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CN-122016430-A - Large-size resin material physical property test sample for semiconductor packaging and manufacturing method thereof

CN122016430ACN 122016430 ACN122016430 ACN 122016430ACN-122016430-A

Abstract

The invention relates to a large-size resin material physical property test sample for semiconductor packaging and a manufacturing method thereof, belongs to the field of semiconductor materials, and solves at least one of the problems of high sample preparation cost, poor surface flatness, difficult control of dimensional accuracy, insufficient process adaptability, low yield and the like of the large-size resin material physical property test sample in the prior art. A manufacturing method of a large-size resin material physical property test sample for semiconductor packaging comprises the following steps of providing a double-sided copper-clad plate, forming a through groove for accommodating a target sample array on the double-sided copper-clad plate, filling a resin material to be tested into the through groove to obtain a filled composite structure, performing pre-forming treatment, pressing and curing, and milling the large-size resin material physical property test sample in a machining mode. The invention reduces sample preparation cost, improves surface evenness and dimensional control precision, has good process adaptability, and realizes yield improvement.

Inventors

  • YU ZHONGYAO
  • YANG FANG

Assignees

  • 中国科学院微电子研究所

Dates

Publication Date
20260512
Application Date
20260212

Claims (10)

  1. 1. A method for manufacturing a physical property test sample of a large-sized resin material for semiconductor packaging, comprising the steps of: S1, providing a double-sided copper-clad plate, wherein the thickness of the double-sided copper-clad plate is consistent with the thickness of a target sample, and a through groove for accommodating one or more target sample arrays is formed in the double-sided copper-clad plate, the width of the through groove is larger than the outer edge of the target sample, and the length of the through groove is smaller than the length of the double-sided copper-clad plate; carrying out surface roughening treatment on the groove wall of the through groove; After the surface roughening treatment, a core plate provided with through grooves with roughened groove walls is obtained; S2, filling a resin material to be detected into the through groove, and enabling the thickness of the filled resin to be not smaller than that of the core plate to obtain a filled composite structure; S3, performing preforming treatment on the filled composite structure; s4, placing the preformed composite structure in a laminating machine, and adopting a mirror surface steel plate to perform lamination and solidification in a vacuum environment, so that the resin material to be tested is completely solidified, and the upper surface and the lower surface of the resin material in the through groove are level with the surface of the core plate; S5, milling out a required large-size resin material physical property test sample with a specific shape and size for semiconductor packaging from the cured resin structure in the through groove of the core plate in a machining mode.
  2. 2. The manufacturing method according to claim 1, wherein in step S2, the resin material to be measured is a dry film type resin in a semi-cured state; the filling step comprises the following steps: cutting the dry film type resin into an inner resin sheet and an outer resin sheet; wherein the outline dimension of the inner resin sheet in any direction parallel to the surface of the core plate Distance between inner walls of the through groove And the outline dimension of the outer resin sheet The following relationships are satisfied: ; Wherein, the Is the unilateral difference value of the distance between the outline size of the inner resin sheet and the inner wall of the through groove; and at least one outer resin sheet is used as a bottom layer group to cover and attach to the bottom opening of the through groove, an inner resin sheet group formed by at least one inner resin sheet is stacked on the bottom layer group, and at least one outer resin sheet is stacked on the inner resin sheet group as a top layer group, so that the total thickness of the stacked resin is more than or equal to the thickness of the core plate.
  3. 3. The method of manufacturing a ceramic panel according to claim 2, wherein the distance between inner walls of the through-grooves is in any direction parallel to the surface of the core plate And the outline dimension of the outer resin sheet The following relationships are satisfied: ; Wherein, the The single side exceeding amount of the outline of the outer resin sheet relative to the inner wall of the through groove is obtained.
  4. 4. The manufacturing method according to claim 2, characterized in that: The thickness of all the inner resin sheets is equal; the number N of the inner resin sheets in the inner resin sheet group is determined according to the following formula: ; Wherein, the Representing an upward rounding operation, T being the thickness of the core plate, Is the thickness of the single inner resin sheet.
  5. 5. The manufacturing method according to claim 4, wherein: thickness of the outer resin sheet The thickness T of the core plate is as follows: And/or, Thickness of the inner resin sheet The thickness T of the core plate is as follows: 。
  6. 6. The method of manufacturing a semiconductor device according to claim 2, wherein the resin material to be measured is a dry film resin in a semi-cured state, and the preforming in step S3 is a low-temperature vacuum press molding process performed on the filled composite structure in a vacuum film press, wherein the temperature of the low-temperature vacuum press molding process is 100-120 ℃.
  7. 7. The manufacturing method according to claim 1, wherein in step S2, the resin material to be measured is a liquid resin paste; the filling step comprises the following steps: attaching a high-temperature-resistant temporary bonding adhesive film to the bottom opening of the through groove so as to seal the through groove into a containing cavity; and injecting the liquid resin slurry into the accommodating cavity by adopting a vacuum screen printer.
  8. 8. The method according to claim 7, wherein the preforming process in step S3 includes low-temperature baking the liquid resin paste injected into the accommodating chamber to a degree of solidification of 40 to 60% and to form a semi-solidified state.
  9. 9. The method according to claim 1, wherein, In the step S4, the pressing and curing are carried out in a laminating machine according to the following process conditions: (a) The vacuum lamination stage comprises the steps of firstly keeping the temperature of 110-130 ℃ and the pressure of 1.0-3.0 MPa for 30-60min under the environment that the vacuum degree is lower than 100-1000 Pa; (b) And in the curing stage, in the environment with the vacuum degree lower than 100-1000Pa, heating to the curing temperature of the resin material to be tested, and keeping the temperature at the pressure of 1.0-3.0 MPa for 60-100min.
  10. 10. A large-size resin material physical property test sample for semiconductor packaging, characterized in that the large-size resin material physical property test sample is obtained by the manufacturing method according to any one of claims 1 to 9.

Description

Large-size resin material physical property test sample for semiconductor packaging and manufacturing method thereof Technical Field The invention relates to the technical field of semiconductor materials, in particular to a large-size resin material physical property test sample for semiconductor packaging and a manufacturing method thereof. Background In the field of semiconductor packaging, physical property testing of resin materials generally requires that the materials be manufactured in specific shapes and sizes. For example, measuring the permeability of an organic magnetic resin requires preparing an annular standard sample. While evaluating critical properties such as Coefficient of Thermal Expansion (CTE), young's modulus, etc. of thin film materials such as ABF, PI, etc., the industry generally tends to employ more data-reliable expansion methods. The swelling test requires that the film material be prepared as a slab sample. The sample size is relatively large, but the number required by single test is not large, and the cost is high if a special die is manufactured by adopting the traditional injection molding process. In addition, the resin to be measured has various forms, including a dry film type magnetic film in a semi-solidified state and liquid resin slurry, and further increases the complexity of standardized sample preparation. At present, the non-mould sample preparation mode commonly adopted in the industry mainly comprises a traditional pouring method of pouring liquid resin after a core plate is perforated and a prepreg lamination method aiming at dry film type resin. However, both of these methods have significant drawbacks. The casting method is easily affected by surface tension and gravity in the curing process, so that the surface of the sample is uneven and the thickness is uneven, and internal bubbles are difficult to remove. The lamination thickness and the packing compactness of the prepreg are difficult to accurately control by the prepreg lamination rule, resin is easy to shift or deform in the lamination process, and the consistency of a final sample is poor and the yield is low. Therefore, how to prepare a large-size resin material physical property test sample for the semiconductor field with high efficiency, low cost and high precision has long been a technical problem which plagues the industry. Disclosure of Invention In view of the above analysis, the present invention aims to provide a large-size resin material physical property test sample for semiconductor packaging and a manufacturing method thereof, which are used for solving at least one of the problems of high sample manufacturing cost, poor surface flatness, difficult control of dimensional accuracy, insufficient process adaptability, low yield and the like of the large-size resin material physical property test sample in the prior art. The invention aims at realizing the following technical scheme: The invention provides a manufacturing method of a large-size resin material physical property test sample for semiconductor packaging, which comprises the following steps: S1, providing a double-sided copper-clad plate, wherein the thickness of the double-sided copper-clad plate is consistent with the thickness of a target sample, and a through groove for accommodating one or more target sample arrays is formed in the double-sided copper-clad plate, the width of the through groove is larger than the outer edge of the target sample, and the length of the through groove is smaller than the length of the double-sided copper-clad plate; carrying out surface roughening treatment on the groove wall of the through groove; After the surface roughening treatment, a core plate provided with through grooves with roughened groove walls is obtained; S2, filling a resin material to be detected into the through groove, and enabling the thickness of the filled resin to be not smaller than that of the core plate to obtain a filled composite structure; S3, performing preforming treatment on the filled composite structure; s4, placing the preformed composite structure in a laminating machine, and adopting a mirror surface steel plate to perform lamination and solidification in a vacuum environment, so that the resin material to be tested is completely solidified, and the upper surface and the lower surface of the resin material in the through groove are level with the surface of the core plate; S5, milling out a required large-size resin material physical property test sample with a specific shape and size for semiconductor packaging from the cured resin structure in the through groove of the core plate in a machining mode. Further, in step S2, the resin material to be measured is a dry film type resin in a semi-cured state; the filling step comprises the following steps: cutting the dry film type resin into an inner resin sheet and an outer resin sheet; wherein the outline dimension of the inner resin sheet in any direction pa