Search

CN-122015330-A - TEC self-adaptive anti-condensation heat dissipation control method, equipment, medium and product

CN122015330ACN 122015330 ACN122015330 ACN 122015330ACN-122015330-A

Abstract

The application provides a TEC self-adaptive anti-condensation heat dissipation control method, equipment, a medium and a product, wherein the method comprises the following steps: the method comprises the steps of acquiring the environmental temperature, the humidity and the temperature of a refrigerating surface of a TEC module of the computing equipment in real time, calculating the real-time dew point temperature through a preset dew point model, determining a first temperature threshold value by combining a safety temperature margin, and adding a buffer difference value to obtain a second temperature threshold value with higher temperature. And when the temperature is between the two thresholds, obtaining the second driving current by multiplying the difference value between the real-time temperature and the first threshold by a proportionality coefficient. By implementing the method, the TEC driving current can be dynamically adjusted according to the environmental conditions and the running state of the equipment, the heat dissipation effect is optimized on the premise of ensuring no condensation, the self-adaptive balance of the anti-condensation and the heat dissipation performance is realized, the running stability and the use reliability of the computing equipment are effectively improved, and the service life of the equipment is prolonged.

Inventors

  • LIU SHANYUE

Assignees

  • 深圳市迈乐技术有限公司

Dates

Publication Date
20260512
Application Date
20260126

Claims (10)

  1. 1. A self-adaptive anti-condensation heat dissipation control method for a TEC is characterized by comprising the following steps: Acquiring environmental temperature data and environmental humidity data of an environment where the computing equipment is located in real time, and acquiring real-time temperature data of a refrigerating surface of a TEC module attached to the surface of a CPU inside the computing equipment; according to the environmental temperature data and the environmental humidity data, calculating a real-time dew point temperature value through a preset dew point calculation model; Adding the real-time dew point temperature value and a preset safety temperature margin value to obtain a first temperature threshold value, and adding the first temperature threshold value and a preset buffer difference value to obtain a second temperature threshold value, wherein the second temperature threshold value is larger than the first temperature threshold value; When the real-time temperature data is higher than the second temperature threshold value, calculating a difference value between the real-time temperature data and a preset target refrigeration temperature to obtain a target difference value, calculating a first driving current value corresponding to the target difference value according to negative feedback control logic, and driving the TEC module by using the first driving current value; When the real-time temperature data is located between the first temperature threshold value and the second temperature threshold value, calculating a difference value between the real-time temperature data and the first temperature threshold value to obtain a threshold value difference value, multiplying the threshold value difference value by a preset proportionality coefficient to obtain a second driving current value, and driving the TEC module by using the second driving current value.
  2. 2. The method according to claim 1, wherein the adding the real-time dew point temperature value to a preset safety temperature margin value to obtain a first temperature threshold value specifically includes: Continuously monitoring the change rate of the environmental humidity data according to a preset sampling period; When the change rate exceeds a preset humidity mutation threshold value, a preset compensation function is called to generate a dynamic compensation value positively related to the change rate; And summing a preset basic safety value and the dynamic compensation value to obtain the safety temperature margin value at the current moment, and adding the safety temperature margin value and the real-time dew point temperature value to obtain the first temperature threshold value.
  3. 3. The method according to claim 2, wherein adding the first temperature threshold to a preset buffer difference value to obtain a second temperature threshold specifically includes: Determining a buffer difference value proportional to the safety temperature margin value according to a preset interval mapping relation; And adding the first temperature threshold value and the buffer difference value to obtain the second temperature threshold value.
  4. 4. The method according to claim 1, wherein calculating the difference between the real-time temperature data and a preset target refrigeration temperature to obtain a target difference value specifically comprises: Acquiring the current core load rate and the current working main frequency of a CPU in the computing equipment in real time; Searching a recommended operation temperature value corresponding to the current core load rate and the current working main frequency in a preset energy efficiency optimization mapping table; Assigning the recommended operating temperature value to the target refrigeration temperature; And subtracting the target refrigeration temperature from the real-time temperature data to obtain the target difference value.
  5. 5. The method according to claim 4, wherein the method further comprises: constructing a target temperature arbitration mechanism, and defining the recommended operating temperature value as a candidate target value to be checked; Substituting the candidate target value into a safety constraint condition based on the second temperature threshold value to perform validity check; If the candidate target value is smaller than the second temperature threshold value, judging that the candidate target value does not pass the safety constraint condition, and determining the second temperature threshold value as the finally effective target refrigeration temperature; and if the candidate target value is greater than or equal to the second temperature threshold value, judging that the candidate target value passes the safety constraint condition, and determining the candidate target value as the finally effective target refrigeration temperature.
  6. 6. The method according to claim 1, wherein multiplying the threshold difference value by a preset scaling factor to obtain a second driving current value, specifically comprises: Calculating the descending rate of the real-time temperature data along with the time change; generating a dynamic proportionality coefficient which is inversely related to the descending speed according to a preset damping adjustment model, wherein the larger the descending speed is, the smaller the dynamic proportionality coefficient is; and multiplying the threshold difference value by the dynamic proportionality coefficient to obtain the second driving current value.
  7. 7. The method of claim 1, wherein the driving the TEC module with the first drive current value or the driving the TEC module with the second drive current value specifically comprises: taking the first driving current value or the second driving current value to be loaded as a target current value; Acquiring a stored historical driving current value at the last moment, and calculating the current variation of the target current value and the historical driving current value; And if the current variation exceeds a preset current climbing upper limit value, limiting the variation amplitude of the target current value based on the current climbing upper limit value, generating a smoothed final driving control signal and loading the smoothed final driving control signal to the TEC module.
  8. 8. An electronic device comprising a processor and a memory; The memory is for storing computer program code comprising computer instructions that the processor invokes to cause the electronic device to perform the method of any of claims 1-7.
  9. 9. A computer readable storage medium storing computer instructions which, when run on an electronic device, cause the electronic device to perform the method of any one of claims 1-7.
  10. 10. A computer program product, characterized in that the computer program product, when run on an electronic device, causes the electronic device to perform the method of any of claims 1-7.

Description

TEC self-adaptive anti-condensation heat dissipation control method, equipment, medium and product Technical Field The application relates to the technical field of temperature control of electronic devices, in particular to a self-adaptive anti-condensation heat dissipation control method, equipment, a medium and a product of a TEC. Background With the rapid development of high-performance computing hardware to miniaturization and integration, MINI-PCs (MINI computers) are increasingly popular in the fields of office, entertainment, industrial control and the like by virtue of the advantages of small size and strong performance. How to efficiently dissipate heat of a CPU (Central Processing Unit ) with high heat density in a limited chassis space has become a core requirement for guaranteeing the performance release and operation stability of equipment. TEC (Thermo Electric Cooler, semiconductor refrigeration technology) is widely applied to solving the heat dissipation bottleneck problem of such high-integration electronic equipment because of the active and efficient refrigeration capacity. In the prior art, in order to prevent condensed water from being generated in the TEC refrigeration process, a control strategy of global heating dehumidification or based on a preset fixed temperature threshold is generally adopted. For example, the operating temperature of the TEC is set above a fixed safe value or the ambient temperature is raised in conjunction with a heating device. However, the control method based on the fixed threshold in the prior art lacks self-adaptive capability to complex and changeable environment humiture (such as high-temperature, high-humidity or low-temperature drying environment), so that the refrigeration potential of the TEC is easily limited in the drying environment, cold surface condensation is difficult to avoid in the humid environment, and the electronic equipment has the risks of limited heat dissipation efficiency and PCBA short circuit fault caused by condensation in actual operation. Disclosure of Invention In view of the above, the present application provides a TEC adaptive anti-condensation heat dissipation control method, apparatus, medium and product, so as to solve the above problems. In a first aspect, a method for controlling adaptive anti-condensation heat dissipation of a TEC is provided, where the method includes: Acquiring environmental temperature data and environmental humidity data of an environment where the computing equipment is located in real time, and acquiring real-time temperature data of a refrigerating surface of a TEC module attached to the surface of a CPU inside the computing equipment; according to the environmental temperature data and the environmental humidity data, calculating to obtain a real-time dew point temperature value through a preset dew point calculation model; adding the real-time dew point temperature value and a preset safety temperature margin value to obtain a first temperature threshold value, and adding the first temperature threshold value and a preset buffer difference value to obtain a second temperature threshold value, wherein the second temperature threshold value is larger than the first temperature threshold value; When the real-time temperature data is higher than a second temperature threshold value, calculating a difference value between the real-time temperature data and a preset target refrigeration temperature to obtain a target difference value, calculating a first driving current value corresponding to the target difference value according to negative feedback control logic, and driving the TEC module by using the first driving current value; when the real-time temperature data is located between the first temperature threshold value and the second temperature threshold value, calculating a difference value between the real-time temperature data and the first temperature threshold value to obtain a threshold value difference value, multiplying the threshold value difference value by a preset proportionality coefficient to obtain a second driving current value, and driving the TEC module by using the second driving current value. According to the technical scheme, the ambient temperature, the humidity and the temperature of the TEC refrigeration surface of the computing equipment are collected in real time, the dew point temperature is calculated by combining the dew point calculation model, and then the two-stage temperature threshold is determined, so that the system can dynamically adjust the TEC drive current according to the temperature interval. And when the temperature exceeds a second threshold value, the refrigerating current is flexibly controlled when the temperature exceeds the second threshold value, so that the CPU temperature is effectively maintained under the condition that condensed water is not generated, and the balance between the anti-condensation and heat dissipation efficiency is rea