CN-122015667-A - Method and system for detecting sizing amount in material compounding process

Abstract

The invention belongs to the technical field of glue coating amount detection, and particularly relates to a method for detecting glue coating amount in a material compounding process, which comprises the following steps of S1, taking glue with a main agent and a curing agent which are completely mixed, measuring the weight M1 of the glue, S2, ageing the glue in S1, measuring the weight M2 and the density ρ of the aged glue, S3, and calculating the solid content N of the glue under the ageing condition in S2, wherein N= S4, ageing the composite material, wherein ageing conditions are the same as S2, so that the adhesive layer is rapidly cured, observing the section of the slice, and measuring to obtain the thickness d of the adhesive layer, S5, calculating the volume V of the adhesive layer in unit area, V=S×d, calculating the adhesive weight M3 in unit area after ageing, M3=V=rho=S×d×rho, and calculating the adhesive weight M4 in unit area before ageing, and M4=D Wherein the glue weight M4 is the glue feeding amount in the material compounding process.

Inventors

• ZHANG LONG
• WU YANGLONG

Assignees

• 至信搏远新材料科技有限公司

Dates

Publication Date

20260512

Application Date

20260203

Claims (5)

1. 1. The method for detecting the sizing amount in the material compounding process is characterized by comprising the following steps of: s1, taking glue with completely mixed main agent and curing agent, and measuring the weight M1 of the glue; s2, aging the glue in the step S1, and measuring the weight M2 and the density rho of the aged glue; s3, calculating the solid content N of the glue under the aging condition in S2, wherein N= ; S4, taking the composite material to be subjected to ageing treatment, wherein the ageing conditions are the same as those of S2, so that the adhesive layer of the composite material is quickly solidified, observing the section of the slice, and measuring to obtain the thickness d of the adhesive layer; S5, calculating the volume V of the adhesive layer in the unit area, and v=s×d, calculating the adhesive weight M3 in the unit area after aging, and m3=s×d×ρ, and calculating the adhesive weight M4 in the unit area before aging, and m4= ; Wherein the glue weight M4 is the glue feeding amount in the material compounding process.
2. 2. The detection method according to claim 1, wherein, The aging treatment condition in the step S2 comprises the temperature range of 100-150 ℃ and the time of 30-120 min.
3. 3. The detection method according to claim 1, wherein, The material to be compounded in the step S4 comprises a film material with the thickness not more than 200 mu m and a metal material with the thickness not more than 100 mu m.
4. 4. The detection method according to claim 1, wherein, The detection method of the thickness d of the adhesive layer in the step S4 comprises the step of observing the thickness by a microscope after slicing.
5. 5. The utility model provides a detecting system of rubberizing volume in material compounding process which characterized in that includes: the measuring unit comprises a weighing sensor for acquiring weight M1 and weight M2, a densimeter for acquiring density rho and a microscope for acquiring thickness d; An aging unit including an oven for performing aging treatment; the control module is electrically connected with the measuring unit and the aging unit, and performs detection according to the method of any one of claims 1-4 to calculate the glue weight M4.

Description

Method and system for detecting sizing amount in material compounding process Technical Field The invention belongs to the technical field of sizing amount detection, and particularly relates to a method and a system for detecting sizing amount in a material compounding process. Background Along with the rapid development of the material processing industry in recent years, the material industry also puts forward stricter requirements on the material production and manufacturing process, the current industry excessively depends on an on-line detection instrument for controlling the glue coating amount of the composite material in the production process, and the glue coating amount is calculated through the total glue consumption after the production is finished, so that a mature and reliable detection method is not formed for detecting the glue coating amount in the production process. Therefore, how to rapidly detect the sizing amount in the production process is a technical problem to be solved in the art. It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and therefore the above description is not to be construed as constituting prior art information. Disclosure of Invention The embodiment of the disclosure at least provides a method and a system for detecting the sizing amount in the material compounding process. In a first aspect, an embodiment of the present disclosure provides a method for detecting a glue amount in a material compounding process, including the steps of S1, taking a glue in which a main agent and a curing agent are completely mixed, measuring a weight M1 of the glue, S2, aging the glue in S1, measuring a weight M2 and a density ρ of the aged glue, S3, and calculating a solid content N of the glue in S2 under an aging condition, wherein N=S4, ageing the composite material, wherein ageing conditions are the same as S2, so that the adhesive layer is rapidly cured, observing the section of the slice, and measuring to obtain the thickness d of the adhesive layer, S5, calculating the volume V of the adhesive layer in unit area, V=S×d, calculating the adhesive weight M3 in unit area after ageing, M3=V=rho=S×d×rho, and calculating the adhesive weight M4 in unit area before ageing, and M4=DWherein the glue weight M4 is the glue feeding amount in the material compounding process. In an alternative embodiment, the aging treatment in S2 is performed under the conditions that the temperature is 100-150 ℃ and the time is 30-120 min. In an alternative embodiment, the material to be compounded in S4 includes a thin film type material having a thickness of not more than 200 μm and a metal type material having a thickness of not more than 100 μm. In an alternative embodiment, the method for detecting the thickness d of the adhesive layer in S4 includes observing the thickness with a microscope after slicing. In a second aspect, the embodiment of the disclosure further provides a system for detecting the glue feeding amount in the material compounding process, which comprises a measuring unit, an aging unit and a control module, wherein the measuring unit comprises a weighing sensor for collecting weight M1 and weight M2, a densimeter for collecting density ρ and a microscope for collecting thickness d, the aging unit comprises an oven for aging treatment, and the control module is electrically connected with the measuring unit and the aging unit and is used for detecting the method according to any one of claims 1-4 to calculate and obtain glue weight M4. The method has the beneficial effects that the method for detecting the glue amount in the material compounding process is characterized in that the glue is solidified under different time-efficient conditions, the solid content is calculated, the density is measured, the calculated volume of the glue thickness is measured through observation of a slicing microscope, the glue amount in a unit area is calculated, finally, whether the glue amount in the production process is consistent with the design requirement can be rapidly judged, and the glue amount with larger deviation is obtained through calculation of the total glue amount without an additional online detection instrument or after the production is completed. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings. In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below. Drawings In order to more clearly illustrate the embodiments of the present invention or the tech