CN-122016836-A - Optical waveguide wafer surface detection device
Abstract
The invention relates to the technical field of wafer surface detection, in particular to an optical waveguide wafer surface detection device which comprises a mounting base, a first electric control conveyor belt and a second electric control conveyor belt, wherein an electric control center column is mounted at the center position of the upper end of the mounting base, an electric control bottom side adjusting disk is movably mounted on the upper surface of the mounting base, and a lateral optical detection module is mounted at the top end of the electric control center column through a detachable lateral support. According to the invention, through the cooperation of the electric control type bottom side adjusting disk and the electric control type assembly control frame, the multi-angle and multi-position adjustment of the optical waveguide wafer can be realized, and the comprehensive detection of the wafer surface can be realized through cooperation with the lateral optical detection module, so that the problem that the detection of a single detection mode is incomplete is solved.
Inventors
- PAN XIANGCHENG
- YAN XUEFEI
Assignees
- 常州市好利莱光电科技有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20260415
Claims (8)
- 1. The optical waveguide wafer surface detection device comprises a mounting base (1), a first electric control conveying belt (2) and a second electric control conveying belt (3), and is characterized in that an electric control center column (4) is arranged at the center of the upper end of the mounting base (1), an electric control bottom side adjusting disc (5) is movably assembled on the upper surface of the mounting base (1), a lateral optical detection module (7) is arranged at the top end of the electric control center column (4) through a detachable lateral support (6), and an electric control assembly control frame (8) is hinged to the upper end of the electric control bottom side adjusting disc (5), and an embedded annular guide rail (9) is fixedly arranged on the upper surface of the mounting base (1); The electric control type bottom side adjusting disc (5) comprises a bottom surface adjusting ring (10) which is inserted into the embedded annular guide rail (9) in a sliding manner, a supporting wheel (11) and a driving wheel (12) which are arranged in the bottom surface adjusting ring (10); the lateral optical detection module (7) comprises a top side assembly frame (13) of an n-shaped structure, which is fixed at the outer end of the detachable lateral support (6), a lateral installation seat (14) and an optical detection probe (15), wherein the lateral installation seat (14) is inserted into the opening at the lower end of the top side assembly frame (13), and the optical detection probe (15) is fixed on the lateral installation seat (14).
- 2. The optical waveguide wafer surface detection device according to claim 1, wherein the electric control center column (4) comprises a longitudinal fixing column (16) longitudinally fixed at the upper end of the mounting base (1), a middle lifting support rod (17) axially inserted into the longitudinal fixing column (16) and a longitudinal lifting column (18) axially sleeved outside the upper end of the longitudinal fixing column (16), and an end mounting seat (20) with a mounting slot (19) is fixed at the outer side of the top end of the longitudinal lifting column (18).
- 3. The optical waveguide wafer surface inspection apparatus according to claim 2, wherein the detachable side bracket (6) is fixedly assembled with the end mounting base (20) by inserting the mounting buckle (21) of the assembly section into the mounting slot (19).
- 4. The optical waveguide wafer surface detection device according to claim 1, wherein the upper surface of the bottom surface adjusting ring (10) is provided with a plurality of surface assembling frames (22) protruding upwards, and the electric control type assembling control frame (8) is movably assembled outside the surface assembling frames (22).
- 5. The optical waveguide wafer surface inspection apparatus as set forth in claim 4, wherein the electrically controlled assembly control frame (8) comprises a turnover control frame (23) hinged to the outer surface assembly frame (22), an inner adjusting stay bar (24) hinged to the inner surface assembly frame (22), arc-shaped clamping arms (25) hinged to both sides of the upper end of the turnover control frame (23), lateral control stay bars (26), lateral support wheels (27) movably mounted inside the arc-shaped clamping arms (25), and lateral driving wheels (28).
- 6. The optical waveguide wafer surface inspection apparatus as set forth in claim 5, wherein the arcuate clamping arm (25) has an arcuate limit groove (29) on its clamping surface.
- 7. The optical waveguide wafer surface inspection apparatus as set forth in claim 2, wherein the outside of the end mount (20) is equipped with an optical positioning module (30) by a detachable side bracket (6).
- 8. The optical waveguide wafer surface detection device according to claim 1, wherein the LED lamp (31) for light supplement illumination is fixedly arranged on the inner top surface of the top side assembly frame (13).
Description
Optical waveguide wafer surface detection device Technical Field The invention relates to the technical field of wafer surface detection, in particular to an optical waveguide wafer surface detection device. Background The optical waveguide wafer is a core carrier of an integrated photon device, takes materials such as quartz and the like as a substrate, forms an optical waveguide structure with a specific refractive index difference through a micro-nano processing technology, is a key basic component for realizing optical signal restraint, transmission and regulation, is widely applied to the fields of optical communication, AR/VR, optical sensing and the like, and directly determines the optical performance, reliability and yield of downstream devices in quality. In the optical waveguide wafer manufacturing process, the processes of photoetching, etching, polishing and the like are easy to cause various flaws such as particle pollution, scratches, step defects and the like on the surface, and the flaws can cause increase of optical signal transmission loss, waveform distortion and even device failure, so that surface detection is an indispensable quality control link in the wafer manufacturing process. The current mainstream detection mode mainly comprises optical microscopic imaging, confocal laser scanning, atomic force microscope detection and the like. The optical microscopic imaging can rapidly realize large-view-field scanning and position obvious scratches and large-size particles, the laser confocal scanning can accurately measure structural characteristics such as surface grooves, steps and the like, and the atomic force microscope can detect nano-scale micro defects, but has the problem of low detection efficiency. The existing detection technology still has the obvious defects that a single detection mode is difficult to achieve both detection precision and efficiency, a high-resolution detection means has a small visual field and a long detection period, large-scale mass production requirements cannot be met, different detection equipment needs to be operated respectively, multi-dimensional comprehensive characterization of defects is difficult to achieve, missing detection and false detection are easy to occur, identification accuracy of fine defects such as nano-scale particle pollution and crystal structure distortion is not enough, accurate tracing of defect causes is difficult to achieve, further improvement of optical waveguide wafer quality is restricted, and therefore a high-efficiency, accurate and comprehensive surface detection technology is needed to solve the problems. Disclosure of Invention The invention aims to solve the technical problems that in the prior art, the surface detection efficiency of an optical waveguide wafer is low, the precision is insufficient, the detection is incomplete, and the optical waveguide wafer is difficult to adapt to large-scale mass production requirements. The technical scheme includes that the optical waveguide wafer surface detection device comprises a mounting base, a first electric control conveying belt and a second electric control conveying belt, an electric control center column is mounted at the center of the upper end of the mounting base, an electric control bottom side adjusting plate is movably mounted on the upper surface of the mounting base, a lateral optical detection module is mounted at the top end of the electric control center column through a detachable lateral support, an electric control assembly control frame is hinged to the upper end of the electric control bottom side adjusting plate, an embedded annular guide rail is fixedly mounted on the upper surface of the mounting base, the electric control bottom side adjusting plate comprises a bottom surface adjusting ring which is slidably inserted into the embedded annular guide rail, a supporting wheel and a driving wheel which are mounted in the bottom surface adjusting ring, and the lateral optical detection module comprises a top side assembly frame which is fixed at the outer end of the detachable lateral support and is in an n-shaped structure, a lateral mounting seat which is inserted into the opening at the lower end of the top side assembly frame, and an optical detection probe which is fixed on the lateral mounting seat. Further, for realizing the lift adjustment of automatically controlled type center post, the detection demand of adaptation not co-altitude, automatically controlled type center post is including vertically fixing at the vertical fixed column of installation base upper end, the centrally-mounted lift vaulting pole of axial cartridge in vertical fixed column is inside and the vertical lift post of axial suit in vertical fixed column upper end outside, and vertical lift post top is fixed with the tip mount pad that the outside has the installation slot. Further, for realizing the quick assembly and disassembly of the detachable side bracket, the deta