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CN-122013286-A - Grid line electroplating device and method

CN122013286ACN 122013286 ACN122013286 ACN 122013286ACN-122013286-A

Abstract

The application discloses a grid line electroplating device and method, and relates to the technical field of photovoltaics. The grid line electroplating device comprises a cathode conductive module, an anode conductive module, a power supply module and a liquid supply module, wherein the anode of the power supply module is connected with the anode conductive module, the cathode of the power supply module is connected with the cathode conductive module, the cathode conductive module is used for being connected with a transparent conductive layer of a battery matrix, the anode conductive module is used for being opposite to a grid line groove and surrounding a flow channel for supplying plating liquid together with the grid line groove, a liquid inlet and a liquid outlet are formed in the anode conductive module, the liquid supply module is communicated with the liquid inlet and the liquid outlet, and the liquid supply module is used for enabling electroplating liquid to flow in the flow channel in a circulating manner. The grid line electroplating device provided by the application is used for electroplating the grid line, the whole battery matrix is not required to be immersed into the electroplating liquid, but the flowing electroplating liquid is formed in the grid line groove for electroplating, a mask is not required, laser sintering is not required, and the risk of damaging the transparent conductive layer is reduced.

Inventors

  • CHEN JIANHUA

Assignees

  • 通威太阳能（成都）有限公司

Dates

Publication Date
20260512
Application Date
20260210

Claims (10)

  1. 1. The utility model provides a grid line electroplating device for electroplate grid line on battery base member, the battery base member includes transparent conducting layer and sets up the grid wire casing on transparent conducting layer, its characterized in that, grid line electroplating device includes negative pole conducting module, positive pole conducting module, power module and confession liquid module, the anodal connection of power module positive pole conducting module, the negative pole of power module is connected negative pole conducting module, negative pole conducting module is used for connecting the battery base member transparent conducting layer, positive pole conducting module is used for just facing the grid wire casing and with the grid wire casing encloses into the runner that supplies power plating solution circulation jointly, offer inlet and liquid outlet on the positive pole conducting module, confession liquid module with inlet with the liquid outlet intercommunication, confession liquid module is used for making the plating solution is in runner internal circulation flows.
  2. 2. The grid line electroplating device according to claim 1, further comprising a base, wherein the cathode conductive module and the anode conductive module are both disposed on the base, a surface of the cathode conductive module, which faces away from the base, is used for abutting against the transparent conductive layer of the battery matrix, a surface of the anode conductive module, which faces away from the base, is used for being opposite to the bottom of the grid line groove at intervals to form the flow channel, and the liquid inlet and the liquid outlet both penetrate through the anode conductive module and the base.
  3. 3. The grid line electroplating device according to claim 2, wherein the base is provided with a matching groove corresponding to the pattern of the grid line groove, the anode conductive module is arranged at the bottom of the matching groove, and the cathode conductive module is arranged outside the matching groove.
  4. 4. The grid line electroplating device according to claim 1, wherein the anode conductive module comprises a plurality of anode conductive parts, each anode conductive part is respectively used for being opposite to a part of the grid line grooves, a partition plate is arranged between two adjacent anode conductive parts, the grid line electroplating device comprises a plurality of power supply modules, and each anode conductive part is respectively and electrically connected with the positive electrode of one power supply module.
  5. 5. The device according to claim 4, further comprising a gate line detection module for detecting a thickness of a deposited metal layer in each segment of the gate line groove corresponding to each anode conductive portion.
  6. 6. The grid plating apparatus of claim 5, wherein the grid detection module comprises a plurality of infrared probes.
  7. 7. The grid line electroplating device according to claim 1, wherein the liquid supply module comprises a liquid storage tank, a liquid inlet pipe and a liquid outlet pipe, the liquid storage tank is used for storing the electroplating liquid, two ends of the liquid inlet pipe are respectively communicated with the liquid inlet and the liquid storage tank, two ends of the liquid outlet pipe are respectively communicated with the liquid outlet and the liquid storage tank, and a pump body is arranged on the liquid inlet pipe.
  8. 8. The grid line plating apparatus according to claim 1, wherein a sealing insulating bar is provided on a side of the cathode conductive module adjacent to the anode conductive module, the sealing insulating bar being for blocking the plating solution from contacting the cathode conductive module.
  9. 9. The grid line plating apparatus according to claim 1, wherein the cathode conductive module is provided with a plurality of vacuum adsorption holes for adsorbing the battery substrate to the surface of the cathode conductive module.
  10. 10. A gate line plating method, characterized by using the gate line plating apparatus according to any one of claims 1 to 9, comprising: obtaining a battery matrix, wherein the battery matrix comprises a transparent conductive layer and a grid line groove formed in the transparent conductive layer; Connecting the cathode conductive module of the grid line electroplating device with the transparent conductive layer, wherein the anode conductive module is opposite to the grid line groove and encloses a flow passage for supplying plating solution together with the grid line groove; the electroplating solution circularly flows in the flow channel through the solution supply module, and an electric field is formed in the flow channel through the power supply module so as to electroplate and form a grid line in the grid line groove.

Description

Grid line electroplating device and method Technical Field The application relates to the technical field of photovoltaics, in particular to a grid line electroplating device and method. Background The gate lines of the existing heterojunction cells are often manufactured by means of mask plating, laser transfer printing, ink jet printing or conventional electroplating. However, the methods have certain defects that the mask electroplating has the problems that the mask contaminates a transparent conductive layer and the transparent conductive film is easy to damage during demolding, meanwhile, the cost is high, the laser transfer printing is realized by laser-induced copper paste transfer printing, the defects that the width of a grid line is low (less than 0.3) and the resistivity is high (more than 3 mu omega cm), the traditional electroplating method needs to immerse the whole battery substrate in electroplating liquid, and the whole battery substrate is used as a cathode to be combined with a parallel flow field for electroplating, so that the process is complex. Disclosure of Invention The application aims to provide a grid line electroplating device and a grid line electroplating method, wherein the whole battery matrix is not required to be immersed into electroplating liquid when the grid line is electroplated, laser sintering is not required, a mask is not required, and the transparent conductive layer is less damaged. Embodiments of the application may be implemented as follows: In a first aspect, the application provides a grid line electroplating device, which is used for electroplating a grid line on a battery substrate, the battery substrate comprises a transparent conductive layer and a grid line groove formed in the transparent conductive layer, the grid line electroplating device comprises a cathode conductive module, an anode conductive module, a power module and a liquid supply module, the anode of the power module is connected with the anode conductive module, the cathode of the power module is connected with the cathode conductive module, the cathode conductive module is used for being connected with the transparent conductive layer of the battery substrate, the anode conductive module is used for facing the grid line groove and surrounding a flow channel for supplying plating liquid together with the grid line groove, the anode conductive module is provided with a liquid inlet and a liquid outlet, the liquid supply module is communicated with the liquid inlet and the liquid outlet, and the liquid supply module is used for enabling the electroplating liquid to circularly flow in the flow channel. In an alternative embodiment, the grid line electroplating device further comprises a base, the cathode conductive module and the anode conductive module are both arranged on the base, one surface of the cathode conductive module, which is away from the base, is used for being abutted against the transparent conductive layer of the battery matrix, and one surface of the anode conductive module, which is away from the base, is used for being opposite to the bottom of the grid line groove at intervals to form a flow channel, and the liquid inlet and the liquid outlet penetrate through the anode conductive module and the base. In an alternative embodiment, the base is provided with a matching groove corresponding to the pattern of the grid line groove, the anode conductive module is arranged at the bottom of the matching groove, and the cathode conductive module is arranged outside the matching groove. In an alternative embodiment, the anode conductive module comprises a plurality of anode conductive parts, each anode conductive part is respectively used for being opposite to a part of the grid line groove, a partition plate is arranged between two adjacent anode conductive parts, the grid line electroplating device comprises a plurality of power supply modules, and each anode conductive part is respectively and electrically connected with the anode of one power supply module. In an alternative embodiment, the gate line electroplating apparatus further includes a gate line detection module for detecting a thickness of the deposited metal layer in each section of the gate line groove corresponding to each anode conductive portion. In an alternative embodiment, the grid line detection module includes a plurality of infrared probes. In an alternative embodiment, the liquid supply module comprises a liquid storage tank, a liquid inlet pipe and a liquid outlet pipe, wherein the liquid storage tank is used for storing electroplating liquid, two ends of the liquid inlet pipe are respectively communicated with the liquid inlet and the liquid storage tank, two ends of the liquid outlet pipe are respectively communicated with the liquid outlet and the liquid storage tank, and a pump body is arranged on the liquid inlet pipe. In an alternative embodiment, a sealing insulating strip is arranged on one side o