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CN-122013282-A - Nickel-plated copper production line applied to integrated circuit manufacturing

CN122013282ACN 122013282 ACN122013282 ACN 122013282ACN-122013282-A

Abstract

The invention relates to the technical field of integrated circuit manufacturing, in particular to a nickel-plated copper production line applied to integrated circuit manufacturing. The device comprises an electroplating bath, wherein a plurality of water pumping devices are arranged in the electroplating bath, a liquid spraying assembly is arranged at the end part of the water pumping device, the liquid spraying assembly is positioned close to the top of a product strip, the end water outlet of the liquid spraying assembly is of a circular structure in an initial state, two bending assemblies are arranged in the liquid spraying assembly, when the liquid flow distribution needs to be changed, the end water outlet of the liquid spraying assembly is deformed from the circular structure into an elliptical structure through operation of the bending assemblies, the bending assemblies are matched with the operation and the rotation adjustment, so that an outlet forms a transverse elliptical liquid curtain consistent with the width direction of the strip, and through changing the liquid flow form, columnar impact jet flows of high pressure at the center and low pressure at the two sides formed by a traditional circular tube are converted into laminar flows of which the pressure distribution is uniform and transversely extends, and the liquid flow coverage in the width direction of the strip is enlarged.

Inventors

  • XIA SHIBIN
  • XIA TIAN

Assignees

  • 广州天幸机电设备有限公司

Dates

Publication Date
20260512
Application Date
20260310

Claims (10)

  1. 1. The utility model provides a be applied to nickel-plated copper production line of integrated circuit manufacturing, includes unreeling device, pretreatment module, electroplating module and the aftertreatment module that sets gradually, electroplating module includes plating bath (1), plating bath (1) are configured to hold the plating solution and supply the product strip vertically to pass, plating bath (1) outer wall is through outlet pipe (11) and inlet tube (12) intercommunication have filtering mechanism (2); The electroplating bath is characterized in that a plurality of water pumping devices (13) are arranged in the electroplating bath (1), a liquid spraying component (14) is arranged at the end part of each water pumping device (13), the liquid spraying component (14) is positioned at the position close to the top of a product strip, and the tail end water outlet of the liquid spraying component (14) is of a circular structure in the initial state; two bending assemblies (15) are arranged in the liquid spraying assembly (14), and when the liquid flow distribution needs to be changed, the bending assemblies (15) are operated to deform a water outlet at the tail end of the liquid spraying assembly (14) from a circular structure to an elliptical structure; meanwhile, the installation direction of the rotary liquid spraying component (14) at the end part of the water pumping device (13) enables the long axis direction of the elliptical structure to be consistent with the width direction of the product strip, and the electroplating liquid sprayed on the surface of the product strip is adjusted to be an elliptical liquid curtain which is transversely expanded.
  2. 2. The nickel-plated copper production line for integrated circuit manufacturing according to claim 1, wherein the filtering mechanism (2) comprises a filtering tank (23), a water outlet plate (21) and a water inlet plate (22) are respectively arranged in the filtering tank (23) near two ends, the bottom of the water outlet plate (21) is fixedly connected to the inner bottom of the filtering tank (23), an overflow gap is reserved between the top of the water outlet plate and the inner top of the filtering tank (23), the top of the water inlet plate (22) is level with the top of the filtering tank (23), and an overflow gap is reserved between the bottom of the water outlet plate and the inner bottom of the filtering tank (23).
  3. 3. The nickel-plated copper production line for integrated circuit manufacturing according to claim 2, wherein a high-level overflow groove is formed between the water outlet plate (21) and the inner wall of one end of the filter tank (23), a low-level extraction groove is formed between the water inlet plate (22) and the inner wall of the other end of the filter tank (23), and a space between the water outlet plate (21) and the water inlet plate (22) is a main groove; the high-level overflow tank is communicated with the electroplating tank (1) through a water outlet pipe (11), and the low-level extraction tank is communicated with the electroplating tank (1) through a water inlet pipe (12).
  4. 4. The nickel-plated copper production line for integrated circuit manufacturing according to claim 1, wherein the water pumping device (13) comprises a water pumping pump (133), the water pumping pump (133) is fixedly connected to the outer wall of the electroplating tank (1), two ends of the water pumping pump (133) are respectively communicated with a water pumping pipe (132) and a water inlet pipe (131), the water pumping pipe (132) and the water inlet pipe (131) are fixedly communicated in the electroplating tank (1), the end part of the water inlet pipe (131) is fixedly connected with a corrugated pipe (130), and the end part of the corrugated pipe (130) is provided with a liquid spraying component (14).
  5. 5. The nickel-plated copper production line for integrated circuit manufacturing according to claim 4, wherein the leaching assembly (14) comprises a rotary pipe (142), the rotary pipe (142) is rotatably connected to the inside of the corrugated pipe (130) near the end, penetrating out of the corrugated pipe (130), of the rotary pipe (142) is fixedly connected with a pipe head piece (140), and an annular groove is formed in the end of the pipe head piece (140) and is sealed through the end head (141).
  6. 6. The nickel-plated copper production line for integrated circuit manufacturing according to claim 5, wherein an annular flange is arranged on the outer wall of the rotary pipe (142), an annular clamping groove matched with the annular flange is formed in the inner wall of the end portion of the corrugated pipe (130), and the annular flange is rotatably clamped in the annular clamping groove to realize rotation and axial limiting of the liquid spraying component (14) relative to the corrugated pipe (130).
  7. 7. The nickel-plated copper production line for integrated circuit manufacturing according to claim 5, wherein two bending assemblies (15) are movably connected in the annular groove, and the two bending assemblies (15) are symmetrically arranged.
  8. 8. The nickel-plated copper production line for integrated circuit manufacturing according to claim 7, wherein the bending component (15) comprises two round beads (150) and a deformation wire (151), the two round beads (150) are movably clamped in the annular groove, and the deformation wire (151) is fixedly connected between the two round beads (150) and is located in the annular groove.
  9. 9. The nickel-plated copper production line for integrated circuit manufacturing according to claim 8, wherein the diameter of the round beads (150) is larger than the diameter of the groove body of the annular groove, and the diameter of the deformation wire (151) is smaller than the diameter of the groove body of the annular groove, so that the two round beads (150) are limited to move in the annular groove, and the deformation wire (151) can freely stretch and deform in the annular groove.
  10. 10. The nickel-plated copper production line for integrated circuit manufacturing according to claim 5, wherein the tube head (140) and the end head (141) are made of flexible corrosion-resistant materials, and are used for elastically deforming to change the shape of the water outlet when the bending assembly (15) acts.

Description

Nickel-plated copper production line applied to integrated circuit manufacturing Technical Field The invention relates to the technical field of integrated circuit manufacturing, in particular to a nickel-plated copper production line applied to integrated circuit manufacturing. Background The continuous nickel-copper plating production line is a surface treatment system for efficiently treating long strip-shaped metal base bands (such as copper bands and stainless steel bands), and the core of the continuous nickel-copper plating production line is to continuously and uniformly plate functional metal layers (such as nickel and copper) on the surfaces of the high-speed conveyed bands through an electrochemical deposition process. The production line integrates modules such as unreeling, pretreatment, electroplating, post-treatment, reeling and the like, and is widely applied to the fields of electronic components, new energy battery current collectors, high-end connectors, decorative building materials and the like. At present, a continuous nickel-copper plating production line mainly adopts vertical or horizontal layout, in the electroplating process, firstly, product strips are washed and activated, then vertically or horizontally pass through an electroplating unit formed by an anode and a spraying system, in the unit, electroplating liquid is pumped out of a liquid storage tank through a pumping system and is sprayed or sprayed on the surfaces of the strips through a pipeline and a distributor, under the action of an electric field, metal ions in the solution are reduced and deposited on a conductive layer on the surfaces of the strips to form a coating, and then, the strips are subjected to post-treatment links such as rinsing, drying and the like, and finally are rolled into finished products. In the electroplating liquid application link, a simple circular tube outlet is adopted for spraying or showering, the speed and the pressure of columnar free jet flow formed by the circular tube outlet are distributed in a parabolic shape with high center and low edge, when high-speed liquid flow vertically impacts a product strip running at high speed, the pressure of a core impact area of the columnar liquid flow is obviously higher than that of diffusion areas at two sides on a fluid distribution layer surface, so that the effective wetting width of the surface of the strip is limited, the central area is forced to form an excessively thick liquid film, and the two side areas can be covered only by means of transverse spreading of the liquid, so that the thickness of the liquid film is a thin plating layer with thick center and thin two sides easily. In view of the foregoing, there is a need for a nickel-plated copper production line for integrated circuit fabrication that addresses the above-described problems. Disclosure of Invention The invention provides a nickel-copper plating production line applied to integrated circuit manufacture, which is characterized in that a plurality of water pumping devices and matched liquid spraying components are arranged in an electroplating bath, a water outlet is circular in an initial state of the liquid spraying components, a bending component symmetrically arranged in the liquid spraying components can be operated to enable the water outlet to be deformed from a circular shape into an elliptical structure, and the liquid spraying components are rotated to enable the long axis of the elliptical structure to be consistent with the width direction of a product strip, so that a transversely-expanded elliptical liquid curtain is formed, electroplating liquid can uniformly cover the surface of the product strip, the liquid film is prevented from exhibiting a distribution state with thick center and thin two sides, and the thickness uniformity of a plating layer is ensured, thereby solving the problems in the background art, namely: The traditional simple circular tube outlet forms columnar free jet flow, the speed and the pressure of the columnar free jet flow are in parabolic distribution with high center and low edge, the effective wetting width of the surface of the strip is limited, the center of the thickness of a liquid film is thick, and the two sides of the liquid film are thin, so that the problem of uneven plating is formed. In order to achieve the above purpose, the nickel-plated copper production line applied to integrated circuit manufacturing comprises an unreeling device, a pretreatment module, an electroplating module and a post-treatment module which are sequentially arranged, wherein the electroplating module comprises an electroplating bath, the electroplating bath is configured to contain electroplating liquid and allow a product strip to vertically pass through, and a filtering mechanism is communicated with a water inlet pipe through a water outlet pipe on the outer wall of the electroplating bath; the electroplating bath is characterized in that a pl