavity of the micropump, the phenomenon of blocking the pump and flowing stagnation is shown, further the heat dissipation performance is greatly deteriorated, and the reliability of the liquid cooling module is affected. Disclosure of Invention The application provides a cooling liquid, a liquid cooling module and electronic equipment, which are used for reducing the problem of cooling liquid clamping pump caused by bubbles of the cooling liquid and improving the reliability of cooling liquid flowing in the liquid cooling module. In a first aspect, the application provides a cooling liquid, which comprises a heat exchange medium and a first surfactant which is miscible with the heat exchange medium, wherein the HLB (hydrophile-lipophile balance) of the first surfactant is more than or equal to 8, and the static surface tension of the cooling liquid is 13-30 mN/m. Through adding the first surfactant with HLB more than or equal to 8 into the heat exchange medium, the static surface tension of the cooling liquid is in the range of 13-30 mN/m, so that gas in the heat exchange medium can be dispersed to form micro-bubbles, and the gas is prevented from converging to form large-bubbles, thereby reducing the problem of pump blockage of the micro-pump caused by the blockage of the large-bubbles, improving the flowing fluency of the cooling liquid, and avoiding the reduction of the heat dissipation reliability of the liquid cooling module. In one implementation, the first surfactant has a hydrophile-lipophile balance (HLB) of 11 or greater. The gas dispersion in the cooling liquid can be further adjusted by optimizing the HLB value of the first surfactant, so that the dispersibility of the bubbles is higher to form smaller microbubbles. In one implementation, the mass ratio of the first surfactant in the cooling liquid is less than or equal to 2%. By adjusting the mass ratio of the first surfactant, the heat dissipation efficiency of the cooling liquid can be prevented from being influenced by the excessive content of the first surfactant. In one implementation, the heat exchange medium comprises water, silicone oil, or a fluorinated liquid. In one implementation, the heat exchange medium is water, the first surfactant has a molecular formula of Rf 1-X1-M1, wherein, Rf 1 is a perfluoroalkylene group of which CF 3-R1-,R1 is C3-C15; X 1 is selected from-SO 3-、-COO-、-(R2O)m-,R2 and is alkylene of C2-C6, and the value of m is 1-30; M 1 is selected from H, a monovalent metal cation, or a monovalent organic cation. When the heat exchange medium is water and the first surfactant is Rf 1-X1-M1, the static surface tension of the cooling liquid can be effectively reduced, so that the dispersion of bubbles can be realized. In one implementation, in Rf 1, the C3 to C15 perfluoroalkylene group may be a linear perfluoroalkylene group, a branched perfluoroalkylene group, or a cyclic perfluoroalkylene group. In one implementation, M 1 is H. When X 1 is-SO 3 -, H may be present in the form of H +, such as-SO 3 H which may be formed with X 1. When X 1 is-COO-, or- (R 2O)m -, H can combine with adjacent O to form hydroxy-OH. In one implementation, M 1 is a monovalent metal cation, such as Na +、K+, or NH 4+.M1 is a monovalent organic cation, and can be an organic amine cation. In one implementation, the cooling fluid further includes an antifoaming agent having a surface tension of less than equal to 25mN/m. By adding the defoaming agent, large bubbles accumulated in the cooling liquid can be further eliminated. In one implementation, the defoamer comprises a hydrophobic solvent and hydrophobic particles dispersed in the hydrophobic solvent, wherein the mass ratio of the hydrophobic particles in the defoamer is 60-90%. The defoamer ca