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CN-122013152-A - Gas distribution assembly for semiconductor film processing equipment and semiconductor film processing equipment

CN122013152ACN 122013152 ACN122013152 ACN 122013152ACN-122013152-A

Abstract

The application provides a gas distribution assembly for a semiconductor film treatment device and the semiconductor film treatment device, wherein the gas distribution assembly comprises a partition piece, the partition piece comprises a central part and a plurality of branch parts connected to the central part and distributed at intervals, branch gas paths are arranged in the branch parts, each branch gas path comprises at least one branch gas inlet positioned at the gas inlet side of the branch part and a plurality of branch gas outlets positioned at the gas outlet side of the branch part, the gas outlet side of the branch part comprises a plurality of strip-shaped bulges, the strip-shaped bulges are distributed at intervals in the circumferential direction of the partition piece, and the plurality of branch gas outlets are arranged on the plurality of strip-shaped bulges so as to obtain gas curtains distributed in sequence in high-low pressure areas between adjacent reaction areas, thereby enhancing the separation effect between reaction gas and metal source gas and ensuring the uniformity of film deposition and the film quality.

Inventors

  • HENG DEZHENG
  • ZHI SHUNHUA
  • XU KANG
  • RUAN HAO
  • WANG GUOCHAO

Assignees

  • 江苏微导纳米科技股份有限公司

Dates

Publication Date
20260512
Application Date
20260213

Claims (10)

  1. 1. A gas distribution assembly for a semiconductor thin film processing apparatus, comprising: A partitioning member (31), the partitioning member (31) including a central portion (311) and a plurality of branch portions (312) connected to the central portion (311) and distributed at intervals; The branch part (312) is provided with a branch gas path, and the branch gas path comprises at least one branch gas inlet (3121) positioned on the gas inlet side of the branch part (312) and a plurality of branch gas outlets (3122) positioned on the gas outlet side of the branch part (312); The air outlet side of the branch part (312) comprises a plurality of strip-shaped bulges (3123), the strip-shaped bulges (3123) are distributed at intervals in the circumferential direction of the separating piece (31), and the plurality of branch air outlets (3122) are arranged on the plurality of strip-shaped bulges (3123).
  2. 2. A gas distribution assembly according to claim 1, characterized in that the branch gas inlet (3121) is located at an end of the gas inlet side of the branch portion (312) near the central portion (311).
  3. 3. A gas distribution assembly according to claim 1, wherein the branch gas circuit comprises a separate gas buffer chamber (3124) arranged within the branch portion (312), the branch gas inlet (3121) being connected to the plurality of branch gas outlets (3122) through the separate gas buffer chamber (3124).
  4. 4. A gas distribution assembly according to claim 3, characterized in that the branch gas inlet (3121) extends in the circumferential direction of the partition (31) and communicates to the partition buffer chamber (3124) through a plurality of communication holes (3125).
  5. 5. A gas distribution assembly according to claim 1, characterized in that the central portion (311) has a central gas passage therein, the central gas passage comprising at least one central gas inlet (3111) on the gas inlet side of the central portion (311) and a plurality of central gas outlets (3112) on the gas outlet side of the central portion (311); The plurality of center air outlets (3112) form a plurality of rows and are disposed corresponding to the plurality of branch air outlets (3122).
  6. 6. A gas distribution assembly according to claim 5, characterized in that the gas outlet side of the branch portion (312) is flush with the gas outlet side of the central portion (311).
  7. 7. A gas distribution assembly according to claim 5, characterized in that the gas outlet side of the branching portion (312) protrudes from the gas outlet side of the central portion (311).
  8. 8. A gas distribution assembly according to claim 5, characterized in that the central portion (311) and the plurality of branch portions (312) form a one-, V-, Y-or cross-shaped partition.
  9. 9. A semiconductor thin film processing apparatus comprising a chamber base (1), a lid (2) and a gas distribution assembly (3) according to any one of claims 1-8; The novel reaction chamber is characterized in that the chamber base (1) is provided with a top opening (11), the cover body (2) is detachably arranged on the top opening (11) and forms a reaction cavity with the chamber base (1), the cover body (2) is provided with a mounting groove (21), and the partition piece (31) is mounted in the mounting groove (21).
  10. 10. The semiconductor thin film processing apparatus according to claim 9, wherein the semiconductor thin film processing apparatus comprises a carrying portion (4), the carrying portion (4) being rotatably provided to the reaction chamber and configured to carry a substrate; the central part (311) is given vent to anger and is put for branch portion (312) is given vent to anger and is formed sunk area (313), be provided with boss (41) on the loading part (4), boss (41) with sunk area (313) nest and form clearance fit.

Description

Gas distribution assembly for semiconductor film processing equipment and semiconductor film processing equipment Technical Field The application belongs to the technical field of semiconductor processing, and particularly relates to a gas distribution assembly for semiconductor film processing equipment and the semiconductor film processing equipment. Background In the field of semiconductor fabrication, the quality of semiconductor thin film deposition processes directly affects chip performance and reliability. The semiconductor film deposition process needs to introduce various reaction gases into a reaction chamber to enable the reaction gases to chemically react on the surfaces of substrates such as wafers and the like, so that films are deposited and formed. In the related art, as the reaction gas and the metal source gas are difficult to effectively separate before reaching the surface of the substrate, the reaction gas and the metal source gas react in the reaction cavity in advance, so that unnecessary byproducts can be generated, the internal environment of the reaction cavity is polluted, defects can be formed by adhering to the surface of a wafer, the uniformity, the purity and the electrical property of film deposition are affected, and the yield of chips is reduced. Therefore, how to effectively separate the reaction gases and avoid the reaction between the reaction gases and the metal source gases before contacting the surface of the substrate becomes an important technical problem to be solved in the semiconductor manufacturing industry. Disclosure of Invention An object of the embodiment of the application is to provide a gas distribution assembly for a semiconductor thin film processing device and a new technical scheme of the semiconductor thin film processing device. According to a first aspect of an embodiment of the present application, there is provided a gas distribution assembly for a semiconductor thin film processing apparatus, comprising: a partitioning member including a central portion and a plurality of branch portions connected to the central portion and spaced apart; the branch part is provided with a branch gas path, and the branch gas path comprises at least one branch gas inlet positioned on the gas inlet side of the branch part and a plurality of branch gas outlets positioned on the gas outlet side of the branch part; the air outlet side of the branch part comprises a plurality of strip-shaped bulges, the strip-shaped bulges are distributed at intervals in the circumferential direction of the partition piece, and the plurality of branch air outlets are arranged in the plurality of strip-shaped bulges. Optionally, the branch air inlet is located at an end of the air inlet side of the branch portion near the central portion. Optionally, the branch gas circuit includes a separation gas buffer cavity disposed in the branch portion, and the branch gas inlet is communicated to the plurality of branch gas outlets through the separation gas buffer cavity. Alternatively, the branched intake port extends in the circumferential direction of the partition and communicates to the partition gas buffering chamber through a plurality of communication holes. Optionally, the central portion has a central air path therein, the central air path including at least one central air inlet located on an air inlet side of the central portion and a plurality of central air outlets located on an air outlet side of the central portion; the plurality of central air outlets form a plurality of rows and are correspondingly arranged with the plurality of branch air outlets. Optionally, the branch portion outlet side is flush with the central portion outlet side. Optionally, the branch portion air outlet side protrudes from the central portion air outlet side. Optionally, the central portion and the plurality of branch portions form a divider in the shape of a straight, V, Y, or cross. According to a second aspect of an embodiment of the present application, there is provided a semiconductor thin film processing apparatus, including a chamber base, a cover, and the gas distribution assembly of the first aspect; the cavity base is provided with a top opening, the cover body is detachably arranged on the top opening and forms a reaction cavity with the cavity base, the cover body is provided with a mounting groove, and the partition piece is mounted in the mounting groove. Optionally, the semiconductor thin film processing apparatus includes a carrying part rotatably disposed in the reaction chamber and configured to carry a substrate; the central part is given vent to anger the side and is formed the depressed area for the branch portion is given vent to anger the side, be provided with the boss on the loading part, the boss with the depressed area nestification forms clearance fit. The application has the technical effects that: The embodiment of the application provides a gas distribution assembly for