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CN-122014626-A - Rotary screw pumping turbulence integrated heat dissipation device for satellite-borne high-power equipment

CN122014626ACN 122014626 ACN122014626 ACN 122014626ACN-122014626-A

Abstract

The invention discloses a rotary screw pumping turbulence integrated heat dissipation device for a satellite-borne high-power device, which can simultaneously realize pumping and turbulence cooling liquid through screw rotation to achieve a better heat dissipation effect, and comprises a cooling pipe, a rotary screw and a motor, wherein the cooling pipe can be used for introducing a cooling working medium and is provided with an outer heat absorption surface and an inner heat absorption surface which are parallel to each other, the outer heat absorption surface is attached to the heat dissipation surface of the satellite-borne high-power device, the inner heat absorption surface is positioned on the inner wall of the cooling pipe and is adjacent to the outer heat absorption surface, the rotary screw comprises a center rod and a helical blade, one end of the center rod extends out of the cooling pipe and is connected with the motor, the motor can be adjusted in height, the lead angle of the helical blade is alpha, the curvature radius of the helical blade is R, the minimum gap from the outer wall surface of the helical blade to the inner heat absorption surface is delta, the rotation speed of the motor is v, and the high-efficiency removal of the surface heat flux density of the satellite-borne high-power device of not less than 50W/cm 2 can be realized through cooperative control of alpha, R, delta and v, and the mass ratio power consumption in heat dissipation is not more than 0.1W/g.

Inventors

  • HE WEI
  • Feng songjiang
  • WU XUNLIANG
  • LIU XINPING
  • CHEN JIALIANG
  • SHAO MINGXUE
  • LI XIAOLIANG
  • CAI KAIYUAN
  • LI XIAODUO

Assignees

  • 中国人民解放军军事航天部队航天工程大学

Dates

Publication Date
20260512
Application Date
20250715

Claims (10)

  1. 1. The rotary screw pumping and turbulence integrated heat dissipation device for the satellite-borne high-power equipment is characterized by comprising a cooling pipe, a rotary screw and a motor; The cooling pipe can be used for introducing cooling working media and is provided with an outer heat absorbing surface and an inner heat absorbing surface which are parallel to each other, wherein the outer heat absorbing surface is attached to the heat radiating surface of the satellite-borne high-power equipment, and the inner heat absorbing surface is positioned on the inner wall of the cooling channel and is adjacent to the outer heat absorbing surface; The rotary screw rod is axially inserted into the center of the cooling pipe, and comprises a center rod and spiral blades spirally arranged on the periphery of the center rod; By means of the cooperative control of alpha, R, delta and v, the heat flux density of the spaceborne high-power-density chip during heat dissipation is not lower than 50W/cm 2 , and the mass ratio power consumption is not higher than 1.0W/g.
  2. 2. The rotary screw pumping turbulence integrated heat dissipating device for the satellite-borne high-power equipment according to claim 1, wherein the lead angle alpha of the helical blade is positively correlated with the motor rotation speed v, wherein v is more than or equal to 5000rpm and less than or equal to 7000rpm, alpha is more than or equal to 35 DEG and less than or equal to 50 DEG, and the optimal value of the motor rotation speed v can enable the axial pumping flow Q of the rotational flow turbulence screw to be not lower than 8mL/s, and can generate secondary rotational flow through the curvature induction of the helical blade.
  3. 3. The rotary screw pumping and turbulence integrated heat dissipating device for a satellite-borne high-power apparatus according to claim 2, wherein v=6000±500rpm and α=45±5°.
  4. 4. The rotary screw pumping and turbulence integrated heat dissipation device for the satellite-borne high-power equipment, which is disclosed in claim 1, is characterized in that R=0.4-0.7r, wherein R is the radius of a central rod.
  5. 5. The rotary screw pumping turbulence integrated heat dissipation device for the satellite-borne high-power equipment according to claim 1, wherein when alpha and R are kept unchanged, the heat flux density is not lower than 50W/cm 2 when the satellite-borne high-power equipment dissipates heat by increasing v and reducing delta, and the mass ratio power consumption is not higher than 1.0W/g.
  6. 6. The rotary screw pumping and turbulence integrated heat dissipation device for the satellite-borne high-power equipment, which is disclosed in claim 5, is characterized in that delta=0.2-0.3 r, wherein r is the radius of the central rod.
  7. 7. The rotary screw pumping and turbulence integrated heat dissipation device for the satellite-borne high-power equipment according to claim 1, wherein the thickness of the spiral blade is t, and t=0.3+/-0.05 mm.
  8. 8. The rotary screw pumping turbulence integrated heat dissipating device for the satellite-borne high-power equipment according to claim 1, wherein the cross section of the cooling pipe is in a shape of a Chinese character 'hui', and the roughness Ra of the inner wall surface of the cooling pipe is less than or equal to 0.8 mu m.
  9. 9. The rotary screw pumping turbulence integrated heat dissipating device for the satellite-borne high-power equipment according to claim 1, wherein the material of the rotational flow turbulence screw is SiC-TiC ceramic matrix composite, and the material of the cooling pipe is high-purity AlN ceramic.
  10. 10. The rotary screw pumping and turbulence integrated heat dissipation device for the satellite-borne high-power equipment according to claim 7, wherein the heat flux density of the satellite-borne high-power density chip during heat dissipation is not lower than 50W/cm 2 and the mass ratio power consumption is not higher than 0.1W/g through cooperative control of alpha, R, delta, v and t.

Description

Rotary screw pumping turbulence integrated heat dissipation device for satellite-borne high-power equipment Technical Field The invention relates to the technical field of spacecraft thermal control, in particular to a rotary screw pumping turbulence integrated heat dissipation device for satellite-borne high-power equipment. Background At present, when a low-orbit satellite runs in orbit, a multi-core processor of a satellite-borne high-power density chip is rapidly increased due to transient computing force, and the following technical bottlenecks exist: 1. Local hot spots, in turn, lead to temperature gradients exceeding the standard. 2. The thermal boundary layer in the cooling tube is thickened, thereby causing a decrease in heat transfer efficiency. 3. Conventional mechanical pump drive systems have a mass ratio that is too high, such as in excess of 2.5W/g, for example. With the use of a new generation of satellite-borne high-power-density chips, the heat flux density, the temperature uniformity and the mass ratio power consumption have higher cooperative requirements, and if the following three conditions are required to be satisfied at the same time: A. High heat flux, the heat flux of the chip needs to break through 50W/cm when radiating 2 B. The high temperature uniformity is that the flow distribution is uniform when the chip dissipates heat, and the temperature difference is not more than 105K, so that the maximum temperature in the chip is not more than the fatigue limit of the welding spot material. C. And the mass ratio power consumption is lower than 0.1W/g when the chip dissipates heat. In the prior art, a mechanical bearing is used for driving a fin cooling pipe cooling system (also called a fin structure) to dissipate heat of a spacecraft chip, and specifically, a stainless steel gear pump and a ball bearing mechanical driving system are adopted, torque is transmitted through a coupling direct-connection impeller, rectangular fins are periodically arranged in a linear cooling pipe, and turbulent mixing is enhanced by utilizing a flow separation effect. The heat dissipation working medium is glycol-water mixed liquid, and heat dissipation of the heat sink is realized by depending on an external heat exchanger. The whole structure of the system adopts an aluminum alloy cooling tube plate, and is connected with the pump body through a brazing process to form a forced convection heat dissipation system. The rib structure has the following key defects in the spacecraft thermal control application, and the key defects are as follows: (1) The low heat flux density has insufficient bearing capacity, and is specifically expressed as follows: A. Effective heat exchange area loss-flow separation in the wake zone of the ribs results in a reduction of the actual effective heat transfer area by 38-45% B. insufficient thermal boundary layer inhibition, when the heat flux density is more than 80W/cm 2, the thickness delta of the thermal boundary layer is more than or equal to 0.25mm C. The heat flow density bottleneck is that the maximum heat dissipation capacity of the system is limited to 95W/cm 2, and the heat dissipation requirement of the new generation of satellite-borne high-density equipment which is more than or equal to 100W/cm 2 cannot be met (2) The temperature distribution unbalance is serious, namely uneven flow distribution is caused by a rib structure, the inter-core temperature gradient delta T is more than 45K, and the fatigue limit of the welding spot material is exceeded. In addition, the dynamic response is slow, and the temperature stabilization time under a step thermal load is 90s. (3) The quality ratio power consumption is too high, the concrete steps are as follows: A. the flow resistance is too large, the pressure drop delta P is more than or equal to 220Pa caused by the rib structure B. the mechanical loss is serious, the friction power consumption of the ball bearing accounts for 32-37 percent of the total power consumption of the system C. the mass ratio power consumption exceeds the standard, namely the overall mass ratio power consumption of the system reaches 2.8-3.2W/g, and the mass ratio power consumption is far more than 0.5W/g required by the new generation of satellite-borne high-power equipment. In addition, the traditional scheme relies on a high-flow working condition (the flow velocity v of a working medium is more than or equal to 3.5 m/s) to enhance heat transfer, but the pressure drop is in super-linear growth, and the cooperative requirement of a spacecraft on high heat flow and low power consumption cannot be met. Disclosure of Invention The invention aims to solve the technical problems of the prior art, and provides a rotary screw pumping and turbulence integrated heat dissipation device for a satellite-borne high-power device, which can realize the efficient removal of the heat flux density of the surface of a satellite-borne high-power density chip whic