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CN-122016118-A - Mould double-thimble series pressure acquisition mechanism

CN122016118ACN 122016118 ACN122016118 ACN 122016118ACN-122016118-A

Abstract

The invention discloses a die double-thimble serial pressure acquisition mechanism, wherein the front part of a first thimble stretches into a die plate and a die core of a die, a second thimble is coaxially arranged behind the first thimble and can mutually prop against the first thimble, the rear part of the second thimble is arranged on a fixed plate of the die, a pressure sensor is arranged behind the second thimble and can mutually prop against the second thimble, the pressure sensor is positioned at one end of the die fixed plate far away from the die core, and the pressure sensor is limited in the die fixed plate through a fixed plate pressing block. Through the structure setting above, the second thimble can lengthen thimble length with the mode of continuing to install pressure sensor in the fixed plate of mould, and be located the position that is close to the fixed plate lateral surface, when need tear pressure sensor open, only need to tear down the fixed plate briquetting from the fixed plate lateral surface of mould and can tear open pressure sensor open, thereby alleviateed the manpower and materials of pressure sensor dismouting, alleviateed working strength, improved work efficiency, greatly reduced repair the influence of mould to the sensor.

Inventors

  • DU WEI
  • GONG RULIN
  • SUN QIANKUN
  • QIAN XUELI

Assignees

  • 青岛海尔模具有限公司

Dates

Publication Date
20260512
Application Date
20260204

Claims (10)

  1. 1. The utility model provides a mould double thimble series connection pressure acquisition mechanism which characterized in that includes: A first ejector pin, the front part of which extends into the template and the die core of the die, The second thimble is coaxially arranged behind the first thimble and can mutually prop against the first thimble, the rear part of the second thimble is arranged on the fixed plate of the die, The pressure sensor is arranged behind the second ejector pin and can mutually prop against the second ejector pin, is positioned at one end of the die fixing plate far away from the die core, and is limited in the die fixing plate through the fixing plate pressing block.
  2. 2. The dual ejector pin tandem pressure collecting mechanism of a mold of claim 1, wherein the rear portion of the first ejector pin is disposed in the ejector plate.
  3. 3. The dual ejector pin tandem pressure collecting mechanism of a mold as set forth in claim 2, wherein the front portion of the second ejector pin extends into the ejector pin plate.
  4. 4. The dual-ejector-pin serial pressure acquisition mechanism of a mold of claim 3, wherein the ejector plate comprises a front ejector plate and a rear ejector plate which are overlapped and fixed, a first stepped hole is arranged on the front ejector plate for placing a first ejector pin, and the depth of a large-diameter hole at the rear section of the first stepped hole is larger than the length of a first ejector pin embryo; the rear thimble plate is provided with a second stepped hole, the diameter of a large-diameter hole of the front section of the second stepped hole is larger than that of the first thimble embryo head, the diameter of a small-diameter hole of the second stepped Kong Jiexu is smaller than that of the first thimble embryo head but larger than that of the second thimble, and the front part of the second thimble stretches into the second stepped hole.
  5. 5. The dual ejector pin tandem pressure collecting mechanism of claim 4, wherein the rear port hole wall of the second stepped hole of the rear ejector pin plate is chamfered.
  6. 6. The dual-ejector-pin serial pressure acquisition mechanism of claim 5, wherein the fixing plate of the die is provided with a third stepped hole, the rear part of the second ejector pin is arranged in the third stepped hole, and the depth of a hole for placing the second ejector pin embryo head in the third stepped hole is larger than the length of the second ejector pin embryo head.
  7. 7. The dual-ejector pin serial pressure acquisition mechanism of the mold of claim 1, wherein the rear part of the first ejector pin is arranged in a fourth stepped hole in a template and a mold core of the mold, and the first ejector pin is limited in the template and the mold core at the rear end of the first ejector pin through a template pressing block with a through hole; The template pressing block is positioned in the fourth stepped hole and does not protrude out of the surface of the template, a through hole of the template pressing block is coaxial with the first thimble and the second thimble, and the front end of the second thimble stretches into the through hole to prop against the first thimble.
  8. 8. The mechanism of claim 7, further comprising a barrel penetrating into the third step hole of the fixed plate, the through hole of the ejector plate, and the through hole of the template pressing block, wherein the second ejector pin is arranged in the barrel with front and rear ends outside the barrel, The through hole of the template pressing block is a stepped hole, the front section is a first large-diameter hole, the middle section is a small-diameter hole, the rear section is a second large-diameter hole, the diameter of the first large-diameter hole is larger than that of the first thimble embryo head and serves as a clearance space, the diameter of the small-diameter hole is smaller than that of the first thimble embryo head and is matched with that of the front end of the second thimble, the diameter of the second large-diameter hole is matched with the outer diameter of the ejector sleeve, and the wall of the rear port hole of the second large-diameter hole is chamfered.
  9. 9. The dual ejector pin tandem pressure collecting mechanism of claim 8, wherein the diameter of the third stepped hole of the die fixing plate is slightly larger than the outer diameter of the ejector sleeve.
  10. 10. The dual-ejector pin serial pressure acquisition mechanism of the die of claim 9, wherein the fixed plate pressing block is fixed in the third stepped hole of the fixed plate through a screw, and the diameter of the screw hole of the fixed plate pressing block is larger than the outer diameter of the screw.

Description

Mould double-thimble series pressure acquisition mechanism Technical Field The invention belongs to the field of die pressure acquisition devices, and particularly relates to a die double-ejector pin series pressure acquisition mechanism. Background When the pressure sensor is installed, the main flow in-mold signal acquisition system manufacturer generally selects direct installation, namely the sensor directly goes deep into a mold cavity, or indirect installation, namely installation after a thimble, generally installs the pressure sensor below the existing thimble embryo, or additionally adds a false thimble, and places the pressure sensor below the false thimble embryo to acquire pressure transmitted by the thimble. The pressure sensor is installed in the die, and when the pressure sensor needs to be removed, replaced and the like, the die is required to be disassembled to complete the work. The demolding work is time-consuming and labor-consuming and is not easy to operate. As shown in fig. 1, there are two main methods for adding an indirect die cavity pressure sensor to the existing die. Firstly, install pressure sensor below current thimble, pressure acquisition module 9 or repeater are installed on thimble board 6, and the sensor cable is connected to pressure acquisition module 9 or repeater through the cable groove on the thimble board 6. Secondly, the pressure sensor 3 is arranged on the inner side of the template 43, the injection molding pressure is transmitted to the pressure sensor 3 by adding a false ejector pin penetrating into a die cavity formed by the die core 44, and the bottom of the pressure sensor 3 is fixedly supported by the pressing block 10. After the pressure sensor 3 is additionally arranged in the die design, data of each die test and production of the die are required to be collected. And the die is often integrally processed before leaving the factory. As a precision measurement part, the whole (water and oil soaking) process often affects the pressure sensor and the collection system, reducing its service life or causing damage, so the sensor and other electronic modules installed inside the die should be removed before the whole process is performed. However, in both the two mounting modes, the pressure sensor 3 is mounted inside the mold, and if the pressure sensor needs to be disassembled and replaced, the mold must be disassembled for operation, so that a great deal of labor is consumed, and waste is generated. The present invention has been made in view of this. Disclosure of Invention The invention aims to solve the technical problem of overcoming the defects in the prior art and providing a die double-thimble series pressure acquisition mechanism which can reduce manpower and material resources consumed by disassembling and assembling a pressure sensor. In order to solve the technical problems, the invention adopts the basic conception of the technical scheme that: a die double-ejector pin tandem pressure acquisition mechanism, comprising: A first ejector pin, the front part of which extends into the template and the die core of the die, The second thimble is coaxially arranged behind the first thimble and can mutually prop against the first thimble, the rear part of the second thimble is arranged on the fixed plate of the die, The pressure sensor is arranged behind the second ejector pin and can mutually prop against the second ejector pin, is positioned at one end of the die fixing plate far away from the die core, and is limited in the die fixing plate through the fixing plate pressing block. Further, the rear part of the first thimble is arranged in the thimble plate. Further, the front part of the second thimble stretches into the thimble plate. Further, the ejector plate comprises a front ejector plate and a rear ejector plate which are fixed in an overlapping manner, a first stepped hole is formed in the front ejector plate for placing a first ejector pin, and the depth of a large-diameter hole at the rear section of the first stepped hole is larger than the length of a first ejector pin embryo; the rear thimble plate is provided with a second stepped hole, the diameter of a large-diameter hole of the front section of the second stepped hole is larger than that of the first thimble embryo head, the diameter of a small-diameter hole of the second stepped Kong Jiexu is smaller than that of the first thimble embryo head but larger than that of the second thimble, and the front part of the second thimble stretches into the second stepped hole. Further, the wall of the rear port hole of the second stepped hole of the rear ejector plate is chamfered. Further, the fixed plate of the die is provided with a third stepped hole, the rear part of the second thimble is arranged in the third stepped hole, and the depth of a hole for placing the second thimble embryo head in the third stepped hole is larger than the length of the second thimble embryo head. Further, the re