CN-122013284-A - Copper jar electroplating system

CN122013284ACN 122013284 ACN122013284 ACN 122013284ACN-122013284-A

Abstract

The invention discloses a copper cylinder electroplating system which comprises an electroplating bath, an electroplating mechanism, a cathode hanger and a conductive groove, wherein the electroplating mechanism comprises two groups of spraying units which are parallel and opposite and extend along the length direction of the electroplating bath, and anode units which are correspondingly arranged at the back of each spraying unit, the cathode hanger comprises a frame main body, a first conductive clamping assembly, a second conductive clamping assembly and a power taking carbon brush, the first conductive clamping assembly is arranged at the upper part of the frame main body, the second conductive clamping assembly is arranged at the lower part of the frame main body, the power taking carbon brush is arranged at the side part of the frame main body and is electrically connected with the first conductive clamping assembly and the second conductive clamping assembly through cables, and each conductive groove is used for accommodating the power taking carbon brush of the corresponding cathode hanger and providing cathode current for the power taking carbon brush.

Inventors

WANG HENGJIANG
YANG XIAOMING
QIU JIAN
XU XIAOQI

Assignees

昆山嘉德君电子科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260304

Claims (10)

1. A copper cylinder plating system, comprising: Plating bath; The electroplating mechanism comprises two groups of spraying units which are parallel and opposite to each other and extend along the length direction of the electroplating bath, and an anode unit which is correspondingly arranged at the back of each spraying unit, wherein an electroplating space for a workpiece to be electroplated to pass through is formed between the two spraying units, and each spraying unit comprises a spray pipe and a plurality of spray heads which are uniformly arranged on the spray pipe; The cathode hanger is used for clamping a workpiece to be electroplated and providing cathode current, and comprises a frame main body, a first conductive clamping component, a second conductive clamping component and an electricity taking carbon brush, wherein the frame main body is used for accommodating and fixing the workpiece to be electroplated, the first conductive clamping component is arranged on the upper part of the frame main body, the second conductive clamping assembly is arranged at the lower part of the frame body and used for clamping the lower end part of the workpiece to be electroplated, the electricity taking carbon brush is arranged at the side part of the frame body and is electrically connected with the first conductive clamping assembly and the second conductive clamping assembly through cables; And the conductive grooves are arranged above the electroplating bath along the width direction of the electroplating bath, the number of the conductive grooves is at least one, and each conductive groove is used for accommodating the corresponding electricity taking carbon brush of the cathode hanger and providing cathode current for the electricity taking carbon brush.
2. The copper cylinder electroplating system of claim 1, further comprising a walking structure, wherein the walking structure comprises a walking chain group, a guide plate, a guide roller group and a connecting piece, the walking chain group is rotatably arranged on the upper portion of the electroplating bath, a plurality of chains contained in the walking chain group are all provided with slots which are obliquely arranged, the connecting piece is arranged above the side portion of the frame body, the connecting piece can enter the slots of the chains, the guide plate is arranged on the upper portion of the electroplating bath along the length direction of the electroplating bath, and guide wheels contained in the guide roller group are rotatably arranged on the frame body and are in tight fit with the guide plate.
3. The copper cylinder electroplating system according to claim 1, wherein the frame body comprises an upper frame and a lower frame, the side part of the upper frame is provided with a through hole, the side part of the lower frame is correspondingly provided with a waist hole, and the upper frame and the lower frame are connected with a nut through bolts penetrating through the through hole and the waist hole so as to adjust the relative positions of the upper frame and the lower frame and perform locking fixation.
4. The copper cylinder electroplating system according to claim 1, wherein the first conductive clamping assembly comprises a plurality of upper clamps which are arranged at intervals, the second conductive clamping assembly comprises a plurality of lower clamps which are arranged at intervals, the upper clamps and the lower clamps are made of conductive materials, the surfaces of the upper clamps and the lower clamps are coated with insulating corrosion-resistant layers, and the insulating corrosion-resistant layers cover the rest surfaces except the contact parts with the workpiece to be electroplated.
5. The copper cylinder plating system of claim 4, wherein the insulating and corrosion-resistant layer is at least one of PP, PE, PVC, PTFE or epoxy.
6. The copper cylinder electroplating system of claim 1, wherein the anode unit comprises an anode plate and a shielding plate body arranged on the anode plate, the surface of the shielding plate body is provided with area compensation holes, the area compensation holes are at least one of grids with different densities, circular hole arrays and special-shaped holes, and the aperture density or the size of the area compensation holes is adaptive to the current density of an area corresponding to a workpiece.
7. The copper cylinder electroplating system of claim 1, wherein a turbulence tube is arranged below the electroplating space in the electroplating tank, and a plurality of upward through air holes are formed in the turbulence tube.
8. The copper cylinder electroplating system according to claim 1, wherein a first limiting plate and a second limiting plate are arranged below the spray pipe in the electroplating bath along the width direction of the electroplating bath, a limiting column is arranged at the lower part of the frame body, and the limiting column can extend into the space between the first limiting plate and the second limiting plate.
9. The copper cylinder electroplating system according to claim 1, wherein a liquid inlet pipe is arranged in the electroplating tank, and an overflow pipe is arranged above the electroplating tank.
10. The copper cylinder plating system as recited in claim 1, wherein a width of a plating space formed between the two spraying units is 10-30mm.

Description

Copper jar electroplating system Technical Field The invention relates to the field of electroplating equipment, in particular to a copper cylinder electroplating system. Background In the technical field of PCB electroplating, a traditional electroplating bath generally adopts a soaking type or a single-side jet type process, so that uneven electric field distribution between a cathode and an anode is caused, an edge effect is easy to generate, the problem that the thickness difference of a plating layer at the edge and a central area of a PCB is obvious is solved, in addition, the traditional electroplating hanger mainly adopts a single-point clamping and rigid conductive structure, the quick-change type requirements of the PCB with different sizes cannot be adapted, and current interruption is easy to be caused due to fluctuation of contact resistance, so that the uniformity of the plating layer of the PCB is influenced. Disclosure of Invention To overcome the above drawbacks, an object of the present invention is to provide a copper cylinder plating system. In order to achieve the above purpose, the technical scheme adopted by the invention comprises the following steps: Plating bath; The electroplating mechanism comprises two groups of spraying units which are parallel and opposite to each other and extend along the length direction of the electroplating bath, and an anode unit which is correspondingly arranged at the back of each spraying unit, wherein an electroplating space for a workpiece to be electroplated to pass through is formed between the two spraying units, and each spraying unit comprises a spray pipe and a plurality of spray heads which are uniformly arranged on the spray pipe; The cathode hanger is used for clamping a workpiece to be electroplated and providing cathode current, and comprises a frame main body, a first conductive clamping component, a second conductive clamping component and an electricity taking carbon brush, wherein the frame main body is used for accommodating and fixing the workpiece to be electroplated, the first conductive clamping component is arranged on the upper part of the frame main body, the second conductive clamping assembly is arranged at the lower part of the frame body and used for clamping the lower end part of the workpiece to be electroplated, the electricity taking carbon brush is arranged at the side part of the frame body and is electrically connected with the first conductive clamping assembly and the second conductive clamping assembly through cables; And the conductive grooves are arranged above the electroplating bath along the width direction of the electroplating bath, the number of the conductive grooves is at least one, and each conductive groove is used for accommodating the corresponding electricity taking carbon brush of the cathode hanger and providing cathode current for the electricity taking carbon brush. In the preferred technical scheme of the copper cylinder electroplating system, the copper cylinder electroplating system further comprises a walking structure, the walking structure comprises a walking chain group, a guide plate, a guide roller group and a connecting piece, the walking chain group is rotatably arranged on the upper portion of the electroplating bath, a plurality of chains contained in the walking chain group are all provided with obliquely arranged slots, the connecting piece is arranged above the side portion of the frame body, the connecting piece can enter the slots of the chains, the guide plate is arranged on the upper portion of the electroplating bath along the length direction of the electroplating bath, and guide wheels contained in the guide roller group are rotatably arranged on the frame body and are in tight fit with the guide plate in a propping mode. In the preferred technical scheme of the copper cylinder electroplating system, the frame main body comprises an upper frame and a lower frame, the side part of the upper frame is provided with a perforation, the side part of the lower frame is correspondingly provided with a waist hole, and the upper frame and the lower frame are connected with a nut through bolts penetrating through the perforation and the waist hole so as to adjust the relative position of the upper frame and the lower frame and lock and fix the upper frame and the lower frame. In the preferred technical scheme of the copper cylinder electroplating system, the first conductive clamping assembly comprises a plurality of upper clamps which are arranged at intervals, the second conductive clamping assembly comprises a plurality of lower clamps which are arranged at intervals, the upper clamps and the lower clamps are made of conductive materials, the surfaces of the upper clamps and the lower clamps are coated with insulating corrosion-resistant layers, and the insulating corrosion-resistant layers cover the surfaces except the contact parts with the workpiece to be electroplated. In the