CN-122013285-A - Long copper roller plating device for preventing reverse plating of conductive roller

CN122013285ACN 122013285 ACN122013285 ACN 122013285ACN-122013285-A

Abstract

The invention relates to a device for preventing a conductive roller from reversely plating a long copper roller, which belongs to the technical field of water and electricity plating, and comprises a plurality of electroplating baths sequentially arranged along a composite copper film advancing path, wherein a conductive mechanism is arranged between adjacent electroplating baths, the conductive mechanism consists of a first conductive roller, a second conductive roller, a first press roller and a second press roller which are correspondingly arranged, when the composite copper film sequentially passes through a first clamping area and a second clamping area, the first press roller and the second press roller respectively apply positive pressure to the first conductive roller and the second conductive roller, the positive pressure enables the press roller made of elastic materials to elastically deform, a high-pressure sealing belt is formed in the clamping area, and plating liquid is physically eliminated and a zero-potential-difference electric contact interface is established through the cooperation of the press roller and the conductive roller and film path control, so that the chemical condition of reverse plating is fundamentally blocked.

Inventors

CAI CHUNLIANG
WANG TAO
LI ZHANPENG

Assignees

广东捷盟智能装备股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260312

Claims (7)

1. The plating device for preventing the conductive roller from reversely plating the long copper roller is characterized by comprising a plurality of plating tanks which are sequentially arranged along the travelling path of the composite copper film, wherein an anode mechanism which is immersed in plating solution and a submerged roller which is used for guiding the composite copper film are arranged in the plating tanks, a conductive mechanism is arranged between adjacent plating tanks, the conductive mechanism comprises a rotatable first conductive roller, a second conductive roller, a first press roller and a second press roller, the first press roller is oppositely arranged with the first conductive roller, the second press roller is oppositely arranged with the second conductive roller, so that a first clamping area and a second clamping area are respectively formed when the composite copper film passes through the composite copper film, the composite copper film sequentially passes through the first clamping area and the second clamping area, the roller surfaces of the first conductive roller and the second conductive roller are in contact with the A surface of the composite copper film, the roller surfaces of the second conductive roller and the first press roller are in contact with the B surface of the composite copper film, and the first press roller and the second press roller are respectively in non-contact with the first conductive roller and the second press roller, and the second conductive roller are respectively in contact with the first press roller and the second press roller, and the second conductive roller are respectively in contact with the first clamping area and the second conductive roller.
2. The apparatus for preventing a long copper roll from being reverse plated by a conductive roll according to claim 1, wherein a tension mechanism is further provided between two adjacent plating tanks, and the tension mechanism is provided on an upstream side of the conductive mechanism in a traveling direction of the composite copper film for guiding the composite copper film entering the conductive mechanism so that the composite copper film enters the first clamping area and the second clamping area horizontally in a tangential manner.
3. The apparatus for preventing a long copper roll from being reverse plated by a conductive roll according to claim 2, wherein the tension mechanism comprises a rotatable tension roll and a passing roll, the tension roll is disposed near an output end of a preceding plating bath for changing a direction of the composite copper film and providing tension, and the passing roll is disposed near an input end of a following plating bath.
4. The apparatus for preventing reverse plating of long copper roller by conductive roller according to claim 3, wherein the conductive mechanism and the tension mechanism are both disposed above the plating bath, wherein a highest bus bar of the tension roller and a highest bus bar of the passing roller are located at a first horizontal reference plane, a lowest bus bar of the first conductive roller and a highest bus bar of the second conductive roller are located at a second horizontal reference plane, and the first horizontal reference plane coincides with the second horizontal reference plane.
5. The apparatus for preventing a long copper roller from being reverse plated by a conductive roller according to claim 1, wherein the anode mechanism comprises at least one pair of anode plates arranged in parallel in the same electroplating tank, an independent electroplating channel is formed between each pair of anode plates, the submerged roller is arranged at the output end of the electroplating channel, and the composite copper film passes through the electroplating channel and passes through the submerged roller to enter the adjacent conductive mechanism.
6. The device for preventing reverse plating of long copper roller on conductive roller according to claim 1, wherein the first press roller and the second press roller are rubber rollers.
7. The apparatus for preventing reverse plating of a long copper roll by a conductive roll according to claim 1, wherein the lengths of the first conductive roll, the second conductive roll, the first press roll and the second press roll are each larger than the width of the composite copper film.

Description

Long copper roller plating device for preventing reverse plating of conductive roller Technical Field The invention relates to the technical field of water electroplating, in particular to a device for preventing a conductive roller from reversely plating a long copper roller. Background In the conventional V-shaped water electroplating process of the PET composite copper film, an equipment layout as shown in fig. 3 is often adopted, in the structure, the composite copper film forms a larger wrap angle at the conductive roller, which is generally larger than 100 degrees, so that the plating solution carried out of the film from the plating solution tank is accumulated in the wrap angle area to form a layer of residual plating solution film, and as shown in fig. 4, a large amount of free copper ions with positive charges are contained in the residual solution. Due to the existence of residual plating solution, the actual contact condition between the composite copper film and the conductive roller is poor, so that obvious potential difference is formed between the composite copper film and the conductive roller, under the driving of the potential difference, copper ions acquire electrons from the surface of the conductive roller, electrochemical reduction reaction is carried out, metallic copper is generated and gradually deposited and attached on the surface of the conductive roller, as shown in fig. 5, along with the continuous production, the copper layer on the surface of the conductive roller is continuously thickened, the thicker the copper layer is, the contact resistance between the film and the roller is further increased, and the potential difference is further increased, so that the deposition rate of copper on the conductive roller is accelerated, and vicious cycle is formed. When the potential difference reaches a certain degree, even the copper layer plated on the surface of the PET film is used as a soluble anode, reverse ionization dissolution is carried out to generate copper ions, so that the quality problems of uneven plating thickness, reduced binding force, increased surface roughness and the like are caused, and the product percent of pass and the production stability are seriously affected. In practice, although the residual liquid can be reduced by increasing the tension of the film material, adding a compression roller, optimizing the discharging and liquid cutting device of the plating liquid tank, and the like, the plating liquid can not be completely prevented from remaining between the film and the conductive roller due to the inherent limitation of the wrap angle structure, and the potential difference caused by the existence of the plating liquid and the series of electrochemical side reactions caused by the potential difference can not be completely eliminated. Therefore, the conventional V-shaped water electroplating process always faces technical bottlenecks of copper plating of the conductive roller, fluctuation of plating quality, poor process stability and the like in continuous production, and the improvement of productivity and the guarantee of product consistency are restricted. Therefore, a plating device for preventing the reverse plating of the conductive roller with the long copper roller is needed to solve the above technical problems. Disclosure of Invention The invention aims to provide a device for preventing a conductive roller from reversely plating a long copper roller, which solves the technical problems. In order to achieve the above purpose, the present invention provides the following technical solutions: The utility model provides a prevent long copper roller plating device of conductive roller reverse plating, includes a plurality of plating baths that arrange in proper order along the route of advancing of compound copper film and set up, be equipped with in the plating bath and all submerge in plating bath and be used for the direction the submerged roller of compound copper film is equipped with conductive mechanism between the adjacent conductive mechanism includes rotatable first conductive roller, second conductive roller, first compression roller and second compression roller, first compression roller with first conductive roller sets up relatively, the second compression roller with second conductive roller sets up relatively, in order to form respectively first centre gripping region and second centre gripping region when compound copper film passes, compound copper film has opposite A face and B face, and passes in proper order first centre gripping region and second centre gripping region, wherein, the face of first conductive roller with the face of second compression roller with the contact of compound copper film, second conductive roller with the face of first compression roller with the contact of compound copper film, first conductive roller with second conductive roller and second compression roller do not have respectively the contac