CN-122016922-A - Thermal conductivity measurement system and measurement method

CN122016922ACN 122016922 ACN122016922 ACN 122016922ACN-122016922-A

Abstract

The application discloses a thermal conductivity measurement system and a thermal conductivity measurement method. The system comprises a sample to be detected, a heating unit, an infrared imaging unit and a data processing terminal, wherein a closed cavity is arranged in the sample to be detected, liquid metal is filled in the closed cavity, the sample to be detected is connected with the heating unit, the heating unit is connected with the data processing terminal, the data processing terminal is connected with the infrared imaging unit, the heating unit is used for heating the sample to be detected, the infrared imaging unit is used for collecting a thermal form image of the sample to be detected and transmitting the thermal form image to the data processing terminal, and the data processing terminal is used for reading electric power data of the heating unit and determining heat conductivity of the sample to be detected according to the electric power data and the thermal form image. The method at least solves the technical problem that the thermal conductivity measurement system in the related technology can only measure the thermal conductivity, so that the thermal morphology image in the sample to be measured is lost.

Inventors

WANG ZHENYU
LI QIAN
XIONG GUANGYU

Assignees

北京大学

Dates

Publication Date: 20260512
Application Date: 20260213

Claims (10)

1. A thermal conductivity measurement system, comprising: The device comprises a sample to be tested, a heating unit, an infrared imaging unit and a data processing terminal, wherein a closed cavity is arranged in the sample to be tested, liquid metal is filled in the closed cavity, the sample to be tested is connected with the heating unit, the heating unit is connected with the data processing terminal, and the data processing terminal is connected with the infrared imaging unit; The heating unit is used for heating the sample to be detected; The infrared imaging unit is used for collecting a thermal form image of the sample to be detected and transmitting the thermal form image to the data processing terminal; the data processing terminal is used for reading the electric power data of the heating unit and determining the heat conductivity of the sample to be detected according to the electric power data and the thermal morphology image.
2. The system of claim 1, wherein the heating unit comprises: the heating piece is connected with the direct-current voltage-stabilizing power supply; The direct-current stabilized power supply is used for providing voltage for the heating plate; And the heating piece is used for heating the sample to be measured until the temperature difference between two measuring points in the sample to be measured reaches a steady state.
3. The system of claim 2, wherein the infrared imaging unit comprises a medium wave thermal infrared imager, wherein an optical axis of the medium wave thermal infrared imager is opposite to a middle region of the sample to be measured.
4. The system of claim 1, wherein the sample to be tested comprises: And the silicon-based adapter plate.
5. The system of claim 1, wherein the data processing terminal is further configured to obtain an output power of the dc regulated power supply and a cross-sectional area of the sample to be measured when a distance between two measurement points in the sample to be measured and a temperature difference between the two measurement points in the sample to be measured reach a steady state; The data processing terminal is also used for acquiring a temperature difference value when the temperature difference between two measurement points of the sample to be measured reaches a steady state from the thermal form image.
6. The system of claim 1, wherein the data processing terminal is further configured to determine the thermal conductivity of the sample to be measured based on a distance between two measurement points in the sample to be measured, an output power of the dc regulated power supply when a temperature difference between the two measurement points in the sample to be measured reaches a steady state, and a temperature difference value when a cross-sectional area of the sample to be measured and a temperature difference between the two measurement points in the sample to be measured reach a steady state.
7. The system of claim 2, wherein the dc regulated power supply is further configured to output different voltages to the heater chip, wherein the different voltages are used to determine the thermal conductivity of the sample under test at the different voltages.
8. A method of measuring thermal conductivity, comprising: Acquiring multidimensional data of a sample to be measured, wherein the multidimensional data at least comprises power data of a direct-current stabilized power supply in a thermal conductivity measurement system and a thermal morphology image of the sample to be measured, wherein a closed cavity is arranged in the sample to be measured, and liquid metal is filled in the closed cavity; And determining the thermal conductivity of the sample to be tested according to the multidimensional data of the sample to be tested.
9. The method of claim 8, wherein determining the thermal conductivity of the sample to be measured from the multi-dimensional data of the sample to be measured comprises: acquiring a distance between two measuring points in the sample to be measured, a cross-sectional area of the sample to be measured, the electric power data and the thermal form image, wherein the electric power data comprises output power of a direct current stabilized power supply when a temperature difference between the two measuring points in the sample to be measured reaches a steady state; extracting a temperature difference value when the temperature difference between two measurement points in the sample to be detected reaches a steady state from the thermal form image; And determining the thermal conductivity of the sample to be measured according to the distance between the two measuring points, the output power of the direct current stabilized power supply when the temperature difference between the two measuring points in the sample to be measured reaches a steady state, and the cross-sectional area of the sample to be measured and the temperature difference value when the temperature difference between the two measuring points in the sample to be measured reaches the steady state.
10. A method of embedding liquid metal into a silicon-based interposer, comprising: Heating a liquid metal to a target temperature, wherein the target temperature is above a melting point temperature of the liquid metal; Filling the liquid metal with the target temperature into a closed cavity in a base adapter plate until the filling rate of the liquid metal in the closed cavity reaches a preset value; And sealing the filling and sealing opening of the base adapter plate by adopting a low-temperature ceramic adhesive.

Description

Thermal conductivity measurement system and measurement method Technical Field The application relates to the technical field of industrial automation control, in particular to a thermal conductivity measurement system and a thermal conductivity measurement method. Background With the continuous increase of the power density of microelectronic devices, liquid metal becomes an advanced heat dissipation medium with great prospect due to its excellent heat conducting property. Particularly, the liquid metal is embedded in the silicon-based microcavity structure, so that the high-efficiency thermal management of local hot spots can be realized. However, current performance research on this composite structure is faced with fundamental technical bottlenecks. Firstly, the opacity of the silicon material in the visible light and near infrared bands makes the traditional optical observation means unable to directly peep into the closed cavity, resulting in limited thermal morphology analysis. The existing method is dependent on destructive off-line disassembly or adopts transparent materials with different thermophysical properties to carry out substitution experiments, so that the dynamic thermal morphology of the liquid metal under the actual silicon-based working condition is difficult to truly reflect. Meanwhile, the existing heat conductivity measurement method is mostly dependent on an external temperature sensor or indirectly calculated, for example, a contact type temperature measurement probe can interfere an internal thermal field and a flow field, a significant error is introduced, the real heat conduction characteristic of liquid metal in a closed cavity can not be obtained, and the measurement accuracy is low. The liquid metal sealed in the microcavity cannot be subjected to in-situ and real-time thermophysical characterization. The prior art systems suffer from serious "system separation" problems. The thermal morphology observation of the liquid metal and the thermal physical property measurement of the embedded liquid metal adapter plate are generally divided into two independent processes, and the two independent processes are completed by means of different equipment. The separation causes the defects of complex operation, asynchronous data, high cost and the like, and more importantly, the method prevents researchers from directly relating the observed dynamic thermal phenomenon with the measured thermal conductivity data under the same working condition at the same time, so that the inherent thermal transport mechanism of the researchers is difficult to deeply reveal. Although single crystal silicon is known to have transmission characteristics in the mid-infrared band (3-5 μm), the prior art fails to make effective use of this physical characteristic, developing an integrated system that can simultaneously achieve in-situ visualization of intra-cavity thermal morphology and accurate measurement of thermal conductivity. The technical dead zone severely restricts the research and development process of the high-performance embedded liquid metal adapter plate. Disclosure of Invention The embodiment of the application provides a thermal conductivity measuring system and a thermal conductivity measuring method, which at least solve the technical problem that a thermal conductivity measuring system in the related technology can only measure thermal conductivity to cause missing of a thermal morphology image in a sample to be measured. According to one aspect of the embodiment of the application, a thermal conductivity measurement system is provided, which comprises a sample to be measured, a heating unit, an infrared imaging unit and a data processing terminal, wherein a closed cavity is arranged in the sample to be measured, liquid metal is filled in the closed cavity, the sample to be measured is connected with the heating unit, the heating unit is connected with the data processing terminal, the data processing terminal is connected with the infrared imaging unit, the heating unit is used for heating the sample to be measured, the infrared imaging unit is used for collecting a thermal form image of the sample to be measured and transmitting the thermal form image to the data processing terminal, and the data processing terminal is used for reading electric power data of the heating unit and determining thermal conductivity of the sample to be measured according to the electric power data and the thermal form image. The heating unit comprises a heating plate and a direct current stabilized power supply, wherein the heating plate is connected with the direct current stabilized power supply, the direct current stabilized power supply is used for providing voltage for the heating plate, and the heating plate is used for heating the sample to be measured until the temperature difference between two measuring points in the sample to be measured reaches a steady state. Optionally, the infrared imaging un