CN-122015647-A - Three-coordinate automatic visual detection device capable of measuring semiconductor material size in batches

CN122015647ACN 122015647 ACN122015647 ACN 122015647ACN-122015647-A

Abstract

The invention relates to the technical field of measurement, and particularly discloses a three-coordinate automatic visual detection device capable of measuring the size of semiconductor materials in batches. According to the invention, through the cooperation of the auxiliary mechanism and the positioning mechanism, the situation that one side of the annular semiconductor is tilted in the process of centering the annular semiconductor is avoided, so that the annular semiconductor is prevented from falling down to generate offset, the centering stability of the annular semiconductor is prevented from being reduced, and the accuracy of subsequent visual detection is improved. And simultaneously can make the gas guide cover be located the recess at annular semiconductor top to clear up in the recess at annular semiconductor top, reduce impurity such as dust and pile up in annular semiconductor top recess, thereby reduce follow-up influence to visual detection accuracy.

Inventors

ZHANG HENG
Gou Shuwei
TAN JIANZHENG
ZHAO JIALE

Assignees

济南德仁三坐标测量机有限公司

Dates

Publication Date: 20260512
Application Date: 20260318

Claims (10)

1. Three-dimensional automatic visual detection device that can measure semiconductor material size in batches, including three-dimensional measuring machine and visual detector, its characterized in that still including setting up at three-dimensional measuring machine top be used for carrying out size measurement's detection mechanism to annular semiconductor, detection mechanism includes: The mounting plate is fixedly arranged at the top of the three-coordinate measuring machine, the top of the mounting plate is fixedly provided with a placement plate which is in an H-shaped design and is used for placing the annular semiconductor, and a positioning mechanism which is positioned at the top of the three-coordinate measuring machine and at the inner side of the placement plate and is used for positioning the annular semiconductor is arranged at the top of the three-coordinate measuring machine; The frame body is arranged on the outer side of the placing plate in a sliding mode and is in a U-shaped design, the first plate body is arranged on the inner side of the frame body in a lifting mode, the second plate body is arranged on the bottom of the first plate body in a rotating mode, the third plate body is fixedly arranged on the bottom of the second plate body, an auxiliary mechanism which is symmetrically arranged on the center point of the third plate body is arranged on the bottom of the third plate body, the auxiliary mechanism is matched with the positioning mechanism, so that the annular semiconductor is limited to tilt when being positioned, and grooves on the surface of the annular semiconductor can be cleaned.
2. The automated three-dimensional visual inspection apparatus for bulk dimensions of semiconductor material of claim 1, characterized in that the auxiliary mechanism comprises: The spline shaft is fixedly arranged at the center of the bottom of the first connecting plate, the first electromagnet is fixedly arranged at the bottom of the first connecting plate, the second electromagnet is sleeved on the side wall of the spline shaft, and the first electromagnet and the second electromagnet are both in annular design and are sleeved on the side wall of the spline shaft; The telescopic sleeve is fixedly arranged at the bottom of the first connecting plate and is positioned at the outer side of the first electromagnet, the bottom of the telescopic sleeve is fixedly provided with a second connecting plate, a spline groove for sleeving a spline shaft is formed in the top of the second connecting plate, and a first spring is sleeved on the side wall of the spline shaft and positioned between the second electromagnet and the second connecting plate.
3. The three-coordinate automated vision inspection device of claim 2, characterized in that the auxiliary mechanism further comprises: the first connecting shell is fixedly arranged at the bottom of the second connecting plate, the top of the first connecting shell is in an opening design, and the bottom of the spline shaft extends into the first connecting shell along the spline groove; The second is connected the shell, fixedly locates the bottom of spline shaft, and the cover is established in first connection shell, and the inside cover of second is connected the shell and is equipped with the connecting block, and the fixed connecting rod that is equipped with of bottom of connecting block extends to second connection shell bottom, and the lateral wall diameter of connecting rod is less than the lateral wall diameter of connecting block to restrict connecting block and connecting rod and second connection shell and break away from.
4. A three-coordinate automated vision inspection apparatus for batch sizing of semiconductor materials as defined in claim 3, wherein the auxiliary mechanism further comprises: The connecting ring is fixedly sleeved on the side wall of one end of the connecting rod, which is positioned at the bottom of the second connecting shell, and sleeved on the inner side wall of the second connecting shell, and a second spring is sleeved on the side wall of the connecting rod and positioned between the connecting ring and the second connecting shell; The air guide cover is fixedly arranged at the bottom of the connecting rod, air guide holes which are distributed at intervals are formed in the side wall and the bottom of the air guide cover, an air guide pipe which extends to the outside of the first connecting shell along the inside of the connecting rod and the connecting block is fixedly arranged at the bottom of the connecting rod, and connecting through grooves for the air guide pipe to move are formed in the side walls of the first connecting shell and the second connecting shell.
5. The automated three-dimensional visual inspection apparatus for bulk dimensions of semiconductor material of claim 4, characterized in that the auxiliary mechanism further comprises: The connecting hole is formed in the bottom of the first connecting shell, the outer wall of the air guide cover is attached to the inner wall of the connecting hole, and sealing rings which are distributed at intervals are fixedly sleeved on the inner wall of the connecting hole; The sealing cylinder is fixedly arranged on the inner wall of the bottom of the first connecting shell and fixedly connected with the bottom of the connecting ring, and the inner wall of the sealing cylinder is sleeved on the outer wall of the air guide cover and is attached to the outer wall of the air guide cover.
6. The three-coordinate automatic vision inspection device capable of measuring semiconductor material sizes in batches according to claim 2, wherein the top of the frame body is fixedly provided with an electric push rod, a telescopic shaft of the electric push rod extends to the inner side of the frame body, the telescopic shaft of the electric push rod is fixedly provided with a connecting cover, the bottom of the connecting cover is fixedly connected with the top of the first plate body, an adjusting mechanism for adjusting the two auxiliary mechanisms to be close to or far away from each other is arranged in the connecting cover, and the adjusting mechanism comprises: The first servo motor is fixedly arranged at the top of the first plate body and is positioned in the connecting cover; The first sliding groove is formed in the bottom of the third plate body and extends out of the third plate body, first sliding blocks symmetrically distributed at the center point of the first sliding groove are placed in the first sliding groove, sliding seats are fixedly arranged at the bottoms of the first sliding blocks, and the bottoms of the sliding seats are fixedly connected with the tops of the first connecting plates; The first threaded rod is rotationally arranged on the inner wall of the top of the first chute and is in a bidirectional screw design, two ends of the side wall of the first threaded rod are respectively in threaded connection with the two first sliding blocks, and the middle end of the side wall of the first threaded rod is in transmission connection with the output shaft of the first servo motor through a bevel gear; The second sliding groove is formed in the bottom of the third plate body and is located on two sides of the first sliding groove, second sliding blocks are placed in the second sliding groove and fixedly connected with the top of the sliding seat, and the second sliding blocks are located on one side, close to the first servo motor, of the sliding seat.
7. The automated vision inspection device of claim 1, wherein the top of the first plate is provided with a rotating mechanism for driving the second plate to rotate, the rotating mechanism comprising: The second servo motor is fixedly arranged at the top of the first plate body, and a gear is fixedly arranged on an output shaft of the second servo motor; The annular sliding groove is formed in the bottom of the first plate body, an annular sliding block is arranged in the annular sliding groove, and the bottom of the annular sliding block is fixedly connected with the top of the second plate body; the gear ring is fixedly arranged at the top of the second plate body and meshed with the gear, and a groove for providing running space for the gear and the gear ring is formed in the bottom of the first plate body.
8. The automated three-dimensional visual inspection apparatus for bulk dimensions of semiconductor material of claim 1, the positioning mechanism is characterized by comprising: The second threaded rod is rotationally arranged on the inner side of the placement plate and is in a bidirectional screw design, two ends of the side wall of the second threaded rod are connected with positioning seats in a threaded manner, positioning rods symmetrically distributed at the center point of the positioning seats are fixedly arranged on two sides of the top of each positioning seat, and rubber sleeves are fixedly sleeved on the side walls of the positioning rods; the third servo motor is fixedly arranged at the top of the mounting plate and fixedly connected with the second threaded rod through the coupler, guide rails are fixedly arranged at the top of the mounting plate and positioned at two sides of the second threaded rod, so that the positioning seat is slidably connected with the top of the mounting plate, a top plate is arranged at the top of the mounting plate and positioned at two sides of the placing plate in a lifting manner, and the top plate is positioned between the two positioning rods.
9. The automated three-dimensional visual inspection apparatus for bulk dimensions of semiconductor material of claim 8, the positioning mechanism is characterized by further comprising: the third electromagnet is fixedly arranged at the upper end of the side wall of the positioning rod, the side wall of the first plate body is fixedly provided with a magnetic attraction plate, the magnetic attraction plate is made of magnetic metal materials, and the magnetic attraction plate is of an arc-shaped design; and the third sliding grooves are formed in the outer sides of the placing plates, third sliding blocks are arranged in the third sliding grooves, and the third sliding blocks are fixedly connected with the inner sides of the frame bodies so as to limit the movement of the frame bodies.
10. The automated vision inspection device capable of batch measurement of semiconductor material dimensions according to claim 1, wherein a first electric slide rail is fixedly arranged at the top of the three-dimensional measurement machine, a second electric slide rail is fixedly arranged at the sliding end of the first electric slide rail, a third electric slide rail is fixedly arranged at the sliding end of the second electric slide rail, and the bottom of the sliding end of the third electric slide rail is fixedly connected with the vision inspection instrument so as to adjust the position of the vision inspection instrument through the first electric slide rail, the second electric slide rail and the third electric slide rail.

Description

Three-coordinate automatic visual detection device capable of measuring semiconductor material size in batches Technical Field The invention relates to the technical field of measurement, in particular to a three-coordinate automatic visual detection device capable of measuring the size of semiconductor materials in batches. Background New materials refer to materials that are emerging or evolving with excellent properties and special functions. The conductivity of semiconductor materials (such as silicon, gallium arsenide) is between the conductor and the insulator, and the performance can be regulated and controlled by doping, process and the like, which accords with the definition of new materials. When the semiconductor material is actually applied, the workpiece with the corresponding shape of the support seat according to the actual situation, such as an annular semiconductor workpiece, is required to be monitored after the manufacture is completed so as to judge whether the use requirement is met. The core principle of visual dimension measurement is ‌, which is to make the machine 'see' the object through the camera, and then accurately calculate the dimension ‌ by using an algorithm, thus having the advantages of non-contact, high efficiency and the like. The publication number CN119438241B discloses a visual detection device of the motor coil, which aims to realize image acquisition of different positions of one motor coil, and a plurality of cameras and image contrast equipment are not required to be used for shooting the different positions of the motor coil, so that the visual detection cost of the motor coil is greatly reduced. The following problems exist when the prior art is integrated: When the three-coordinate automatic visual inspection device is used for measuring the size of the semiconductor annular material, the semiconductor annular material is required to be placed on an inspection table, centered and positioned, so that the visual inspection device can take a picture of the semiconductor annular material, and therefore, whether the semiconductor annular material is abnormal in size or not is obtained, but when the semiconductor annular material is centered and positioned, the semiconductor annular material is usually centered and clamped from the periphery of the semiconductor annular material, so that the centering and positioning are carried out, but in the process, the tilting of one side of the semiconductor annular material in the axial direction is caused, after the centering and positioning, the tilted part falls, the positioning deviation is caused, the stability of subsequent measurement is affected, a groove is formed in the top of the semiconductor annular material, dust and the like are easy to accumulate in the groove, so that the accuracy of the subsequent visual inspection is affected, and the centering and clamping are only carried out from the periphery of the annular material, so that the tilting of the annular material in the axial direction cannot be avoided, and a certain defect is present. Disclosure of Invention The three-coordinate automatic visual detection device capable of measuring the size of the semiconductor material in batches comprises a three-coordinate measuring machine, a visual detector, a detection mechanism arranged on the top of the three-coordinate measuring machine and used for measuring the size of the annular semiconductor, wherein the detection mechanism comprises: The mounting plate is fixedly arranged at the top of the three-coordinate measuring machine, the top of the mounting plate is fixedly provided with a placement plate which is in an H-shaped design and is used for placing the annular semiconductor, and a positioning mechanism which is positioned at the top of the three-coordinate measuring machine and at the inner side of the placement plate and is used for positioning the annular semiconductor is arranged at the top of the three-coordinate measuring machine; The frame body is arranged on the outer side of the placing plate in a sliding mode and is in a U-shaped design, the first plate body is arranged on the inner side of the frame body in a lifting mode, the second plate body is arranged on the bottom of the first plate body in a rotating mode, the third plate body is fixedly arranged on the bottom of the second plate body, an auxiliary mechanism which is symmetrically arranged on the center point of the third plate body is arranged on the bottom of the third plate body, the auxiliary mechanism is matched with the positioning mechanism, so that the annular semiconductor is limited to tilt when being positioned, and grooves on the surface of the annular semiconductor can be cleaned. Further, the auxiliary mechanism includes: The spline shaft is fixedly arranged at the center of the bottom of the first connecting plate, the first electromagnet is fixedly arranged at the bottom of the first connecting plate, the second electrom