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CN-122016932-A - Appearance detection equipment for chip production

CN122016932ACN 122016932 ACN122016932 ACN 122016932ACN-122016932-A

Abstract

The application relates to the technical field of chip detection, in particular to appearance detection equipment for chip production. The method comprises the steps of collecting infrared images and chip information of different target chips through a collecting assembly, inputting all collected data information into a detecting assembly, finishing preprocessing of the infrared images through the detecting assembly to obtain a plurality of preprocessed images, extracting a detecting area of each target chip based on the preprocessed images, calculating infrared temperature values corresponding to unit pixel points of the target chips according to the detecting areas, creating an integrity index of the target chips, analyzing appearance integrity of the real-time chips according to the integrity index of the target chips, and screening abnormal chips with unqualified appearance integrity.

Inventors

  • Cheng Xibo

Assignees

  • 苏州尚准电子科技有限公司

Dates

Publication Date
20260512
Application Date
20260323

Claims (10)

  1. 1. Appearance detection equipment for chip production, characterized by comprising: The infrared image acquisition module is used for acquiring infrared images and chip information of a plurality of target chips; The detection assembly is in communication connection with the acquisition assembly, all the infrared images acquired by the acquisition assembly are input into the detection assembly, and the following detection steps are executed through the detection assembly: preprocessing all the infrared images to obtain a plurality of preprocessed images; extracting a detection area of each target chip based on the preprocessed image; calculating an infrared temperature value corresponding to a unit pixel point of the target chip by combining the detection area, and creating an integrity index of the target chip; and analyzing the appearance integrity of the real-time chip based on the integrity index of the target chip, and screening out abnormal chips with unqualified appearance integrity.
  2. 2. The apparatus according to claim 1, wherein the acquisition module includes a chip acquisition module through which an infrared image of the target chip is acquired, and an image acquisition module through which chip information of the target chip is acquired.
  3. 3. The apparatus according to claim 2, wherein the inspection module includes a preprocessing module through which preprocessing of the infrared image is completed, and an inspection area is extracted, and the inspection module through which the appearance integrity judgment of the target chip is completed based on the inspection area.
  4. 4. The apparatus according to claim 3, wherein the preprocessing of all the infrared images to obtain a plurality of preprocessed images comprises: Randomly selecting one infrared image from all the infrared images; carrying out Gaussian filtering processing on the infrared image to obtain a Gaussian filtered image; performing histogram equalization processing on the Gaussian filtered image to obtain a preprocessed image; and randomly selecting one infrared image from all the infrared images until all the infrared images are selected, and obtaining a plurality of preprocessed images.
  5. 5. The apparatus for detecting an appearance for chip production according to claim 4, wherein extracting the detection area of each target chip based on the preprocessed image comprises: Selecting a preprocessed image; normalizing the preprocessed image to obtain a normalized image; Performing Sobel edge operator detection on the normalized image to obtain edge pixel points of the target chip; Sequentially connecting a plurality of edge pixel points to obtain a detection area of a target chip; And returning to select one preprocessed image until all the preprocessed images are selected, and obtaining a detection area of each target chip.
  6. 6. The apparatus according to claim 5, wherein calculating the infrared temperature value corresponding to the unit pixel point of the target chip in combination with the detection area and creating the integrity index of the target chip comprises: selecting a target chip and acquiring a detection area of the target chip; calculating a detection index of a detection area of the target chip; Establishing an integrity index of the target chip based on the detection index; And returning to select one target chip and acquiring a detection area of the target chip until all the target chips are selected to be completed, thereby obtaining the integrity index of each target chip.
  7. 7. The apparatus according to claim 6, wherein calculating the detection index of the detection area of the target chip comprises: counting the number of pixel points contained in a detection area of the target chip; acquiring infrared temperature of each observation point of the target chip; And calculating the standard infrared temperature of the unit pixel point by combining the infrared temperature of the target chip and the number of pixel points, wherein the standard infrared temperature of the unit pixel point is the detection index of the target chip.
  8. 8. The apparatus for appearance inspection for chip production according to claim 7, wherein establishing the integrity index of the target chip based on the total inspection index comprises: acquiring a detection index corresponding to each infrared image of the target chip; and calculating the average value of all the detection indexes, wherein the average value is the integrity index of the target chip.
  9. 9. The apparatus according to claim 8, wherein after the acquisition of the infrared image of the target chip is completed, thermal compensation of the infrared image based on the surface temperature of the target chip is required.
  10. 10. The apparatus according to claim 9, wherein the operating temperature range of the pick-up assembly is set to [ 33-36 degrees celsius ].

Description

Appearance detection equipment for chip production Technical Field The invention relates to the technical field of chip detection, in particular to appearance detection equipment for chip production. Background Chips (chips) are a way in electronics to miniaturize circuits (mainly including semiconductor devices, as well as passive components, etc.) and are often manufactured on semiconductor wafer surfaces. The integrated circuits fabricated on the surface of the semiconductor chip are also known as thin-film (thin-film) integrated circuits. Another thick-film integrated circuit (hybrid integrated circuit) is a miniaturized circuit composed of stand-alone semiconductor devices and passive components integrated into a substrate or wiring board. The Chinese patent with the publication number of CN119643585B discloses a chip defect detection system and method based on visual identification, wherein the system comprises the following steps of S10, carrying out partition treatment on the surface of an epitaxial wafer, wherein an inner area of each edge closed line in a grain boundary edge image corresponds to one partition, S20, predicting defect indexes of the partitions, S30, predicting resistivity uniformity of the partitions, and S40, screening the epitaxial wafer with defects. According to the invention, the production quality of the epitaxial wafer is evaluated through a plurality of physical characteristics of the epitaxial wafer, so that the defect detection precision of the system on the epitaxial wafer is further improved, but in the prior art, fine judgment is difficult to carry out when infrared imaging is used, so that the judgment precision is insufficient, and the final detection result is easy to be wrong. Disclosure of Invention The invention aims to provide appearance detection equipment for chip production, which solves the problem of insufficient detection precision in the background technology. In order to solve the technical problems, one of the purposes of the present invention is to provide an appearance detection device for chip production, which comprises an acquisition component and a detection component, wherein the acquisition component is used for acquiring infrared images and chip information of a plurality of target chips, the detection component is in communication connection with the acquisition component, all infrared images acquired by the acquisition component are input into the detection component, and the detection component is used for executing the following detection steps: preprocessing all the infrared images to obtain a plurality of preprocessed images; extracting a detection area of each target chip based on the preprocessed image; calculating an infrared temperature value corresponding to a unit pixel point of the target chip by combining the detection area, and creating an integrity index of the target chip; and analyzing the appearance integrity of the real-time chip based on the integrity index of the target chip, and screening out abnormal chips with unqualified appearance integrity. Preferably, the acquisition component comprises a chip acquisition module and an image acquisition module, wherein the temperature acquisition module is used for acquiring an infrared image of the target chip, and the chip acquisition module is used for acquiring chip information of the target chip. Preferably, the detection assembly comprises a preprocessing module and a detection module, preprocessing of the infrared image is completed through the preprocessing module, a detection area is extracted, and appearance integrity judgment of the target chip is completed through the detection module based on the detection area. Preferably, all the infrared images are preprocessed to obtain a plurality of preprocessed images, including: Randomly selecting one infrared image from all the infrared images; carrying out Gaussian filtering processing on the infrared image to obtain a Gaussian filtered image; performing histogram equalization processing on the Gaussian filtered image to obtain a preprocessed image; and randomly selecting one infrared image from all the infrared images until all the infrared images are selected, and obtaining a plurality of preprocessed images. Preferably, extracting the detection region of each target chip based on the preprocessed image includes: Selecting a preprocessed image; normalizing the preprocessed image to obtain a normalized image; Performing Sobel edge operator detection on the normalized image to obtain edge pixel points of the target chip; Sequentially connecting a plurality of edge pixel points to obtain a detection area of a target chip; And returning to select one preprocessed image until all the preprocessed images are selected, and obtaining a detection area of each target chip. Preferably, calculating an infrared temperature value corresponding to a unit pixel point of a target chip in combination with the detection area, and creating an in