CN-122015974-A - Sheet-shaped temperature and pressure integrated sensor and packaging method thereof

CN122015974ACN 122015974 ACN122015974 ACN 122015974ACN-122015974-A

Abstract

The application provides a sheet temperature and pressure integrated sensor and a packaging method thereof, and belongs to the technical field of sensors. The sheet temperature and pressure integrated sensor comprises a PCB board, a patch type thermistor and a voltage acquisition sheet. The patch type thermistor is arranged on the front surface of the PCB, the voltage acquisition sheet is arranged on the front surface of the PCB and is provided with a windowing area, the patch type thermistor is positioned on the PCB in the windowing area, and a temperature acquisition circuit for transmitting data acquired by the patch type thermistor is not contacted with the voltage acquisition sheet. The voltage acquisition piece still includes the extension claw, and the PCB board still includes the fixed orifices, extends the claw and stretches into in the fixed orifices, realizes the mechanical interlocking of voltage acquisition piece and PCB board. The application enhances the tensile stripping capacity of the nickel sheet by matching the extending claw with the fixing hole, prevents the nickel sheet from falling off due to temperature stress, and simultaneously, the windowing area provides protection and heat dissipation channels for the patch type thermistor, ensures temperature measurement precision and obviously improves the reliability and stability of the sensor.

Inventors

Lu Shuaichen
LIU WEI
WEI QINGYUN
MO CHANGJIAN
Qin Shousen
ZENG QIANG

Assignees

深圳市科敏传感器有限公司

Dates

Publication Date: 20260512
Application Date: 20260408

Claims (10)

1. A sheet-like warm-pressing integrated sensor comprising: a PCB board (10); a chip thermistor (20) provided on the front surface of the PCB (10); The voltage acquisition sheet (30) is arranged on the front surface of the PCB (10), the voltage acquisition sheet (30) is provided with a windowing area (31), and the patch type thermistor (20) is arranged on the PCB (10) in the windowing area (31); The temperature acquisition circuit (12) for transmitting the data acquired by the patch thermistor (20) is not in contact with the voltage acquisition sheet (30); The voltage acquisition sheet (30) further comprises an extension claw (33); The PCB (10) further comprises a fixing hole (11), and the extending claw (33) extends into the fixing hole (11) to fixedly package the voltage acquisition sheet (30) on the PCB (10).
2. The sheet-like temperature and pressure integrated sensor according to claim 1, characterized in that the fenestration area (31) is a wraparound fenestration or a three-sided wraparound fenestration.
3. The sheet-like temperature and pressure integrated sensor according to claim 1, characterized in that the fenestration area (31) is a three-sided surrounding fenestration; The temperature acquisition circuit (12) comprises a positive and negative temperature acquisition welding point (12 a), a positive and negative connecting line (12 b) and a positive and negative temperature connection welding point (12 c); The positive and negative temperature acquisition welding spots (12 a) are arranged in the windowing area (31); the positive and negative connecting lines (12 b) penetrate out of the windowing region (31); The positive and negative temperature connection welding spots (12 c) are arranged outside the windowing area (31).
4. The sheet-like temperature and pressure integrated sensor according to claim 3, wherein the voltage acquisition sheet (30) further comprises a protruding portion (32) located in the windowing region (31), the protruding portion (32) is bent upwards relative to an extension plane of the voltage acquisition sheet (30) and extends to a position where the chip-type thermistor (20) is located along an extension plane parallel to the voltage acquisition sheet (30), and the protruding portion (32) is used for protecting the chip-type thermistor (20); The extension claw (33) is bent downwards relative to the extension plane of the voltage acquisition sheet (30).
5. A sheet-like temperature and pressure integrated sensor according to claim 3, wherein a partition area (15) is arranged on the PCB board (10), the partition area (15) is located between the positive and negative temperature connection welding spots (12 c) and is used for physically isolating the positive and negative poles of the positive and negative temperature connection welding spots (12 c), and the extension length of the partition area (15) is equal to the extension length of the positive and negative temperature connection welding spots (12 c).
6. The sheet-like temperature and pressure integrated sensor according to claim 5, the sheet-shaped temperature and pressure integrated sensor (100) is characterized by further comprising: The first packaging adhesive (51) is arranged on the PCB (10) and is used for packaging the patch type thermistor (20) in the windowing area (31); The second packaging adhesive (52) is arranged on the PCB (10) and is used for packaging the positive and negative temperature connection welding spots (12 c) and the pressure connection welding spots (13 b) in the voltage acquisition circuit (13); And the third packaging adhesive (53) is arranged on the PCB (10) and is used for packaging other circuit structures exposed out of the PCB (10).
7. The sheet-like warm-pressing integrated sensor according to claim 3, wherein the overall length of the PCB board (10) is L, the distance from the center of the positive and negative temperature connection pads (12 c) to the first edge of the PCB board (10) is L1, the distance from the center of the positive and negative temperature connection pads (12 c) to the second edge of the PCB board (10) is L2, wherein the first edge is an edge close to an outer lead and satisfies that L is 12 +.0.3 mm +.16 +.0.3 mm, and L is 3:7 +.l1:l2≤5:5.
8. A packaging method of a sheet-like temperature and pressure integrated sensor, applied to the sheet-like temperature and pressure integrated sensor as set forth in any one of claims 1 to 7, characterized by comprising the steps of: S1, providing a PCB (10), wherein a fixing hole (11), a temperature acquisition circuit (12) and a voltage acquisition circuit (13) are preset on the PCB (10), the fixing hole (11) is arranged on a path of the voltage acquisition circuit (13), and the inner side wall of the fixing hole (11) is coated with a copper material; S2, providing a voltage acquisition sheet (30), wherein the voltage acquisition sheet (30) is provided with a windowing area (31) and an extension claw (33); s3, providing solder paste, arranging the solder paste in the fixing hole (11), extending the extending claw (33) into the fixing hole (11), and fixing the voltage acquisition sheet (30) on the front surface of the PCB (10) through welding; S4, providing a patch type thermistor (20), and arranging the patch type thermistor (20) in the windowing area (31) and electrically connecting the patch type thermistor with the temperature acquisition circuit (12); s5, packaging the voltage acquisition sheet (30) and the patch type thermistor (20) on the PCB (10) through packaging glue.
9. The method for packaging a sheet temperature and pressure integrated sensor according to claim 8, wherein the step S2 further comprises: Performing pre-forming treatment on an extending claw (33) and a protruding portion (32) of the voltage acquisition sheet (30), and bending the extending claw (33) downwards relative to an extending plane of the voltage acquisition sheet (30), so that the protruding portion (32) extends to a position where the patch thermistor (20) is located along a direction parallel to the extending plane of the voltage acquisition sheet (30) after being bent upwards relative to the extending plane of the voltage acquisition sheet (30).
10. The method for packaging a sheet-like temperature and pressure integrated sensor according to claim 8, wherein the step S5 specifically includes: S51, applying a first packaging adhesive (51) to package the patch type thermistor (20) in the windowing area (31); S52, applying a second packaging adhesive (52), and packaging positive and negative temperature connection welding spots (12 c) in the temperature acquisition circuit (12) and pressure connection welding spots (13 b) in the voltage acquisition circuit (13); and S53, applying a third packaging adhesive (53) to package other circuit structures exposed out of the PCB (10).

Description

Sheet-shaped temperature and pressure integrated sensor and packaging method thereof Technical Field The application relates to the technical field of sensors, in particular to a sheet temperature and pressure integrated sensor and a packaging method thereof. Background The temperature and pressure integrated sensor is widely applied to the fields of automobiles, industrial control, consumer electronics and the like and is used for simultaneously monitoring the temperature and pressure of the environment or medium. The traditional discrete sensor occupies large space and is complex to assemble, so that a sheet-shaped integrated sensor integrating a temperature sensitive element (such as a patch type thermistor) and a pressure acquisition element (such as a nickel sheet) on the same PCB becomes a development trend. However, in the existing design and manufacturing process of the integrated sensor, there is a significant technical difficulty that the sensor often faces complex environmental stress, particularly severe temperature changes and mechanical vibration, under the working condition of simultaneous temperature and pressure detection. The welding point used for connecting the pressure acquisition nickel sheet and the PCB is extremely easy to generate false welding or even disbonding failure after long-term service. The welding failure not only can cause signal transmission interruption and abnormal data acquisition, but also can cause the loss of the whole function of the sensor, and seriously affects the reliability and the service life of the sensor. The cause of weld failure is analyzed in many ways. Firstly, the pressure acquisition nickel sheet is usually fixed on the PCB board by surface mounting or simple pad connection, and the combination of the pressure acquisition nickel sheet and the PCB board mainly depends on the mechanical strength of welding spots, but the weldability difference between the nickel sheet material (such as pure nickel or nickel alloy) and the PCB pad (usually copper surface coating) is large, and if the welding process is improperly controlled, voids or welding spots with insufficient bonding force are easily formed. Under the temperature stress, due to the fact that the thermal expansion coefficients of the nickel sheet, the PCB (FR-4 and other materials) and the solder are not matched, obvious shearing stress can be generated, and fatigue of welding spots, initiation and expansion of microcracks are caused by long-term action, and finally virtual welding is caused. Secondly, in a limited space, the layout of a temperature acquisition circuit and a pressure acquisition nickel sheet is too compact, the physical isolation between welding spots is insufficient, and the welding spot failure is easy to accelerate due to stress concentration. In addition, the connection point of the outer lead and the PCB often is a weak link with concentrated stress, and when the whole sensor is bent or pulled, deformation generated by the connection point can be transferred to an adjacent nickel sheet welding point, so that the risk of cold joint is further increased. Therefore, how to provide a sheet temperature and pressure integrated sensor which has a stable structure, can effectively resist welding failure and adapt to severe working conditions becomes a technical problem to be solved in the field. Disclosure of Invention The application aims to provide a sheet temperature and pressure integrated sensor and a packaging method thereof, wherein the sheet temperature and pressure integrated sensor comprises the following components: A PCB board; the patch type thermistor is arranged on the front surface of the PCB; the voltage acquisition sheet is arranged on the front surface of the PCB; the voltage acquisition sheet is provided with a windowing area, and the patch type thermistor is arranged on the PCB in the windowing area; The temperature acquisition circuit for transmitting the acquired data of the patch thermistor is not in contact with the voltage acquisition sheet; The voltage acquisition sheet also comprises an extension claw; The PCB further comprises a fixing hole, and the extending claw extends into the fixing hole and is used for fixedly packaging the voltage acquisition sheet on the PCB. In one embodiment, the fenestration area is a wrap-around fenestration or a three-sided wrap-around fenestration. In one embodiment, the fenestration area is a three sided enclosed fenestration; the temperature acquisition circuit comprises a positive temperature acquisition welding spot, a positive connecting wire, a negative connecting wire and a positive temperature connection welding spot; The positive and negative temperature acquisition welding spots are arranged in the windowing area; the positive and negative connecting lines penetrate out of the windowing area; The positive and negative temperature connection welding spots are arranged outside the windowing area. In one embodiment, t