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CN-122012168-A - Water-soluble scribing liquid for cutting wafer blade and preparation method thereof

CN122012168ACN 122012168 ACN122012168 ACN 122012168ACN-122012168-A

Abstract

The invention provides a water-soluble scribing liquid for cutting a wafer blade and a preparation method thereof, which can effectively reduce the interfacial tension of the blade and the wafer and reduce the scratch and damage of the blade and the wafer surface by introducing the synergic action of an ionic liquid, an anionic surfactant and a Gemini cationic surfactant, and the polar groups can adsorb fragments through electrostatic action and perform coalescence and removal through the micelle compatibilization of the surfactant, so that the adsorption of the fragments on the blade and the wafer surface is prevented, and the rust of the blade and the wafer in the processing process is prevented.

Inventors

  • WEN KEXIONG
  • WEN YUXIN
  • WEN YULIAN

Assignees

  • 广州双科新材料有限公司

Dates

Publication Date
20260512
Application Date
20251225

Claims (9)

  1. 1. The water-soluble scribing liquid for cutting the wafer blade comprises 1-6% of anionic surfactant, 1-3% of Gemini cationic surfactant, 0.5-2% of ionic liquid, 0.5-3% of polyethylene glycol and the balance of deionized water, wherein the Gemini cationic surfactant is hyperbranched Gemini cationic surfactant.
  2. 2. The water-soluble dicing liquid for wafer blade dicing of claim 1, wherein the hyperbranched Gemini cationic surfactant comprises one or more of a symmetrical alkyl hyperbranched Gemini cationic surfactant, an asymmetrical hyperbranched Gemini cationic surfactant.
  3. 3. The water-soluble dicing liquid for wafer blade dicing of claim 1, wherein the hyperbranched Gemini cationic surfactant comprises one or more of C12-18 dialkyltrimethylammonium chloride, C12-18 dialkylimidazolinium chloride, C12-18 dialkylpyridinium chloride.
  4. 4. The water-soluble dicing liquid for wafer blade dicing of claim 1, wherein the hyperbranched Gemini cationic surfactant is a propylene [ (dodecyl polyoxyethylene/octadecyl polyoxyethylene) chloride/ammonium bromide ].
  5. 5. The water-soluble dicing liquid for wafer blade dicing of claim 1, wherein the ionic liquid is one or more of 1-butyl-3-methylimidazolium bis (trifluoromethylsulfonyl) imide, 1-ethyl-3-methylimidazolium ethyl sulfate, 1-hexyl-3-methylimidazolium hexafluorophosphate, 1-butyl-3-methylpyridinium bis (trifluoromethylsulfonyl) imide, 1-ethyl-3-methylimidazolium bis trifluoromethylsulfonyl imide salt, 1-octyl-3-methylimidazolium bis trifluoromethylsulfonyl imide salt.
  6. 6. The water-soluble dicing liquid for wafer blade dicing of claim 1, wherein the ionic liquid is one or both of 1-octyl-3-methylimidazolium bistrifluoromethylsulfonylimide salt and 1-hexyl-3-methylimidazolium hexafluorophosphate.
  7. 7. The water-soluble dicing fluid for wafer blade cutting of claim 1, wherein the anionic surfactant comprises one or more of a C12-18 alkyl sulfate, a C12-18 alkylbenzene sulfonate, a C12-18 alkyl sulfosuccinate, a C12-18 alkyl carboxylate, a C12-18 alkyl sulfonate.
  8. 8. The water-soluble dicing fluid for wafer blade dicing of claim 1, wherein the anionic surfactant comprises one or more of sodium dodecyl sulfate, sodium dodecyl benzene sulfonate, sodium dioctyl sulfosuccinate, sodium stearate.
  9. 9. A method of preparing the water-soluble dicing liquid for dicing a wafer blade according to any one of claims 1 to 8, comprising the reaction steps of: step one, weighing the components according to the mass ratio; step two, mixing a Gemini cationic surfactant, an anionic surfactant, an ionic liquid and deionized water, heating to 30-45 ℃, and stirring for 10-30 minutes; And thirdly, adding polyethylene glycol PEG4000 into the aqueous solution in the second step, and continuously stirring for 10-30 minutes to obtain the water-soluble scribing liquid.

Description

Water-soluble scribing liquid for cutting wafer blade and preparation method thereof Technical Field The invention belongs to the technical field of wafer processing, and particularly relates to a water-soluble scribing liquid for wafer blade cutting and a preparation method thereof. Background In the wafer processing process, the blade and the wafer are subjected to strong friction, static electricity, vibration and a large amount of heat and fragments are generated, edge breakage, unfilled corner, blade abrasion, chipping, adhesion and corrosion rust are easy to cause, therefore, the dicing liquid is generally required to be added in the wafer adding processing process, multiple functions of cooling, lubrication, cleaning, rust prevention and shock absorption are exerted, the high efficiency and high quality of the processing process are ensured to absorb and radiate heat to prevent the wafer from being damaged due to overheating, meanwhile, the friction between the cutting tool and the wafer is reduced, the service life of the cutting tool is prolonged, the scratches and the damages on the surface of the wafer are reduced, the fragments and dust generated in the cutting process are removed, the cleanness of a cutting area is kept, the fragments are prevented from affecting the cutting precision and quality, the vibration in the cutting process is absorbed, the cutting stability and the cutting precision are improved, and the cutting and the rust of the cutting tool and the wafer are prevented in the processing process are prevented. The existing scribing liquid generally takes water as a solution, and various functional auxiliary agents are added into the water-soluble liquid to improve the effect of the scribing liquid. For example, CN 107142145A is a scribing liquid composed of 1% -3% of surfactant, 0.5% -1.5% of extreme pressure agent, 4% -6% of lubricant and the balance of deionized water, wherein the surfactant is phosphate surfactant, sodium dodecyl benzene sulfonate or coconut oil fatty acid diethanolamide, the extreme pressure agent is octyl phenol polyoxyethylene ether, the lubricant is polyethylene glycol 400, the effects of wetting and edge breakage prevention are improved while good lubricating effect is achieved by adding the surfactant, and broken pieces can be better prevented by adding the extreme pressure agent, so that the yield of a cutting process is effectively increased. CN 103113972A is a scribing liquid composed of 2% -7% of polyethylene glycol with molecular weight between 2000-20000 and polyvinyl alcohol or a mixture of two polymers with different molecular weights, 0.001% -0.5% of polysilicone ether surfactant or phosphate surfactant and 0.01% -0.5% of quinoline or thiazole surfactant, wherein the lipophilic group of the polysilicone ether surfactant or the phosphate surfactant at least contains 2 branched chains, and the scribing liquid can reduce scraps and pollution generated in the cutting process and simultaneously slow down the corrosion of a bonding pad in the cutting process. However, silicone or phosphate surfactants are extremely foaming and foam-rich, and excessive foam tends to inhibit the adsorption of the surfactant on the blade and its contact surface with the wafer and the effect of lowering the interfacial tension, and for this reason, it is generally necessary to add an antifoaming agent, however, the addition of an antifoaming agent tends to cause a decrease in the stability of the dicing liquid and even precipitation delamination. Disclosure of Invention In order to overcome the problems in the prior art, the invention aims to provide the water-soluble scribing liquid for cutting the wafer blade and the preparation method thereof, which can effectively reduce the interfacial tension of the blade and the wafer and reduce the scratch and damage of the blade and the wafer surface by introducing the synergistic effect of the ionic liquid, the anionic surfactant and the Gemini cationic surfactant, and the polar groups can adsorb fragments through electrostatic effect and perform coalescence and removal through the micelle compatibilization effect of the surfactant so as to prevent the fragments from being adsorbed on the blade and the wafer surface and prevent the blade and the wafer from rusting in the processing process. The aim of the invention is realized by the following technical scheme: A water-soluble dicing liquid for cutting wafer blades comprises 1-6% of anionic surfactant, 1-3% of Gemini cationic surfactant, 0.5-2% of ionic liquid, 0.5-3% of polyethylene glycol and the balance of deionized water. Preferably, the Gemini cationic surfactant is a hyperbranched Gemini cationic surfactant. Preferably, the hyperbranched Gemini cationic surfactant comprises one or more of symmetrical alkyl hyperbranched Gemini cationic surfactant and asymmetrical hyperbranched Gemini cationic surfactant. Preferably, the hyperbranched Gemini cationic surfactant comprises one