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CN-122013325-A - System and process for chemical polishing of curved electrode surface

CN122013325ACN 122013325 ACN122013325 ACN 122013325ACN-122013325-A

Abstract

The invention provides a system and a process for chemically polishing the surface of a curved electrode, which relate to the technical field of electrode surface treatment and comprise an etching tank, wherein the top of the etching tank is fixedly connected with a U-shaped supporting frame, the top of the U-shaped supporting frame is in sliding fit with an adjusting component, a circulating component is fixedly arranged in the bottom of the etching tank, two limiting frames are fixedly arranged on the U-shaped supporting frame, and a rotating shaft is in running fit between the two limiting frames. The circulating blades and the curved electrode keep synchronous swinging, so that the concentration change of the surface of the curved electrode is always consistent in the liquid circulation process of the etching liquid, the non-uniformity of the polished curved electrode caused by the flowing direction of the etching liquid and the front and back sides of the curved electrode is avoided, the mobility of the etching liquid and the uniformity of the concentration of the etching liquid on the surface of the curved electrode are ensured, and the polishing effect of the curved electrode is improved.

Inventors

  • ZHANG MENGYUN
  • PU YONGZHE

Assignees

  • 安徽四象半导体材料科技有限公司

Dates

Publication Date
20260512
Application Date
20260303

Claims (9)

  1. 1. The polishing system for the chemical polishing of the surface of the curved electrode is characterized by comprising an etching groove (1), wherein a U-shaped supporting frame (101) is fixedly connected to the top of the etching groove (1), an adjusting component (2) is slidably matched with the top in the U-shaped supporting frame (101), a circulating component (3) is fixedly arranged at the inner bottom of the etching groove (1), two limiting frames (102) are fixedly arranged on the U-shaped supporting frame (101), and a rotating shaft (4) is rotatably matched between the two limiting frames (102); The circulating assembly (3) comprises a mounting base plate (301), two circulating holes (302) are formed in the mounting base plate (301), a circulating liquid pipe (103) is arranged in the circulating holes (302) at the inner bottom part of the etching tank (1), a plurality of circulating liquid ports (1031) are formed in the circulating liquid pipe (103), two circulating shafts (303) are rotatably matched on the mounting base plate (301), circulating gears (3031) are fixedly connected to the peripheral side surfaces of the two circulating shafts (303), and circulating blades (3032) are fixedly connected to the outer sides of the circulating gears (3031) on the peripheral side surfaces of the two circulating shafts (303); The adjusting assembly (2) comprises an adjusting frame (201) which is connected to the inner top of the U-shaped supporting frame (101) in a sliding mode, and a circulating rack (202) meshed with the circulating gear (3031) is arranged on the adjusting frame (201).
  2. 2. The polishing system for chemical polishing of a curved electrode surface according to claim 1, wherein a servo motor (104) is fixedly arranged at the outer top of the U-shaped support frame (101), the output end of the servo motor (104) is fixedly connected with a threaded rod (1041), and the threaded rod (1041) is in rotary fit with the outer top of the U-shaped support frame (101); A limiting block (203) is fixedly connected to the adjusting frame (201), and a threaded block (2031) in threaded rotation fit with the threaded rod (1041) is fixedly connected to the top of the limiting block (203).
  3. 3. A polishing system for chemical polishing of a curved electrode surface according to claim 2, wherein the top of the U-shaped support frame (101) is provided with a limiting hole (105) which is in sliding fit with the limiting block (203).
  4. 4. The polishing system for chemical polishing a curved electrode surface according to claim 2, wherein two sliders (204) are fixed to the bottom of the adjusting frame (201); And sliding holes (304) which are respectively matched with the two sliding blocks (204) in a sliding way are formed in the top of the mounting bottom plate (301).
  5. 5. The polishing system for chemical polishing of a curved electrode surface according to claim 1, wherein one end, away from the plurality of circulating liquid ports (1031), of the circulating liquid pipe (103) is provided with a liquid inlet (1032), the liquid inlet (1032) is arranged on the inner side wall of the etching tank (1), and etching liquid output by the plurality of circulating liquid ports (1031) is discharged to the plurality of circulating liquid ports (1031) along the circulating liquid pipe (103) through the liquid inlet (1032).
  6. 6. The polishing system for chemical polishing of a curved electrode surface according to claim 4, wherein a rotary gear (401) is fixedly installed on the peripheral side surface of the rotary shaft (4); the traction rack (205) meshed with the rotary gear (401) is fixedly arranged on the adjusting frame (201).
  7. 7. The polishing system for chemical polishing of a curved electrode surface according to claim 6, wherein a rotating plate (402) is fixedly connected to both sides of the rotating gear (401) on the peripheral side surface of the rotating shaft (4), and a moving groove (4021) is formed in one side surface of the rotating plate (402); An air cylinder (403) is fixedly arranged on one side surface of the rotating plate (402), and a moving block (4031) which is in sliding fit with the moving groove (4021) is fixedly connected to the telescopic end of the air cylinder (403).
  8. 8. The polishing system for chemical polishing of a curved electrode surface according to claim 7, wherein two clamping plates (404) are rotatably matched on the peripheral side surface of the rotating shaft (4), traction plates (405) are rotatably matched on the two clamping plates (404), one end, away from the clamping plates (404), of each traction plate (405) is rotatably matched on the side surface of the moving block (4031), and clamping rods (4041) are fixedly connected to the end parts of the clamping plates (404).
  9. 9. A polishing process employing the chemical polishing system for a curved electrode surface according to any one of claims 1 to 8, comprising the steps of: S1, clamping an electrode, namely starting an air cylinder (403) to fix the curved surface electrode between two clamping rods (4041); S2, starting circulating liquid, namely pumping etching liquid along the circulating liquid pipe (103) to a plurality of circulating liquid ports (1031) through a liquid inlet (1032); s3, circulating etching liquid and adjusting the angle of the curved electrode, namely starting a servo motor (104), and respectively driving the circulating blade (3032) to rotate and the curved electrode clamped on the rotating shaft (4) to rotate through the adjusting component (2); And S4, completing etching of the curved electrode, namely taking out the electrode and cleaning and drying the electrode when the etching depth reaches a target value such as 0.02mm or 0.06 mm.

Description

System and process for chemical polishing of curved electrode surface Technical Field The invention relates to the technical field of electrode surface treatment, in particular to a system and a process for chemically polishing a curved electrode surface. Background Chemical polishing is realized by only depending on the oxidation-reduction reaction of a chemical solution, no power is applied, polishing is realized by soaking, aluminum and aluminum alloy use phosphoric acid-sulfuric acid-nitric acid mixed solution (typical three-acid polishing), stainless steel use mixed solution containing hydrochloric acid, nitric acid and hydrofluoric acid, copper and copper alloy use hydrogen peroxide, sulfuric acid, organic additives and the like, a workpiece is immersed into a polishing solution with a specific temperature (usually higher, such as 80-100 ℃) for a period of time, and then the workpiece is taken out for cleaning. After the traditional chemical polishing system is used for a long time, the acidity of etching solution around the curved electrode of the monocrystalline silicon material is reduced, so that the contact uniformity between the curved electrode and the etching solution is not facilitated, and the polishing effect of the electrode surface is affected. Disclosure of Invention (One) solving the technical problems Aiming at the defects of the prior art, the invention provides a system and a process for chemically polishing the surface of a curved electrode, which solve the problem that the acidity of the etching solution around the existing curved electrode is reduced. (II) technical scheme The polishing system for chemical polishing of the surface of the curved electrode comprises an etching groove, wherein the top of the etching groove is fixedly connected with a U-shaped supporting frame, the top of the U-shaped supporting frame is in sliding fit with an adjusting component, a circulating component is fixedly arranged in the bottom of the etching groove, two limiting frames are fixedly arranged on the U-shaped supporting frame, and a rotating shaft is in rotating fit between the two limiting frames. The circulating assembly comprises a mounting bottom plate, two circulating holes are formed in the mounting bottom plate, a circulating liquid pipe is arranged in the circulating hole at the inner bottom of the etching tank, a plurality of circulating liquid ports are formed in the circulating liquid pipe, two circulating shafts are rotatably matched on the mounting bottom plate, circulating gears are fixedly connected to the peripheral side faces of the circulating shafts, and circulating blades are fixedly connected to the outer sides of the circulating gears. The adjusting assembly comprises an adjusting frame which is connected to the inner top of the U-shaped supporting frame in a sliding mode, and a circulating rack meshed with the circulating gear is arranged on the adjusting frame. Preferably, the outer top of the U-shaped support frame is fixedly provided with a servo motor, the output end of the servo motor is fixedly connected with a threaded rod, and the threaded rod is in running fit with the outer top of the U-shaped support frame. The adjusting frame is fixedly connected with a limiting block, and the top of the limiting block is fixedly connected with a threaded block which is in threaded rotation fit with the threaded rod. Preferably, a limiting hole which is in sliding fit with the limiting block is formed in the top of the U-shaped supporting frame. Preferably, two sliding blocks are fixed at the bottom of the adjusting frame; and sliding holes which are respectively matched with the two sliding blocks in a sliding way are formed in the top of the mounting bottom plate. Preferably, one end of the circulating liquid pipe, which is far away from the circulating liquid ports, is provided with a liquid inlet, the liquid inlet is arranged on the inner side wall of the etching tank, and etching liquid output by the circulating liquid ports is discharged to the circulating liquid ports along the circulating liquid pipe through the liquid inlet. Preferably, a rotary gear is fixedly arranged on the peripheral side surface of the rotary shaft. And a traction rack meshed and matched with the rotary gear is fixedly arranged on the adjusting frame. Preferably, the rotary shaft is fixedly connected with the rotary plate on two sides of the rotary gear on the peripheral side face, and a moving groove is formed in one side face of the rotary plate. An air cylinder is fixedly arranged on one side face of the rotating plate, and a moving block which is in sliding fit with the moving groove is fixedly connected to the telescopic end of the air cylinder. Preferably, the rotation axis week side normal running fit has two grip blocks, two all normal running fit has the traction plate on the grip block, two the grip block is kept away from grip block one end normal running fit in the movable block side,