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CN-122015496-A - Copper-based electrode chip pressure-sensitive sintering constant temperature control equipment

CN122015496ACN 122015496 ACN122015496 ACN 122015496ACN-122015496-A

Abstract

The invention relates to the technical field of semiconductor and electronic element manufacturing, and particularly discloses copper-based electrode chip pressure-sensitive sintering constant temperature control equipment which comprises a frame, a constant temperature heating module and a pressure applying unit. The lifting cylinder cover structure is adopted, and the cover body can form a closed process chamber with extremely small volume after being lowered, and is matched with a vacuumizing and inert gas system, so that the high-efficiency and low-consumption atmosphere protection and the operation safety are realized. The heating zone of the equipment is divided into a plurality of independent temperature control subareas, and is correspondingly provided with a compression bar assembly with independent driving and terminal pressure sensing, and the local pressure of the corresponding area can be dynamically adjusted in real time and independently according to the temperature of each subarea through the control unit, so that the self-adaptive matching and compensation of a thermal field and a force field are realized, the density uniformity of chip sintering is obviously improved, and the warp deformation is effectively inhibited. The invention also integrates a multistage cooling and buffering protection mechanism, and ensures the long-term stable operation and process consistency of the equipment at high temperature and high pressure.

Inventors

  • WANG XINMIAO
  • JIANG XUEWEN
  • WANG YOUBIN
  • WU HAOTIAN
  • SHE JUNFENG

Assignees

  • 福建瑞升电子科技有限公司

Dates

Publication Date
20260512
Application Date
20260403

Claims (10)

  1. 1. The copper-based electrode chip pressure-sensitive sintering constant temperature control equipment comprises a frame (1), four corners of the bottom of the frame (1) are fixedly provided with a pad foot (2), a constant temperature heating module (3) is fixedly penetrated at the middle side inside the frame (1), the copper-based electrode chip pressure-sensitive sintering constant temperature control equipment is characterized in that a pressure applying unit (4) is arranged on the frame (1), a lower bearing platform (5) for bearing the copper-based electrode chip is connected to the top side of the constant temperature heating module (3), the pressure applying unit (4) comprises a pedestal (41) with the bottom fastened with the frame (1), a screw rod (42) penetrates through the left side of the pedestal (41), the bottom of the screw rod (42) is connected with the top output end of a driving motor (43), the driving motor (43) is fixedly locked at the bottom side of the frame (1), the screw rod (42) penetrates through the left side inside a cylinder cover (44), an inner thread sleeve (45) is arranged inside the left side of the cylinder cover (44), the inner thread sleeve (45) is connected with the screw rod (42), the rear side of the cylinder cover (44) and the right side of the cylinder cover (44) are respectively fastened with a first guide rod (46) and a second guide rod (47) penetrating through the second guide rod (47) and a pressing structure (48), and the pressing structure (48) is positioned right above the lower bearing platform (5), an inert gas connecting pipe (49) for connecting external inert gas is arranged on the left rear side of the inside of the cylinder cover (44) in a penetrating manner, and a vacuumizing connecting pipe (410) is arranged on the right rear side of the inside of the cylinder cover (44) in a penetrating manner and used for connecting external air pumping equipment.
  2. 2. The copper-based electrode chip pressure-sensitive sintering constant temperature control device according to claim 1, further comprising a control unit, wherein the control unit is configured to independently adjust the applied pressure of the pressure applying structure (48) in a corresponding area according to the temperature feedback of the independent temperature control heating partition, and the heating area of the constant temperature heating module (3) is divided into four equally divided independent temperature control heating partitions.
  3. 3. The copper-based electrode chip pressure-sensitive sintering constant temperature control device according to claim 1, wherein liquid cooling runners are arranged in the wall of the cylinder cover (44) and the lower bearing platform (5), and a flexible graphite ring is arranged on the bottom side of the inner wall of the cylinder cover (44).
  4. 4. The copper-based electrode chip pressure-sensitive sintering constant temperature control device according to claim 1, wherein the pressing structure (48) comprises a bin seat (481) fastened on the middle upper side inside a cylinder cover (44), a water cooling flow passage (482) is formed in the inner wall of the bin seat (481), an execution assembly (483) is installed on the middle side inside the bin seat (481), compression bar assemblies (484) are fixedly penetrated on four sides of the bottom of the execution assembly (483), the tops of the compression bar assemblies (484) are connected with the water cooling flow passage (482) through stainless steel water pipes (485), and the bottoms of the four compression bar assemblies (484) are fastened with a semi-rigid equalizing plate (486).
  5. 5. The pressure-sensitive sintering thermostatic control device of copper-based electrode chips of claim 4, wherein the four compression bar assemblies (484) are identical in structure and size and are located at the same level.
  6. 6. The pressure-sensitive sintering thermostatic control device for copper-based electrode chips, as set forth in claim 4, wherein the executing assembly (483) comprises a support (4831) embedded and fixed at the middle side of the interior of the cartridge base (481), a first servo motor (4832) is fixedly locked at the middle rear side of the interior of the support (4831), a driving gear (4833) is connected to the right side output end of the first servo motor (4832), a driven gear (4834) is meshed and transmitted at the front side of the driving gear (4833), a shaft lever (4835) is coaxially arranged at the middle part of the left side of the driven gear (4834), a fixed gear (4836) is fixed at the middle part of the outer surface of the shaft lever (4835), the front side of the fixed gear (4836) is meshed with a spline post (4837), the spline post (4837) penetrates and slides inside a positioning seat (4838), the positioning seat (4838) is fixedly connected to the middle upper side of the interior of the support (4831), a jacket (4839) is embedded and fixed at the bottom side of the interior of the support (4831), a spline (4837) is integrally formed at the bottom end of the spline post (4837), and a vertical post (48310) penetrates through the inner side of the column.
  7. 7. The pressure-sensitive sintering thermostatic control device of the copper-based electrode chip of claim 6, wherein the four sides of the inner part of the carrier plate (48310) are respectively provided with a through hole, and a compression bar assembly (484) is fixedly penetrated in the inner parts of the four through holes.
  8. 8. The device for pressure-sensitive sintering constant temperature control of copper-based electrode chips of claim 6, wherein a force sensor and an elastic compensation element are arranged between the upright post and the carrier plate (48310), and the elastic compensation element is a belleville spring group.
  9. 9. The pressure-sensitive sintering thermostatic control equipment for copper-based electrode chips, as set forth in claim 4, wherein the pressure bar assembly (484) comprises a protecting cover (4841) with the top connected with a stainless steel soft water pipe (485), a second servo motor (4842) is fixedly locked at the inner bottom side of the protecting cover (4841), a cylinder seat (4843) is fixedly connected with the bottom of the protecting cover (4841), the upper part of the cylinder seat (4843) is fastened with a carrier plate (48310), the bottom output end of the second servo motor (4842) is connected with a rotating bar (4844), two convex columns transversely extend from two sides of the bottom end of the rotating bar (4844) and are inserted into spiral grooves in the inner spiral columns (4845), a limit column (48451) is arranged on one side of the outer surface of the inner spiral columns (4845), the limit column (4824) penetrates through and slides on the inner middle lower side of the cylinder seat (4843), a hemispherical rod (4846) is fixedly connected with the bottom end of the inner spiral columns (4845), the hemispherical rod (4846) is slidably connected with a middle frame (4847), and the hemispherical rod (4847) is fastened with a pressing plate (4847) through three limit frames (4847).
  10. 10. The pressure-sensitive sintering thermostatic control equipment for copper-based electrode chips of claim 9, wherein a thin film type pressure sensor is arranged between contact surfaces of the pressing sheet (4849) and the semi-rigid equalizing sheet (486).

Description

Copper-based electrode chip pressure-sensitive sintering constant temperature control equipment Technical Field The invention relates to the technical field of semiconductor and electronic element manufacturing, in particular to copper-based electrode chip pressure-sensitive sintering constant temperature control equipment. Background In the manufacturing process of semiconductors and electronic components, co-firing of chips and electrodes is a core process for determining the final performance and reliability of the product, and the quality of the products directly affects the electrical performance and reliability of the components, and is usually performed by a hot press sintering furnace. At present, china patent application No. CN202310111998.1 discloses a sintering method of chip capacitor ceramic plates, wherein the adopted tool is two zirconia plates and a plurality of ceramic plates for pad firing, the sintering method comprises the following steps of 1), placing the chip capacitor ceramic plates to be sintered between the two zirconia plates, 2), respectively pad-placing the ceramic plates with larger thickness at four corners of the zirconia plates, 3, placing the zirconia plates, the clamped chip capacitor ceramic plates and the pad firing ceramic plates into a sintering furnace, and 1) in a low-speed heating stage, heating to 700 ℃ at a heating rate of 0.4-0.8 ℃ per minute, 2) in a rapid heating stage, heating to 1100 ℃ at a heating rate of 0.9-1.3 ℃ per minute, 3) in a constant-temperature stage, keeping the temperature for min at the highest temperature stage, 4) in a cooling stage, naturally cooling to room temperature from the highest temperature stage, 4) taking out the products from the sintering furnace, and detecting. However, the prior art mostly depends on optimizing temperature parameters and physical gaskets, lacks active and accurate control of sintering pressure, is difficult to realize dynamic adjustment and compensation of the pressure, is difficult to cope with stress and deformation caused by uneven shrinkage of materials at high temperature, and secondly, the whole sintering process is usually carried out in an open hearth, has weak atmosphere control capability, is inconvenient to effectively prevent easily oxidized materials such as copper-based electrodes and the like from being degraded at high temperature, and has complex operation, low automation and intelligence degree and poor process repeatability and safety. Disclosure of Invention The invention aims to provide a copper-based electrode chip pressure-sensitive sintering constant temperature control device, which is used for solving the problems in the background technology. In order to achieve the aim, the invention adopts the following technical scheme that the copper-based electrode chip pressure-sensitive sintering constant temperature control equipment comprises a frame, pad feet, a constant temperature heating module, a pressure applying unit and a lower bearing platform, wherein the pad feet are fixed at four corners of the bottom of the frame, the constant temperature heating module is fixedly penetrated at the middle side in the frame, the pressure applying unit is arranged on the frame, and the top side of the constant temperature heating module is connected with the lower bearing platform for bearing the copper-based electrode chip; The pressure applying unit comprises a pedestal, the bottom of which is fastened with the frame, a screw rod is penetrated and rotated on the left side of the pedestal, the bottom of the screw rod is connected with the top output end of the driving motor, the driving motor is locked and fixed on the bottom side of the frame, the screw rod is penetrated and arranged inside the left side of the cylinder cover, an inner thread sleeve is arranged inside the left lower side of the cylinder cover, the inner thread sleeve is in threaded connection with the screw rod, the rear side and the right side of the cylinder cover are respectively penetrated and slid with a first guide rod and a second guide rod, the bottoms of the first guide rod and the second guide rod are fastened with the pedestal, the middle upper side in the cylinder cover is fastened with a pressing structure, the pressing structure is positioned right above the lower bearing platform, the left rear side in the cylinder cover is penetrated and provided with an inert gas connecting pipe for connecting external inert gas, and the right rear side in the cylinder cover is penetrated and provided with a vacuumizing connecting pipe for connecting external equipment so as to efficiently manage the intracavity atmosphere of the cylinder cover. Preferably, the heating area of the constant temperature heating module is divided into four equally-divided independent temperature control heating partitions, and the device further comprises a control unit, wherein the control unit is configured to independently adjust the applied pres