CN-122016894-A - Method for testing copper diffusion depth of aluminum alloy coated aluminum plate

Abstract

The application provides a method for testing copper diffusion depth of an aluminum alloy coated aluminum plate, which comprises the following steps of preprocessing the aluminum alloy coated aluminum plate; and (3) performing line scanning on the pretreated aluminum alloy coated aluminum plate by using an energy spectrometer, and obtaining the copper diffusion depth of the aluminum alloy coated aluminum plate according to the obtained Cu element curve. According to the testing method provided by the application, the concentration distribution gradient of Cu element in the coating layer of the aluminum alloy coated aluminum plate is reflected by utilizing the line scanning of the energy spectrometer, so that the influence caused by test operations such as etching and the like is avoided.

Inventors

• YUAN SHENG
• TANG ZONGYUAN
• XIN RONG
• LI ZHENGLONG
• GENG ZHI
• LIU KUN

Assignees

• 西南铝业（集团）有限责任公司

Dates

Publication Date

20260512

Application Date

20260123

Claims (10)

1. 1. A method for testing copper diffusion depth of an aluminum alloy clad aluminum plate comprises the following steps: Pretreating an aluminum alloy coated aluminum plate; and (3) performing line scanning on the pretreated aluminum alloy coated aluminum plate by using an energy spectrometer, and obtaining the copper diffusion depth of the aluminum alloy coated aluminum plate according to the obtained Cu element curve.
2. 2. The method according to claim 1, wherein the pretreatment is specifically mechanical polishing of the surface of the aluminum alloy clad aluminum plate.
3. 3. The test method according to claim 1, wherein the line scan voltage of the spectrometer is 5-30 kv.
4. 4. The test method according to claim 1 or 3, wherein the line scan voltage of the spectrometer is 10-20 kv.
5. 5. The testing method according to claim 1, wherein the working distance between the spectrometer and the aluminum alloy clad aluminum plate is 5-15 mm.
6. 6. The testing method according to claim 1 or 5, wherein the working distance between the spectrometer and the aluminum alloy clad aluminum plate is 8-10 mm.
7. 7. The method according to claim 1, wherein the line scan time of the spectrometer is not less than 100s.
8. 8. The test method according to claim 1 or 7, wherein the line scanning time of the spectrometer is 100-150 s.
9. 9. The method according to claim 1, wherein the base material of the aluminum alloy clad aluminum plate is a 2-series aluminum alloy, and the clad layer is a pure aluminum layer.
10. 10. The method of claim 9, wherein the substrate of the aluminum alloy clad aluminum sheet is 2024-T42 aluminum alloy or 2024-T62 aluminum alloy.

Description

Method for testing copper diffusion depth of aluminum alloy coated aluminum plate Technical Field The invention relates to the technical field of aluminum alloy, in particular to a method for testing copper diffusion depth of an aluminum alloy clad aluminum plate. Background The aluminum alloy clad aluminum plate is a clad plate with pure aluminum clad on the surface based on an alloyed aluminum material, wherein the alloyed aluminum material comprises copper element and is mainly made of 2xxx series aluminum alloy. In the high-temperature heat treatment process of the aluminum alloy coated aluminum plate, cu element diffuses and moves towards the pure aluminum direction of the coating layer under the double influence of element concentration difference and high temperature, so that a copper diffusion phenomenon is formed. At present, a testing method of copper diffusion depth of a coating layer in an aluminum alloy coated aluminum plate is a metallographic method, and a grain boundary where copper diffusion occurs is exposed by etching the aluminum alloy coating layer so as to represent the copper diffusion depth, but the copper diffusion exposure is insufficient or the original grain boundary of the coating layer is etched due to the change of etching conditions, so that an inaccurate copper diffusion testing result can be caused. Therefore, the detection method capable of accurately reflecting the diffusion depth of the cladding copper in the aluminum alloy clad aluminum plate has important significance. Disclosure of Invention The invention solves the technical problem of providing a test method for the copper diffusion depth of an aluminum alloy coated aluminum plate, which can accurately detect the copper diffusion depth of the aluminum alloy coated aluminum plate. In view of the above, the application provides a method for testing copper diffusion depth of an aluminum alloy clad aluminum plate, which comprises the following steps: Pretreating an aluminum alloy coated aluminum plate; and (3) performing line scanning on the pretreated aluminum alloy coated aluminum plate by using an energy spectrometer, and obtaining the copper diffusion depth of the aluminum alloy coated aluminum plate according to the obtained Cu element curve. In some embodiments, the pretreatment is specifically mechanical polishing of the surface of the aluminum alloy clad aluminum sheet. In some embodiments, the line scanning voltage of the spectrometer is 5-30 kv. In some embodiments, the line scanning voltage of the energy spectrometer is 10-20 kV. In some embodiments, the working distance between the energy spectrometer and the aluminum alloy clad aluminum plate is 5-15 mm. In some embodiments, the working distance between the energy spectrometer and the aluminum alloy clad aluminum plate is 8-10 mm. In some embodiments, the line scan time of the spectrometer is greater than or equal to 100 seconds. In some embodiments, the line scan time of the spectrometer is 100-150 s. In some embodiments, the substrate of the aluminum alloy clad aluminum sheet is a 2-series aluminum alloy, and the cladding layer is a pure aluminum layer. In some embodiments, the substrate of the aluminum alloy clad aluminum sheet is 2024-T42 aluminum alloy or 2024-T62 aluminum alloy. The application provides a test method of copper diffusion depth of an aluminum alloy coated aluminum plate, which comprises the steps of firstly preprocessing the aluminum alloy coated aluminum plate to ensure that the surface of the aluminum alloy coated aluminum plate is clean and clean in structure, preparing for line scanning analysis of an energy spectrometer, then carrying out line scanning on the preprocessed aluminum alloy coated aluminum plate by adopting the energy spectrometer, obtaining the copper diffusion depth of the aluminum alloy coated aluminum plate according to concentration change of Cu element, carrying out line scanning on a coating layer of the aluminum alloy coated aluminum plate by utilizing the energy spectrometer, carrying out Cu element analysis on an electron beam along the direction from an aluminum alloy substrate to the coating layer, and further representing the relative change of the concentration of Cu element by line scanning the fluctuation of a Cu element curve, so as to reflect the copper diffusion depth. Drawings FIG. 1 is an electronic image of an aluminum alloy clad aluminum sheet tested by an energy spectrometer of example 1 of the present invention; FIG. 2 is a metallographic photograph of an aluminum alloy clad aluminum sheet tested by the metallographic method of comparative example 1 of the present invention; FIG. 3 is an electronic image of an aluminum alloy clad aluminum sheet tested by an energy spectrometer of example 2 of the present invention; fig. 4 is a metallographic photograph of an aluminum alloy clad aluminum sheet tested by the metallographic method of comparative example 2 of the present invention. Detailed Descrip