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CN-122016954-A - Biosensor and method for manufacturing same

CN122016954ACN 122016954 ACN122016954 ACN 122016954ACN-122016954-A

Abstract

The application provides a biosensor and a manufacturing method thereof. The biosensor comprises a bearing substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive penetrating layers, a plurality of second conductive penetrating layers, a plurality of first exposed electrodes and a plurality of second exposed electrodes. The plurality of first conductive penetrating layers pass through the second insulating layer. The plurality of second conductive penetrating layers pass through the second insulating layer. Each first exposed electrode is electrically connected to the corresponding first conductive penetrating layer. Each second exposed electrode is electrically connected to the corresponding second conductive penetrating layer. Therefore, the first exposed electrode can be electrically connected to the first conductive circuit layer through the corresponding first conductive penetrating layer and is separated from the first conductive circuit layer by a first preset distance, and the second exposed electrode can be electrically connected to the second conductive circuit layer through the corresponding second conductive penetrating layer and is separated from the second conductive circuit layer by a second preset distance.

Inventors

  • YUAN JUNJIE

Assignees

  • 向前生物科技股份有限公司

Dates

Publication Date
20260512
Application Date
20241112

Claims (10)

  1. 1. A biosensor is characterized in that, the biosensor includes: A carrier substrate; The first insulating layer is arranged on the bearing substrate; The first conductive circuit layer is arranged on the first insulating layer; the second conductive circuit layer is arranged on the first insulating layer; a second insulating layer disposed on the first insulating layer and partially covering the first conductive trace layer and the second conductive trace layer; a plurality of first conductive penetrating layers penetrating through the second insulating layer to be electrically connected to the first conductive trace layer; A plurality of second conductive penetrating layers penetrating through the second insulating layer to be electrically connected to the second conductive trace layer; a plurality of first exposed electrodes disposed on the second insulating layer, each of the first exposed electrodes electrically connected to the corresponding first conductive penetrating layer, and The second exposed electrodes are arranged on the second insulating layer, and each second exposed electrode is electrically connected with the corresponding second conductive penetrating layer; the first conductive circuit layer and the second conductive circuit layer are adjacent to each other and separated from each other, and the first conductive circuit layer and the second conductive circuit layer are matched with each other to form a finger-shaped electrode structure; The first conductive circuit layer comprises a first extension part and a plurality of first circuit parts extending from the first extension part, the second conductive circuit layer comprises a second extension part and a plurality of second circuit parts extending from the second extension part, and the plurality of first circuit parts of the first conductive circuit layer and the plurality of second circuit parts of the second conductive circuit layer are alternately arranged.
  2. 2. The biosensor of claim 1, wherein the sensor is configured to detect a presence of a target, The first circuit parts of the first conductive circuit layer are parallel to each other, and extend vertically or obliquely from the first extension part; the second circuit parts of the second conductive circuit layer are parallel to each other, and extend from the second extension part vertically or obliquely; wherein the first extension portion of the first conductive line layer and the second extension portion of the second conductive line layer are parallel to each other, and the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are parallel to each other; wherein the first conductive circuit layer and the second conductive circuit layer are matched with each other, to form a continuous serpentine gap between the first and second conductive trace layers; Wherein a first end and a second end of each first conductive penetrating layer are respectively and electrically contacted with the first conductive circuit layer and the corresponding first exposed electrode; wherein a first end and a second end of each second conductive penetrating layer are respectively and electrically contacted with the second conductive circuit layer and the corresponding second exposed electrode; the first conductive penetrating layers are divided into a plurality of first through hole arrays, and the first conductive penetrating layers of each first through hole array are electrically connected with the corresponding first circuit parts of the first conductive circuit layers; the first exposed electrodes are divided into a plurality of first electrode arrays, and the first exposed electrodes of each first electrode array are arranged above the corresponding first circuit part of the first conductive circuit layer and are respectively and electrically connected with the first conductive penetrating layers of the corresponding first through hole array; the second conductive penetrating layers are divided into a plurality of second through hole arrays, and the second conductive penetrating layers of each second through hole array are electrically connected with the corresponding second circuit parts of the second conductive circuit layers; The second exposed electrodes are divided into a plurality of second electrode arrays, and the second exposed electrodes of each second electrode array are arranged above the corresponding second circuit part of the second conductive circuit layer and are respectively and electrically connected with the second conductive penetrating layers of the corresponding second through hole array; wherein each first exposed electrode is configured to take a column shape, and each second exposed electrode is configured to take a strip shape; Wherein each first exposed electrode is electrically connected to a corresponding one or more of the first conductive penetration layers, and each second exposed electrode is electrically connected to a corresponding one or more of the second conductive penetration layers; Wherein the thickness of the first insulating layer is between To the point of Between the first insulating layer and the second insulating layer, and the thickness of the second insulating layer is between To the point of Between them; wherein the thickness of the first conductive circuit layer is between To the point of The thickness of the second conductive circuit layer is between To the point of And the width of the continuous serpentine gap is between 2000nm and 6000 nm; wherein the thickness of each first conductive penetrating layer is between To the point of The width of each first conductive penetrating layer is between 50nm and 200 nm; wherein the thickness of each second conductive penetrating layer is between To the point of The width of each second conductive penetrating layer is between 50nm and 200 nm; Wherein the thickness of each first exposed electrode is between To the point of The width of each first exposed electrode is between 100nm and 5000nm, and the distance between two adjacent first exposed electrodes is between 1000nm and 10000 nm; wherein the thickness of each second exposed electrode is between To the point of And each second exposed electrode has a width of 3000nm to 5000 nm.
  3. 3. The biosensor of claim 1, wherein the sensor is configured to detect a presence of a target, Wherein the carrier substrate is configured as a silicon wafer substrate, a gallium nitride substrate, a silicon carbide substrate, a silicon germanium substrate, a sapphire substrate or a glass substrate; wherein the first insulating layer is configured as a first oxide layer, a first nitride layer or a first oxynitride layer; Wherein the second insulating layer is configured as a second oxide layer, a second nitride layer or a first oxynitride layer; Wherein the first conductive line layer is configured as a first gold line layer made of gold, a first silver line layer made of silver, a first copper line layer made of copper, a first aluminum line layer made of aluminum, a first nickel line layer made of nickel, a first titanium line layer made of titanium, a first platinum line layer made of platinum, a first palladium line layer made of palladium, a first tantalum line layer made of tantalum, a first tungsten line layer made of tungsten, a first copper aluminum alloy line layer, a first copper aluminum silicon alloy line layer, a first tantalum nitride line layer, or a first titanium nitride line layer; Wherein the second conductive line layer is configured as a second gold line layer made of gold, a second silver line layer made of silver, a second copper line layer made of copper, a second aluminum line layer made of aluminum, a second nickel line layer made of nickel, a second titanium line layer made of titanium, a second platinum line layer made of platinum, a second palladium line layer made of palladium, a second tantalum line layer made of tantalum, a second tungsten line layer made of tungsten, a second copper aluminum alloy line layer, a second copper aluminum silicon alloy line layer, a second tantalum nitride line layer, or a second titanium nitride line layer; wherein each of the first conductive penetrating layers is configured as a first gold via made of gold, a first silver via made of silver, a first copper via made of copper, a first aluminum via made of aluminum, a first nickel via made of nickel, a first titanium via made of titanium, a first platinum via made of platinum, a first palladium via made of palladium, a first tantalum via made of tantalum, a first tungsten via made of tungsten, a first copper aluminum alloy via, a first copper aluminum silicon alloy via, a first tantalum nitride via or a first titanium nitride via; wherein each of the second conductive penetrating layers is configured as a second gold via made of gold, a second silver via made of silver, a second copper via made of copper, a second aluminum via made of aluminum, a second nickel via made of nickel, a second titanium via made of titanium, a second platinum via made of platinum, a second palladium via made of palladium, a second tantalum via made of tantalum, a second tungsten via made of tungsten, a second copper aluminum alloy via, a second copper aluminum silicon alloy via, a second tantalum nitride via, or a second titanium nitride via; wherein each of the first bare electrodes is configured as a working electrode, and each of the first bare electrodes is configured as a first gold electrode made of gold, a first silver electrode made of silver, a first copper electrode made of copper, a first aluminum electrode made of aluminum, a first nickel electrode made of nickel, a first titanium electrode made of titanium, a first platinum electrode made of platinum, a first palladium electrode made of palladium, a first tantalum electrode made of tantalum, a first tungsten electrode made of tungsten, a first copper-aluminum-silicon-alloy electrode, a first tantalum nitride electrode, or a first titanium nitride electrode; Wherein each of the second bare electrodes is configured as an auxiliary electrode, and each of the second bare electrodes is configured as a second gold electrode made of gold, a second silver electrode made of silver, a second copper electrode made of copper, a second aluminum electrode made of aluminum, a second nickel electrode made of nickel, a second titanium electrode made of titanium, a second platinum electrode made of platinum, a second palladium electrode made of palladium, a second tantalum electrode made of tantalum, a second tungsten electrode made of tungsten, a second copper-aluminum-silicon alloy electrode, a second tantalum nitride electrode, or a second titanium nitride electrode; the biosensor further comprises a third conductive circuit layer, a plurality of third conductive penetrating layers and a third exposed electrode, wherein the third conductive penetrating layers are electrically connected between the third conductive circuit layer and the third exposed electrode, and the third exposed electrode is configured to serve as a reference electrode.
  4. 4. A biosensor is characterized in that, the biosensor includes: A carrier substrate; The first insulating layer is arranged on the bearing substrate; The first conductive circuit layer is arranged on the first insulating layer; the second conductive circuit layer is arranged on the first insulating layer; a second insulating layer disposed on the first insulating layer and partially covering the first conductive trace layer and the second conductive trace layer; a plurality of first conductive penetrating layers penetrating through the second insulating layer to be electrically connected to the first conductive trace layer; A plurality of second conductive penetrating layers penetrating through the second insulating layer to be electrically connected to the second conductive trace layer; a plurality of first exposed electrodes disposed on the second insulating layer, each of the first exposed electrodes electrically connected to the corresponding first conductive penetrating layer, and The second exposed electrodes are arranged on the second insulating layer, and each second exposed electrode is electrically connected with the corresponding second conductive penetrating layer.
  5. 5. The biosensor according to claim 4, wherein, The first conductive circuit layer and the second conductive circuit layer are adjacent to each other and separated from each other, and the first conductive circuit layer and the second conductive circuit layer are matched with each other to form a finger-shaped electrode structure; the first conductive circuit layer and the second conductive circuit layer cooperate with each other to form a continuous serpentine gap between the first conductive circuit layer and the second conductive circuit layer.
  6. 6. The biosensor according to claim 4, wherein, Wherein each first bare electrode is configured to serve as a working electrode, and each second bare electrode is configured to serve as an auxiliary electrode; the biosensor further comprises a third conductive circuit layer, a plurality of third conductive penetrating layers and a third exposed electrode, wherein the third conductive penetrating layers are electrically connected between the third conductive circuit layer and the third exposed electrode, and the third exposed electrode is configured to serve as a reference electrode.
  7. 7. A manufacturing method of a biosensor is characterized in that, the manufacturing method of the biosensor comprises the following steps: Forming a first insulating layer on a carrier substrate; forming a first conductive circuit layer and a second conductive circuit layer on the first insulating layer; forming a second insulating layer on the first insulating layer to partially cover the first conductive circuit layer and the second conductive circuit layer; Forming a plurality of first conductive penetrating layers and a plurality of second conductive penetrating layers, wherein the first conductive penetrating layers penetrate through the second insulating layers to be electrically connected with the first conductive circuit layer, the second conductive penetrating layers penetrate through the second insulating layers to be electrically connected with the second conductive circuit layer, and Forming a plurality of first exposed electrodes and a plurality of second exposed electrodes, wherein the first exposed electrodes are arranged on the second insulating layer and are respectively and electrically connected with the first conductive penetrating layers, and the second exposed electrodes are arranged on the second insulating layer and are respectively and electrically connected with the second conductive penetrating layers.
  8. 8. The method for manufacturing a biosensor according to claim 7, wherein, After the steps of forming the plurality of first exposed electrodes and the plurality of second exposed electrodes, the method for manufacturing the biosensor further comprises a step of executing a cleaning step to clean a biosensor manufactured by the method for manufacturing the biosensor; After the steps of forming the plurality of first exposed electrodes and the plurality of second exposed electrodes, the manufacturing method of the biosensor further comprises a leveling step, wherein the leveling step is performed to improve the surface flatness of each first exposed electrode and the surface flatness of each second exposed electrode; in the step of forming the first conductive circuit layer and the second conductive circuit layer, the manufacturing method of the biosensor further comprises forming a third conductive circuit layer, wherein the third conductive circuit layer is arranged on the first insulating layer; The manufacturing method of the biosensor further comprises the steps of forming a plurality of third conductive penetrating layers, penetrating the second insulating layers through the third conductive penetrating layers to be electrically connected to the third conductive circuit layers; in the step of forming the plurality of first exposed electrodes and the plurality of second exposed electrodes, the manufacturing method of the biosensor further comprises forming a third exposed electrode, wherein the third exposed electrode is arranged on the second insulating layer and is electrically connected with the plurality of third conductive penetrating layers respectively.
  9. 9. The method for manufacturing a biosensor according to claim 7, wherein, The first conductive circuit layer and the second conductive circuit layer are adjacent to each other and separated from each other, and the first conductive circuit layer and the second conductive circuit layer are matched with each other to form a finger-shaped electrode structure; The first conductive circuit layer comprises a first extension part and a plurality of first circuit parts extending from the first extension part, the second conductive circuit layer comprises a second extension part and a plurality of second circuit parts extending from the second extension part, and the plurality of first circuit parts of the first conductive circuit layer and the plurality of second circuit parts of the second conductive circuit layer are alternately arranged; The first circuit parts of the first conductive circuit layer are parallel to each other, and extend vertically or obliquely from the first extension part; the second circuit parts of the second conductive circuit layer are parallel to each other, and extend from the second extension part vertically or obliquely; wherein the first extension portion of the first conductive line layer and the second extension portion of the second conductive line layer are parallel to each other, and the plurality of first line portions of the first conductive line layer and the plurality of second line portions of the second conductive line layer are parallel to each other; wherein the first conductive circuit layer and the second conductive circuit layer are matched with each other, to form a continuous serpentine gap between the first and second conductive trace layers; Wherein a first end and a second end of each first conductive penetrating layer are respectively and electrically contacted with the first conductive circuit layer and the corresponding first exposed electrode; wherein a first end and a second end of each second conductive penetrating layer are respectively and electrically contacted with the second conductive circuit layer and the corresponding second exposed electrode; the first conductive penetrating layers are divided into a plurality of first through hole arrays, and the first conductive penetrating layers of each first through hole array are electrically connected with the corresponding first circuit parts of the first conductive circuit layers; the first exposed electrodes are divided into a plurality of first electrode arrays, and the first exposed electrodes of each first electrode array are arranged above the corresponding first circuit part of the first conductive circuit layer and are respectively and electrically connected with the first conductive penetrating layers of the corresponding first through hole array; the second conductive penetrating layers are divided into a plurality of second through hole arrays, and the second conductive penetrating layers of each second through hole array are electrically connected with the corresponding second circuit parts of the second conductive circuit layers; The second exposed electrodes are divided into a plurality of second electrode arrays, and the second exposed electrodes of each second electrode array are arranged above the corresponding second circuit part of the second conductive circuit layer and are respectively and electrically connected with the second conductive penetrating layers of the corresponding second through hole array.
  10. 10. The method for manufacturing a biosensor according to claim 7, wherein, Wherein each first bare electrode is configured to serve as a working electrode, and each second bare electrode is configured to serve as an auxiliary electrode; the biosensor further comprises a third conductive circuit layer, a plurality of third conductive penetrating layers and a third exposed electrode, wherein the third conductive penetrating layers are electrically connected between the third conductive circuit layer and the third exposed electrode, and the third exposed electrode is configured to serve as a reference electrode.

Description

Biosensor and method for manufacturing same Technical Field The present application relates to a sensor and a manufacturing method thereof, and more particularly, to a biosensor and a manufacturing method thereof. Background The biosensor may transmit back a reaction of a biological molecule (e.g., enzyme, antibody, cell receptor, or DNA probe) through a physicochemical detector, and then the sensing result is presented to the user through a signal processor. However, the prior art biosensor still has room for improvement. Disclosure of Invention The application aims to solve the technical problem of providing a biosensor and a manufacturing method thereof aiming at the defects of the prior art. In order to improve or solve the above-mentioned problems, one of the technical means adopted in the present application is to provide a biosensor, which comprises a carrier substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive penetrating layers, a plurality of second conductive penetrating layers, a plurality of first exposed electrodes and a plurality of second exposed electrodes. The first insulating layer is disposed on the carrier substrate. The first conductive line layer is disposed on the first insulating layer. The second conductive line layer is disposed on the first insulating layer. The second insulating layer is arranged on the first insulating layer and partially covers the first conductive circuit layer and the second conductive circuit layer. The first conductive penetrating layers penetrate through the second insulating layer to be electrically connected to the first conductive circuit layer. The plurality of second conductive penetrating layers penetrate through the second insulating layer to be electrically connected to the second conductive circuit layer. The first exposed electrodes are arranged on the second insulating layer, and each first exposed electrode is electrically connected with the corresponding first conductive penetrating layer. The plurality of second exposed electrodes are arranged on the second insulating layer, and each second exposed electrode is electrically connected with the corresponding second conductive penetrating layer. The first conductive circuit layer comprises a first extension part and a plurality of first circuit parts extending from the first extension part, the second conductive circuit layer comprises a second extension part and a plurality of second circuit parts extending from the second extension part, and the plurality of first circuit parts of the first conductive circuit layer and the plurality of second circuit parts of the second conductive circuit layer are alternately arranged. In order to improve or solve the above-mentioned problems, another technical means adopted by the present application is to provide a biosensor, which comprises a carrier substrate, a first insulating layer, a second insulating layer, a first conductive circuit layer, a second conductive circuit layer, a plurality of first conductive penetrating layers, a plurality of second conductive penetrating layers, a plurality of first exposed electrodes and a plurality of second exposed electrodes. The first insulating layer is disposed on the carrier substrate. The first conductive line layer is disposed on the first insulating layer. The second conductive line layer is disposed on the first insulating layer. The second insulating layer is arranged on the first insulating layer and partially covers the first conductive circuit layer and the second conductive circuit layer. The first conductive penetrating layers penetrate through the second insulating layer to be electrically connected to the first conductive circuit layer. The plurality of second conductive penetrating layers penetrate through the second insulating layer to be electrically connected to the second conductive circuit layer. The first exposed electrodes are arranged on the second insulating layer, and each first exposed electrode is electrically connected with the corresponding first conductive penetrating layer. The plurality of second exposed electrodes are arranged on the second insulating layer, and each second exposed electrode is electrically connected with the corresponding second conductive penetrating layer. In order to improve or solve the above-mentioned problems, another technical means adopted by the present application is to provide a manufacturing method of a biosensor, which includes forming a first insulating layer on a carrier substrate, forming a first conductive trace layer and a second conductive trace layer on the first insulating layer, forming a second insulating layer on the first insulating layer to partially cover the first conductive trace layer and the second conductive trace layer, forming a plurality of first conductive penetrating layers and a plurality of second conductive pene