CN-122013143-A - Handling device of double-deck reaction tube
Abstract
The invention discloses a loading and unloading device for a double-layer reaction tube, which comprises a lifting mechanism, a positioning base and a positioning base, wherein the lifting mechanism is connected with the positioning base through a sealing door base so as to drive the positioning base to lift, the positioning base is used for limiting the circumferential freedom degrees of an outer tube mounting structure and an inner tube mounting structure which are arranged on the positioning base respectively, the outer layer reaction tube is arranged on the outer tube mounting structure for mounting, the inner tube reaction tube is arranged on the inner tube mounting structure for mounting, the inner tube mounting structure comprises a circumferential adjusting part and an axial indicating part, the inner tube reaction tube is rotated to a target mounting angle through the circumferential adjusting part, and the inner tube reaction tube is confirmed to extend into the target mounting depth through the axial indicating part. The invention can promote the accuracy and the uniqueness of the positioning of the double-layer reaction tube in the installation process, ensure the repeatability of the installation process, and simultaneously can visually represent the installation position information of the inner-layer reaction tube in the furnace body, thereby further ensuring the safety and the reliability of the inner-layer reaction tube installation process.
Inventors
- LIU QIANG
- YANG PING
- HU HAIMING
Assignees
- 上海稷以科技有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20260304
Claims (10)
- 1. A handling apparatus for a double-layered reaction tube, comprising: the lifting mechanism is connected with the positioning base through the sealing door base so as to drive the positioning base to lift; A positioning base for limiting the circumferential degrees of freedom of an outer tube mounting structure and an inner tube mounting structure provided thereon, respectively, wherein an outer reaction tube is disposed on the outer tube mounting structure for mounting, an inner reaction tube is disposed on the inner tube mounting structure for mounting, wherein, The inner tube mounting structure includes a circumferential adjustment portion through which the inner layer reaction tube is rotated to a target mounting angle, and an axial indication portion through which the inner layer reaction tube is confirmed to extend to a target mounting depth.
- 2. The handling device of claim 1, wherein the circumferential adjustment portion includes a rotating support and a self-lubricating friction ring, the self-lubricating friction ring being fixed to the positioning base, the rotating support being rotated circumferentially via the self-lubricating friction ring to rotate the inner layer reaction tube disposed thereon to the target installation angle.
- 3. The handling device as set forth in claim 2, wherein the circumferential adjustment portion further comprises an inner tube support ring having a bottom provided with a dowel hole and an upper end on which the inner layer reaction tube is placed, The rotary support is internally provided with a telescopic pin shaft, the telescopic pin shaft is positioned below the inner tube support ring and comprises a positioning pin and a first spring positioned at the bottom of the positioning pin, wherein the positioning pin is pressed down by the inner tube support ring to enable the first spring to be in a compressed state when the rotary support does not rotate to the positioning pin hole, and is in an ejecting state when the rotary support rotates to the positioning pin hole, so that the positioning pin is inserted into the positioning pin hole, and the inner tube support ring and the rotary support are relatively fixed and follow-up.
- 4. The handling device of claim 3, wherein the circumferential adjustment portion further comprises a guide ring disposed concentrically with the swivel mount and disposed on an outer periphery of the inner tube support ring for radially restricting a placement position of the inner reaction tube.
- 5. The handling device of claim 1, wherein the axial indicator comprises a guide shaft and a slider, the slider being secured to the positioning base, and wherein a first end of the guide shaft is telescopically inserted into the slider via a second spring and a second end of the guide shaft is telescopically secured to the positioning base to confirm that the inner reaction tube is extended to the target installation depth via a length of the guide shaft extending out of the positioning base.
- 6. The handling device of claim 5, wherein said outer tube mounting structure comprises a support flange over which said outer reaction tube is placed, The length of the guide shaft in a free state is the same as the thickness of the inner ring step of the support flange, so that the extending degree of the inner layer reaction tube is determined through the extending length of the guide shaft in the installation process of the inner layer reaction tube.
- 7. The handling device of claim 6, wherein the outer tube mounting structure includes a flange support seat such that an inner ring step of the support flange is supported on an upper end surface of the flange support seat, The upper surface of positioning base is equipped with the conical surface ring structure, the bottom of flange supporting seat or the bottom of circumference adjustment portion is located in the conical surface ring structure, through with the annular conical surface cooperation that the conical surface ring structure formed, in order to restrict outer tube mounting structure or the circumference degree of freedom of inner tube mounting structure.
- 8. The handling device of claim 7, wherein the support flange is in clearance fit with the flange support seat and secured thereto by a dowel pin to limit circumferential freedom of the support flange on the flange support seat, wherein a first cushion is disposed in the clearance.
- 9. The handling device of claim 1, further comprising a frame including an outer tube mounting area thereon, wherein the outer tube reactor tube disposed on the outer tube mounting structure is locked and secured to the frame by a fixing stud after being raised to the outer tube mounting area via the lifting mechanism to complete outer tube mounting, and wherein outer tube removal is completed by releasing the fixing stud to allow the outer tube reactor tube to descend in synchronization with the outer tube mounting structure.
- 10. The handling device of claim 9, further comprising a base provided with an inner tube installation area, wherein the base includes a first limit and a second limit, and after the outer tube is installed, the inner tube is rotated to the first limit by the inner tube disposed on the inner tube installation structure via the circumferential adjustment portion, is extended into the outer tube from bottom to top by the elevating mechanism, and is confirmed to extend to a target installation depth by the axial indication portion, and the inner tube is installed, and is rotated to the second limit by the circumferential adjustment portion, so that the inner tube is lowered in synchronization with the inner tube installation structure, and the inner tube is removed.
Description
Handling device of double-deck reaction tube Technical Field The invention relates to the technical field of semiconductor equipment, in particular to a loading and unloading device for a double-layer reaction tube. Background The film deposition equipment of the semiconductor is one of important process treatment equipment in the chip manufacturing process, and is widely applied to low-pressure chemical vapor deposition, normal-pressure chemical deposition, atomic layer deposition and other process equipment for growing dielectric films of various chips and the like. Quartz reaction chambers are an important component of thin film deposition equipment. In the process, the quartz reaction tube provides a closed chamber for film deposition reaction, and the reaction gas enters the reaction tube to deposit films on wafers and film materials on the inner wall of the reaction tube. With the increase of the process times, the film on the inner wall of the reaction tube is thicker and thicker, and the film is opaque, which seriously affects the heat radiation effect between the wafer and the heat source on the outer side of the reaction tube. Meanwhile, as the thickness of the film layer on the inner wall of the reaction tube increases, the stress between the film layers is gradually reduced, and the film layer can fall off from the inner wall of the reaction tube, so that the index of dust particles on the surface of the wafer exceeds the standard. In order to make the thin film deposition equipment of the semiconductor continuously and efficiently work stably, the equipment needs to be regularly maintained, particularly a quartz reaction tube which is a core component of the equipment, and the equipment needs to be regularly replaced and cleaned so as to improve the quality of the thin film on the surface of the wafer. Moreover, since the film deposition needs to be performed in a sealed environment, the application of the sealing ring is not required, and the sealing ring is in contact with the chemical reaction gas in the reaction tube for a long time to cause the hardness to be increased, so that the elastic failure is possible to cause the leakage of the reaction tube, so that the quality of the wafer film layer is completely failed, which is not allowed to happen, so that the periodic replacement of the sealing component is also necessary. In this regard, in the prior art, in order to meet the requirements of the film deposition process of the higher process, the reaction chamber is generally designed as a double-layer reaction tube structure. Because each large semiconductor factory has strict requirements on the occupied area of production equipment, each equipment provider ensures the high compactness of the equipment as much as possible, and the furnace tube coating equipment is more so, the space available for operation, installation and maintenance is limited. However, the quartz reaction tube itself is large in size and fragile, and therefore if the positioning of the double-layer reaction tube is inaccurate during the installation process, the reaction tube is liable to collide and break. In addition, in the installation process of the inner-layer reaction tube, an external worker cannot accurately obtain the position information of the inner-layer reaction tube in the furnace body, so that the damage risk in the installation process of the reaction tube can be further increased, and the later maintenance work is more challenged. In order to solve the above-mentioned problem existing in the prior art, there is a need in the art for a handling technology of a double-layer reaction tube, which can promote the accuracy and uniqueness of positioning of the double-layer reaction tube in the installation process, ensure the repeatability of the installation process, and simultaneously can visually represent the installation position information of the inner-layer reaction tube inside the furnace body, thereby further ensuring the safety and reliability of the inner-layer reaction tube installation process, greatly improving the production efficiency and reducing the equipment cost. Disclosure of Invention The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later. In order to overcome the defects in the prior art, the invention provides the loading and unloading device for the double-layer reaction tube, which can improve the positioning accuracy and uniqueness of the double-layer reaction tube in the installation process, ensure the repeatability of the installation process, and simultaneous