CN-122017322-A - Hard pressing plate voltage monitoring device and method

CN122017322ACN 122017322 ACN122017322 ACN 122017322ACN-122017322-A

Abstract

The application discloses a hard pressing plate voltage monitoring device and a method, which relate to the field of power grid hard pressing plate voltage monitoring, wherein the device is principally provided with a first metal plate, a second metal plate and a third metal plate which are arranged in parallel, and the first metal plate is connected with an object to be detected or the object to be detected is regarded as the first metal plate in actual use; the second metal plate is grounded, the third metal plate is connected with one end of the capacitor, the other end of the capacitor is respectively connected with one end of the first resistor and the grid electrode of the field effect transistor, the drain electrode of the field effect transistor is connected with one end of the second resistor, the source electrode is commonly grounded with the other end of the first resistor, and the other end of the second resistor is connected with the positive electrode of the power supply. The device drives the second metal plate to do sinusoidal regular motion along the vertical direction through sinusoidal signals, thereby changing the voltage of the third metal plate, calculating the voltage amplitude to be measured by utilizing the voltage peak-to-peak value of the third metal plate, judging the voltage polarity by combining the phase difference, only being used for accurate measurement of the voltage, avoiding tripping accidents caused by gear shifting of a multimeter, adopting non-contact design, and improving the voltage measurement safety.

Inventors

XIE YINGJUN
LIU ZICHAO
WANG YONGFEI
LIU ZHINENG

Assignees

昆明品启科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260228

Claims (10)

1. The hard pressing plate voltage monitoring device is characterized by comprising a first metal plate, a second metal plate and a third metal plate which are parallel to each other, wherein the third metal plate is arranged between the first metal plate and the second metal plate, the length of the first metal plate and the length of the second metal plate are larger than the length of the third metal plate, and the second metal plate moves along the vertical direction in a sine rule; The third metal plate is connected with one end of a capacitor, the other end of the capacitor is connected with one end of a first resistor and the grid electrode of a field effect transistor, the drain electrode of the field effect transistor is connected with one end of a second resistor, the source electrode of the field effect transistor is grounded with the other end of the first resistor, and the other end of the second resistor is connected with the positive electrode of a power supply; the first metal plate is connected with the voltage input end of the hard pressing plate, and the second metal plate is grounded.
2. The hard platen voltage monitoring device of claim 1 wherein a peak-to-peak value of a voltage between a drain and a source of the field effect transistor is proportional to a voltage on the first metal plate, and wherein a voltage between a drain and a source of the field effect transistor is proportional to a varying voltage on the third metal plate.
3. The hard platen voltage monitoring device of claim 1 wherein an electric field between the first and second metal plates is proportional to a voltage difference between the first and second metal plates, the electric field being inversely proportional to the first distance.
4. The hard platen voltage monitoring device of claim 1, wherein when the first metal plate is a wire under test, the facing areas of the second metal plate and the third metal plate are on the same order of magnitude as the cross-sectional area of the wire under test.
5. The hard pressing plate voltage monitoring device according to claim 1, wherein when the second metal plate is a metal cantilever beam, the third metal plate is a bonding pad, the bonding pad is arranged on a PCB, and the metal cantilever beam drives the metal cantilever beam to vibrate in a magneto-electric mode or a piezoelectric mode through a vibration structure.
6. The hard platen voltage monitoring device of claim 5, wherein the vibration structure comprises a metal cantilever, a bonding pad, a permanent magnet, an electromagnet and an electromagnet driving circuit when the metal cantilever is driven to vibrate by magneto electricity; The permanent magnet is fixed at the tail end of the metal cantilever, the permanent magnet and the electromagnet are coaxially arranged in the vertical direction, two poles of the electromagnet are connected with the PCB through wires, the electromagnet is fixed on the electromagnet driving circuit through a bottom screw, and the electromagnet generates an alternating magnetic field through alternating current provided by the electromagnet driving circuit to drive the permanent magnet to drive the metal cantilever to vibrate up and down in a sine rule.
7. The hard platen voltage monitoring device according to claim 5, wherein the vibration structure comprises a metal cantilever, a bonding pad, a piezoelectric sheet and a piezoelectric sheet driving circuit when the metal cantilever is driven to vibrate by the piezoelectric type; The piezoelectric sheet is fixed on the metal cantilever beam through conductive adhesive, and the piezoelectric sheet vibrates through an alternating voltage signal provided by the piezoelectric sheet driving circuit to drive the metal cantilever beam to vibrate up and down in a sine rule.
8. A hard platen voltage monitoring method, characterized in that the hard platen voltage monitoring method is applied to a hard platen voltage monitoring device of claims 1-7, the hard platen voltage monitoring method comprising: Acquiring a first distance from the first metal plate to the second metal plate and a second distance from the first metal plate to the third metal plate; The second metal plate is driven to move in the vertical direction with a sinusoidal signal, And when the first distance, the second distance and the movement variation of the second metal plate are unchanged, determining the voltage on the first metal plate according to the peak-to-peak value of the voltage varied on the third metal plate, wherein the voltage on the first metal plate is the voltage to be measured.
9. The method of claim 8, wherein determining the voltage value of the voltage under test from the peak-to-peak value of the varying voltage further comprises: and determining the polarity of the voltage to be detected according to the actual measured phase difference of the changed voltage and the sinusoidal driving signal.
10. The method for monitoring voltage of hard platen according to claim 9, wherein determining the polarity of the voltage to be measured according to the measured phase difference between the varying voltage and the sinusoidal driving signal comprises: before leaving the factory, measuring the same positive voltage to be measured by adopting different sensors, and determining the maximum phase difference and the minimum phase difference when the positive voltage is generated; Determining a phase position range of the positive voltage according to the maximum phase difference and the minimum phase difference at the positive voltage, wherein the lower limit of the phase position range of the positive voltage is the minimum phase difference, the upper limit of the phase position range of the positive voltage is the maximum phase difference, and the upper limit and the lower limit of the phase position at the positive voltage are written into a sensor; Before leaving the factory, measuring the same negative voltage to be measured by adopting different sensors, and determining the maximum phase difference and the minimum phase difference when the negative voltage is generated; Determining a negative voltage phase position range according to the maximum phase difference and the minimum phase difference in the negative voltage, wherein the lower limit of the negative voltage phase position range is the minimum phase difference, the upper limit of the negative voltage phase position range is the maximum phase difference, and the upper and lower phase limits in the positive voltage are written into the sensor; And judging whether the actual measured phase difference of the changed voltage and the sinusoidal driving signal is in a positive voltage phase difference range or a negative voltage phase difference range when actually measured, judging that the polarity of the voltage to be measured is positive when the actual measured phase difference is in the positive voltage phase range, and judging that the polarity of the voltage to be measured is negative when the actual measured phase difference is in the negative voltage phase range.

Description

Hard pressing plate voltage monitoring device and method Technical Field The application relates to the field of voltage monitoring of a hard pressing plate of a power grid, in particular to a device and a method for monitoring the voltage of the hard pressing plate. Background The method is characterized in that a hard pressing plate in a smart power grid is in a critical switching state, the voltages of two ends of the hard pressing plate to the ground are required to be measured before the smart power grid is put into operation according to a regulation, and a traditional manual measuring mode by using a universal meter is easy to cause tripping accidents due to gear dislocation errors, so that the safety is low, for example, when the voltage is required to be measured in an electrified state, the universal meter is shifted to a current gear (mA/A), which is equivalent to short circuit, a fuse tube or a meter is instantaneously burned, the control circuit is also caused to trip, in addition, the manual measuring is time-consuming and labor-consuming and is easy to make mistakes, and therefore, a non-invasive voltage monitoring device is necessary to monitor the voltage of the hard pressing plate in real time. Disclosure of Invention The application aims to develop a non-invasive hard pressing plate voltage monitoring device and a non-invasive hard pressing plate voltage monitoring method, so as to solve the problem that tripping accidents are caused by a control loop due to easy selection errors of gears in a traditional manual multimeter measuring mode. In order to achieve the above object, the present application provides the following. The application provides a hard pressing plate voltage monitoring device which comprises a first metal plate and a second metal plate which are parallel to each other, wherein a third metal plate is arranged between the first metal plate and the second metal plate, the length of the first metal plate and the length of the second metal plate are larger than the length of the third metal plate, and the second metal plate moves along the vertical direction in a sine rule. The third metal plate is connected with one end of a capacitor, the other end of the capacitor is connected with one end of a first resistor and the grid electrode of a field effect tube, the drain electrode of the field effect tube is connected with one end of a second resistor, the source electrode of the field effect tube is grounded with the other end of the first resistor, and the other end of the second resistor is connected with the positive electrode of a power supply. The first metal plate is connected with the voltage input end of the hard pressing plate, and the second metal plate is grounded. In one embodiment, the peak-to-peak value of the voltage between the drain and the source of the field effect transistor is proportional to the voltage on the first metal plate, and the voltage between the drain and the source of the field effect transistor is proportional to the voltage that varies on the third metal plate. In one embodiment, the electric field between the first and second metal plates is proportional to a voltage difference between the first and second metal plates, and the electric field is inversely proportional to the first distance. In an embodiment, when the first metal plate is a wire to be tested, the opposite areas of the second metal plate and the third metal plate are in the same order of magnitude as the cross-sectional area of the wire to be tested. In an embodiment, when the second metal plate is a metal cantilever, the third metal plate is a bonding pad, the bonding pad is arranged on the PCB, and the metal cantilever is driven to vibrate by a vibration structure in a magneto-electric or piezoelectric mode. In one embodiment, when the metal cantilever beam is driven to vibrate by magnetoelectric, the vibration structure specifically comprises the metal cantilever beam, a bonding pad, a permanent magnet, an electromagnet and an electromagnet driving circuit. The permanent magnet is fixed at the tail end of the metal cantilever, the permanent magnet and the electromagnet are coaxially arranged in the vertical direction, two poles of the electromagnet are connected with the PCB through wires, the electromagnet is fixed on the electromagnet driving circuit through a bottom screw, and the electromagnet generates an alternating magnetic field through alternating current provided by the electromagnet driving circuit to drive the permanent magnet to drive the metal cantilever to vibrate up and down in a sine rule. In one embodiment, when the piezoelectric type drives the metal cantilever beam to vibrate, the vibration structure specifically comprises the metal cantilever beam, a bonding pad, a piezoelectric sheet and a piezoelectric sheet driving circuit. The piezoelectric sheet is fixed on the metal cantilever beam through conductive adhesive, and the piezoelectric sheet vibrates