CN-122013008-A - High-Ti mirror-surface aluminum plate and preparation method thereof
Abstract
The high Ti mirror aluminum plate comprises, by mass, 0.01% of Mg, 0.05-0.1% of Fe, 0.05-0.1% of Cu, 0.05% of Si, 0.02-0.05% of Ti, less than or equal to 0.04% of impurity elements, and the balance of Al, wherein an aluminum alloy ingot is obtained by smelting and semi-continuous casting, and then subjected to homogenization heat treatment, hot rolling, cold rolling and mirror rolling in sequence, so that the aluminum plate is obtained, and the aluminum alloy ingot is subjected to heat preservation for 4-8 hours at 580-610 ℃ for homogenization heat treatment. The invention reduces the white line rate of the aluminum plate and improves the yield of the aluminum plate.
Inventors
- GUI XINGHUI
- GAO CHONG
- YANG SHUYU
- LIN SHIPENG
- ZHANG JUN
- WU GUANGQI
- MA KE
- XU WEIKUN
Assignees
- 中铝河南洛阳铝加工有限公司
- 中铝材料应用研究院有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20260210
Claims (10)
- 1. The high Ti mirror aluminum plate is characterized by comprising, by mass, 0.01% of Mg, 0.05-0.1% of Fe, 0.05-0.1% of Cu, 0.05% of Si, 0.02-0.05% of Ti, less than or equal to 0.04% of impurity elements and the balance of Al.
- 2. A high Ti mirror aluminum plate is characterized by comprising the following components of 0.001% of Mg, 0.07% of Fe, 0.07% of Cu, 0.004% of Si, 0.03% of Ti, less than or equal to 0.04% of impurity elements and the balance of Al.
- 3. A preparation method of a high Ti mirror-surface aluminum plate is characterized in that an aluminum alloy cast ingot is obtained by smelting and semi-continuous casting, and then subjected to homogenization heat treatment, a hot rolling process, a cold rolling process and mirror rolling in sequence to obtain the aluminum plate, wherein the components in the aluminum alloy cast ingot are the same as those of the aluminum plate in claim 1, and the aluminum alloy cast ingot is subjected to homogenization heat treatment at 580-610 ℃ for 4-8 hours.
- 4. A method for producing a high Ti specular aluminum plate as defined in claim 3, wherein in the hot rolling step, the initial rolling temperature of the hot rolling is 460 to 520℃and the final rolling temperature is 220 to 250 ℃.
- 5. A method for producing a high Ti specular aluminum plate as defined in claim 3, wherein the thickness of the hot rolled plate in the hot rolling step is 3 to 5mm.
- 6. The method for producing a high Ti mirror-finished aluminum plate as claimed in claim 3, wherein the rolling pass is 13 to 17 in the hot rolling step.
- 7. The method for producing a high Ti mirror-surface aluminum plate as defined in claim 3, wherein in the cold rolling step, the rolling pass is 5 to 8, and the total cold rolling deformation is 60 to 80%.
- 8. The method for preparing a high Ti mirror-surface aluminum plate as claimed in claim 3, wherein in mirror-surface rolling, the rolling passes are 3-5 passes, and the deformation amount of each pass is less than or equal to 10%.
- 9. The method of manufacturing a high Ti mirror-finished aluminum plate according to claim 3, wherein the aluminum plate is anodized after mirror-rolling.
- 10. The method for preparing the high-Ti specular aluminum plate according to claim 9, wherein in the anodic oxidation process, an oxide film with a thickness of 3-5 μm is formed on the surface of the aluminum plate by using 180-220 g/L of H 2 SO 4 solution.
Description
High-Ti mirror-surface aluminum plate and preparation method thereof Technical Field The invention relates to the technical field of aluminum alloy processing, in particular to a high-Ti mirror aluminum plate and a preparation method thereof. Background With the gradual increase of the requirements of consumers on the aesthetic degree of product packaging, the mirror aluminum has increasingly wide application in product packaging due to the excellent surface gloss and metal texture. The cosmetic packaging has extremely high requirements on the surface aesthetic degree, the glossiness is required to be more than 650GU, white lines and material lines cannot exist on the surface, meanwhile, in order to reduce the production cost, the working procedure of mechanical polishing is reduced, and pit defects cannot exist on the surface of mirror aluminum. In the prior art, after the mirror aluminum is subjected to hot rolling and intermediate annealing treatment, the surface hardness is reduced due to high-temperature softening, and the phenomenon of sticking aluminum by a roller is easy to occur in the subsequent cold rolling stage, so that tiny pits are easy to form on the surface of an aluminum plate, are difficult to thoroughly eliminate in the subsequent processing and are finally transmitted to the surface of a finished product, and meanwhile, the impurities in an ingot are too high, the risk of adding white lines is increased, and the yield is lower. Disclosure of Invention In order to solve the problem of higher white line rate in aluminum plates in the prior art, the invention provides the high-Ti mirror-surface aluminum plate and the preparation method thereof, which reduce the white line rate of the aluminum plate and improve the yield of the aluminum plate. In order to achieve the aim, the high-Ti mirror-surface aluminum plate comprises, by mass, less than or equal to 0.01% of Mg, 0.05-0.1% of Fe, 0.05-0.1% of Cu, less than or equal to 0.05% of Si, 0.02-0.05% of Ti, less than or equal to 0.04% of impurity elements and the balance of Al. As an optimization scheme of the high-Ti mirror-surface aluminum plate, the high-Ti mirror-surface aluminum plate comprises 0.001% of Mg, 0.07% of Fe, 0.07% of Cu, 0.004% of Si, 0.03% of Ti, less than or equal to 0.04% of impurity elements and the balance of Al. A preparation method of a high Ti mirror-surface aluminum plate comprises the steps of firstly adopting smelting and semicontinuous casting to obtain an aluminum alloy cast ingot, then sequentially carrying out homogenization heat treatment, hot rolling procedure, cold rolling procedure and mirror rolling on the aluminum alloy cast ingot to obtain an aluminum plate, wherein the components in the aluminum alloy cast ingot are the same as those of the aluminum plate, and the aluminum alloy cast ingot is subjected to homogenization heat treatment at 580-610 ℃ for 4-8 hours. As an optimization scheme of the preparation method of the high Ti mirror-surface aluminum plate, in the hot rolling process, the initial rolling temperature of hot rolling is 460-520 ℃ and the final rolling temperature is 220-250 ℃. As another optimization scheme of the preparation method of the high Ti mirror-surface aluminum plate, the thickness of the hot rolled plate is 3-5mm in the hot rolling process. As another optimization scheme of the preparation method of the high-Ti mirror-surface aluminum plate, in the hot rolling process, the rolling pass is 13-17. As another optimization scheme of the preparation method of the high-Ti mirror-surface aluminum plate, in the cold rolling process, the rolling pass is 5-8, and the total cold rolling deformation is 60-80%. As another optimization scheme of the preparation method of the high Ti mirror-surface aluminum plate, in mirror-surface rolling, the rolling pass is 3-5 passes, and the deformation of each pass is less than or equal to 10%. As another optimization scheme of the preparation method of the high Ti mirror aluminum plate, the aluminum plate is anodized after mirror rolling. As another optimization scheme of the preparation method of the high-Ti mirror-surface aluminum plate, 180-220 g/L of H 2SO4 solution is adopted in the anodic oxidation process, and an oxide film with the film thickness of 3-5 microns is generated on the surface of the aluminum plate. Compared with the prior art, the invention has the following beneficial effects: The invention provides a high Ti mirror aluminum plate and a preparation method thereof, wherein in the homogenization treatment process of an aluminum alloy cast ingot, fe phase is fully dissolved, large-size second phase aggregation generated in the semi-continuous casting process is reduced, heat preservation is carried out for 4-8 hours at 580-610 ℃ to fully dissolve and disperse the second phase, the large-size second phase is prevented from being broken and inherited to a product, white lines are prevented from being formed after anodic oxidation, and th