CN-122013095-A - Copper alloy gradient carburized layer and preparation method and application thereof

CN122013095ACN 122013095 ACN122013095 ACN 122013095ACN-122013095-A

Abstract

The invention discloses a copper alloy gradient carburized layer and a preparation method and application thereof, wherein the preparation method comprises the following steps: active elements are added into copper and copper alloy by adopting a vacuum induction melting or powder metallurgy process to generate or compound the copper alloy in situ to form high-melting-point metal, and the copper alloy of the high-melting-point metal is subjected to carburizing treatment to form an anti-bonding and high-wear-resistance gradient carburization layer on the surface of the copper alloy. According to the method, active elements are introduced into copper and copper alloy, high-purity acetylene gas is used as a carbon source, and under the action of high temperature, carbon reacts with the active elements on the surface of the alloy, so that the active elements in the copper alloy continuously migrate to the surface, and a surface gradient carburization layer with active element content gradient and hardness gradient is formed, so that the problem that carburization layer is difficult to form due to non-reaction of copper and carbon is avoided, subsequent carburization treatment is carried out, the preparation process is simple and controllable, the operation is convenient, the cost is low, and the method also has operability on practical workpieces with complex shapes, and therefore the practicability is high.

Inventors

CHEN ZHENG
ZHOU XIWEN
ZHONG RONG
DAI WENGUANG
SU LIJI
WANG YUWEN
WANG LIN
FAN YU

Assignees

中国矿业大学
厦门宏发电力电器有限公司

Dates

Publication Date: 20260512
Application Date: 20260209

Claims (10)

1. The preparation method of the copper alloy gradient carburized layer is characterized by comprising the following steps of: Active elements are added into copper and copper alloy by adopting a vacuum induction melting or powder metallurgy process to generate or compound the copper alloy in situ to form high-melting-point metal, and the copper alloy of the high-melting-point metal is subjected to carburizing treatment to form an anti-bonding and high-wear-resistance gradient carburization layer on the surface of the copper alloy.
2. The method for preparing a copper alloy gradient carburized layer according to claim 1, wherein, Adding active elements into copper and copper alloy to generate or compound in situ to form copper alloy of high melting point metal, which comprises the following steps: s10, polishing the copper alloy of the high-melting-point metal to remove oxides on the surface, cleaning, drying by cold air, and then drying; And S20, mixing the active elements in a gold intermediate alloy mode according to mass percentage, putting the mixture into a vacuum induction furnace for heating and smelting, taking out a sample after all raw materials are melted and rapidly cooling to obtain the copper alloy of the high-melting-point metal, or mixing the active elements in a powder mode according to mass percentage, performing ball milling treatment, and putting the mixture into a vacuum sintering furnace for rapid sintering after uniform powder mixing to obtain the copper alloy of the high-melting-point metal.
3. The method for preparing a copper alloy gradient carburized layer according to claim 2, wherein, In the step S10, the surface oxide of the alloy is removed by polishing with 80-1500 # SiC sand paper, the alloy is cleaned in alcohol for 10-15 min by ultrasonic waves, and then the alloy is dried by cold air, and then the alloy is dried in a drying box.
4. The method for preparing a copper alloy gradient carburized layer according to claim 1, wherein, Carburizing the copper alloy of the high-melting-point metal, which specifically comprises the following steps: W10, removing an oxide layer of the copper alloy of the high-melting-point metal, cleaning, drying by cold air, and then drying; W20, placing the copper alloy into a high-temperature carburizing furnace, heating to a stable temperature after adjusting the flow of the carbon source gas, and carrying out heat preservation treatment to obtain the copper alloy surface carburized layer.
5. The method for preparing a copper alloy gradient carburized layer according to claim 4, wherein, In the step W10, the copper alloy of the high-melting-point metal is polished to remove an oxide layer, ultrasonically cleaned in alcohol for 10-15 min, dried by cold air, and then dried in a drying oven.
6. The method for preparing a copper alloy gradient carburized layer according to claim 4, wherein, In the step W20, the copper alloy sample is placed in a high-temperature carburizing furnace, high-purity acetylene gas is used as a carbon source, the flow rate of the high-purity acetylene gas is adjusted to be 30-200 ml/min, then the high-purity acetylene gas is heated to 800-820 ℃, and the temperature is kept for 8-10 hours, so that a copper alloy surface carburized layer is formed.
7. The method for preparing a copper alloy gradient carburized layer according to claim 1, wherein, The active elements include chromium, titanium and tungsten.
8. A copper alloy gradient carburized layer prepared by the method of any one of claims 1 to 7.
9. An electrical contact comprising a conductive material comprising the copper alloy gradient carburized layer of claim 8.
10. An electrical switching element comprising an electrical contact according to claim 9.

Description

Copper alloy gradient carburized layer and preparation method and application thereof Technical Field The invention relates to the technical field of copper alloy, in particular to a copper alloy gradient carburized layer and a preparation method and application thereof. Background The electric contact is a part for carrying out switching on, breaking and continuous current carrying on a circuit by mechanical action in a gold-opening electric appliance, is widely applied to switching elements such as a breaker, a relay, a contactor and the like in various electric systems, and in order to achieve good switching-on and switching-off effects, materials for manufacturing the electric contact generally need to meet the following requirements of ⑴, namely good electric conduction and heat conduction, low contact resistance, good mechanical abrasion resistance and arc corrosion resistance, and good fusion welding resistance. The electric contact materials widely used at present mainly comprise Ag-based materials and Cu-based materials. In order to reduce the cost, there is a current trend to replace Ag-based contacts with Cu-based contacts. In practical application, the shortcomings of serious adhesive wear and poor anti-adhesion of the copper alloy contact under the action of high temperature are overcome, so that a copper alloy gradient carburized layer capable of preparing an electrical contact with good anti-adhesion, abrasion resistance and low cost is needed, and a preparation method and application thereof are needed. Disclosure of Invention Aiming at the problems and the requirements set forth above, the scheme provides the copper alloy gradient carburized layer, the preparation method and the application thereof, and the technical aims can be achieved and other technical effects are brought about due to the following technical characteristics. The invention aims at providing a preparation method of a copper alloy gradient carburized layer, which comprises the following steps: Active elements are added into copper and copper alloy by adopting a vacuum induction melting or powder metallurgy process to generate or compound the copper alloy in situ to form high-melting-point metal, and the copper alloy of the high-melting-point metal is subjected to carburizing treatment to form an anti-bonding and high-wear-resistance gradient carburization layer on the surface of the copper alloy. In addition, the copper alloy gradient carburization layer, the preparation method and the application thereof can also have the following technical characteristics: In one example of the present invention, copper alloys in which active elements are added to copper and copper alloys to form or complex in situ high melting point metals include the following: s10, polishing the copper alloy of the high-melting-point metal to remove oxides on the surface, cleaning, drying by cold air, and then drying; And S20, mixing the active elements in a gold intermediate alloy mode according to mass percentage, putting the mixture into a vacuum induction furnace for heating and smelting, taking out a sample after all raw materials are melted and rapidly cooling to obtain the copper alloy of the high-melting-point metal, or mixing the active elements in a powder mode according to mass percentage, performing ball milling treatment, and putting the mixture into a vacuum sintering furnace for rapid sintering after uniform powder mixing to obtain the copper alloy of the high-melting-point metal. In one example of the invention, in step S10, the alloy surface is polished with 80-1500 # sic sandpaper to remove surface oxides, ultrasonically cleaned in alcohol for 10-15 min, then dried with cold air, and then dried in a drying oven. In one example of the present invention, carburizing the copper alloy of the high melting point metal, specifically includes the steps of: W10, removing an oxide layer of the copper alloy of the high-melting-point metal, cleaning, drying by cold air, and then drying; W20, placing the copper alloy into a high-temperature carburizing furnace, heating to a stable temperature after adjusting the flow of the carbon source gas, and carrying out heat preservation treatment to obtain the copper alloy surface carburized layer. In one example of the invention, in step W10, the copper alloy of the high melting point metal is polished to remove the oxide layer, ultrasonically cleaned in alcohol for 10-15 min, then dried by cold air, and then dried in a drying oven. In one example of the invention, in step W20, the copper alloy sample is placed in a high-temperature carburizing furnace, high-purity acetylene gas is used as a carbon source, the flow rate of the high-purity acetylene gas is regulated to be 30-200 ml/min, then the high-purity acetylene gas is heated to 800-820 ℃, and after heat preservation is carried out for 8-10 hours, a copper alloy surface carburization layer is formed. In one example of the present invention, the acti