CN-122017506-A - Test system and test method

CN122017506ACN 122017506 ACN122017506 ACN 122017506ACN-122017506-A

Abstract

The application provides a test system and a test method, and relates to the technical field of electronic equipment testing. The testing system comprises a testing voltage generator and a harmonic detector, wherein the testing voltage generator is used for applying testing voltage to first electronic equipment, determining a position to be tested, generating ablation marks at the position to be tested, and the harmonic detector is used for carrying out harmonic detection on second electronic equipment after sequentially carrying out gap improvement on positions corresponding to the position to be tested of the first electronic equipment in the second electronic equipment, wherein the second electronic equipment is electronic equipment in the same batch as the first electronic equipment, the harmonic problem of the second electronic equipment is the same as that of the first electronic equipment, and the harmonic detection results before and after the gap improvement of the second electronic equipment are used for determining intermetallic microscopic gap positions causing the electronic equipment to generate harmonic waves. The embodiment of the application can avoid blind and indiscriminate investigation of the electronic equipment and remarkably improve the efficiency and accuracy of searching the intermetallic microscopic gaps in the electronic equipment.

Inventors

BI LINGYU
ZHANG TONGKAI

Assignees

北京荣耀终端有限公司

Dates

Publication Date: 20260512
Application Date: 20260415

Claims (11)

1. A test system for testing an electronic device, an intermetallic microscopic gap in the electronic device being associated with a harmonic of the electronic device, the test system comprising: the test voltage generator is used for applying test voltage to the first electronic equipment and determining a position to be tested, and the position to be tested generates ablation marks; A harmonic detector, configured to perform harmonic detection on a second electronic device after sequentially performing gap improvement on a position corresponding to the position to be detected of the first electronic device, where the second electronic device is electronic devices in the same batch as the first electronic device, and a harmonic problem of the second electronic device is the same as a harmonic problem of the first electronic device; And the harmonic detection results before and after the gap improvement of the second electronic equipment are used for determining the intermetallic microscopic gap positions causing the electronic equipment to generate harmonic waves.
2. The test system of claim 1, wherein the harmonic detector is further configured to perform harmonic detection on the same batch of electronic devices to determine the first electronic device and the second electronic device.
3. The test system according to claim 1 or 2, wherein the test voltage generator comprises a constant voltage dc power supply and an electrode, the constant voltage dc power supply being connected to the electrode, the electrode being configured to receive a voltage output from the constant voltage dc power supply and apply the test voltage to the first electronic device.
4. The test system of claim 1 or 2, wherein the test voltage generator comprises an electrostatic discharge generator.
5. The test system of claim 1 or 2, wherein the harmonic detector comprises a probe, a high pass filter, and a spectrometer, the spectrometer being connected to the probe through the high pass filter; the probe is used for detecting electromagnetic wave signals radiated by the electronic equipment; the high-pass filter is used for transmitting harmonic signals except for fundamental wave signals in the electromagnetic wave signals to the frequency spectrograph.
6. A test method applied to an electronic device, an intermetallic microscopic gap in the electronic device being associated with a harmonic of the electronic device, the test method comprising: Applying a test voltage to the first electronic equipment, and determining a position to be tested, wherein an ablation trace is generated at the position to be tested; After the gaps of the positions, corresponding to the positions to be detected, of the first electronic equipment in the second electronic equipment are sequentially improved, harmonic detection is carried out on the second electronic equipment, wherein the second electronic equipment is equipment in the same batch as the first electronic equipment, and the harmonic problem of the second electronic equipment is the same as that of the first electronic equipment; And determining the intermetallic microscopic gap position causing the electronic equipment to generate harmonic according to the harmonic detection results before and after the gap improvement of the second electronic equipment.
7. The method of testing of claim 6, further comprising, prior to applying the test voltage to the first electronic device: and carrying out harmonic detection on the electronic equipment in the same batch, and determining the first electronic equipment and the second electronic equipment.
8. The test method of claim 6 or 7, wherein the harmonic problem is identical including identical harmonic generation positions, identical harmonic components, and identical magnitudes of the harmonic components.
9. The method of testing of claim 8, wherein applying a test voltage to the first electronic device comprises: the test voltage is applied to the harmonic generation location of the first electronic device.
10. The method according to claim 6, wherein the sequentially performing the gap improvement on the second electronic device at the position corresponding to the position to be tested of the first electronic device includes: and sequentially insulating the positions corresponding to the positions to be tested of the first electronic equipment in the second electronic equipment, or sequentially applying pressure to the positions corresponding to the positions to be tested of the first electronic equipment in the second electronic equipment.
11. The method according to claim 6, wherein, in the case where the harmonic of the second electronic device disappears after the gap improvement is performed, the position at which the gap improvement is performed is an intermetallic microscopic gap position causing the electronic device to generate the harmonic.

Description

Test system and test method Technical Field The present application relates to the field of electronic device testing technologies, and in particular, to a testing system and a testing method. Background In the development and production process of consumer electronic devices such as smart phones and smart watches, radiation spurious emissions (radiated spurious emission, RSE) are a key electromagnetic compatibility index. The radiation spurious emission exceeds the standard, so that the electronic equipment cannot pass the authentication test, interference can be generated on the communication performance of the equipment, and the user experience is affected. An important factor in the problem of spurious emission of radiation is the false contact of metal, i.e. the formation of a tiny overlap between two metallic parts inside the electronic device that should remain insulated or in reliable contact, due to structural tolerances, assembly deviations or stress relief, etc., without establishing an effective physical contact or weld. The intermetallic microscopic gap is often only nano-scale to micro-scale and is far smaller than the conventional mechanical gap, but is enough to form nonlinear contact under the excitation of a high-frequency signal to generate harmonic components, so that the problem of radiation spurious emission is caused. Because the gap size is very small and the gap is positioned in the electronic equipment, conventional physical detection means, for example, industrial computer tomography (computed tomography, CT) scanning is difficult to distinguish the very small gap, so that the intermetallic microscopic gap often needs a long time to be positioned, the debugging and verification period of the electronic equipment is seriously prolonged, and the project progress is influenced. Disclosure of Invention The embodiment of the application provides a test system and a test method, which are used for quickly searching and positioning an intermetallic microscopic gap in electronic equipment. In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme: In a first aspect, a test system is provided for testing an electronic device, an intermetallic microscopic gap in the electronic device being associated with a harmonic of the electronic device, the test system comprising a test voltage generator and a harmonic detector. The test voltage generator is used for applying test voltage to the first electronic equipment to determine a position to be tested, and the position to be tested generates ablation marks. The harmonic detector is used for carrying out harmonic detection on the second electronic equipment after sequentially carrying out clearance improvement on the position corresponding to the position to be detected of the first electronic equipment in the second electronic equipment, wherein the second electronic equipment is electronic equipment in the same batch as the first electronic equipment, and the harmonic problem of the second electronic equipment is the same as that of the first electronic equipment. The harmonic detection results before and after the second electronic device performs the gap improvement are used for determining the intermetallic microscopic gap positions causing the electronic device to generate harmonics. The method and the device realize accurate searching of the microscopic gaps among metals by combining destructive positioning and non-destructive verification. Firstly, a test voltage is applied to the first electronic equipment, and air or medium at the microscopic gap is broken down by the test voltage to generate irreversible ablation marks, so that the originally invisible microscopic gap position is marked. And then, according to the ablation trace on the first electronic device, performing targeted gap improvement on the corresponding position on the second electronic device. Since the first electronic device and the second electronic device are electronic devices with the same harmonic problem in the same batch of electronic devices, it can be reasonably inferred that the positions of physical defects (i.e., intermetallic microscopic gaps) of the first electronic device and the second electronic device also have high consistency. Because the application of the test voltage to the first electronic device is destructive, the second electronic device needs to be verified at last, and whether the position is a real microscopic gap source can be accurately judged by comparing the harmonic detection results of the second electronic device before and after improvement. The embodiment of the application can avoid blind and indiscriminate investigation of the electronic equipment and remarkably improve the efficiency and accuracy of searching the intermetallic microscopic gaps in the electronic equipment. In some possible embodiments, the harmonic detector is further configured to perform harmonic dete