CN-122017507-A - Packaging detection method and system for FRD (field effect transistor) device

CN122017507ACN 122017507 ACN122017507 ACN 122017507ACN-122017507-A

Abstract

The application provides a packaging detection method and system of an FRD device. The method comprises the steps of obtaining packaging structure information of an FRD packaging device to be tested, establishing a packaging parasitic network model of the FRD packaging device based on the packaging structure information, then applying a test excitation signal to an external pin of the FRD packaging device, enabling a plurality of FRD chips to generate packaging response signals related to the test excitation signal in a packaging state, sampling the packaging response signals to obtain packaging sampling signals, and then performing parameter inversion processing on the packaging sampling signals based on the packaging parasitic network model to obtain a plurality of core grain electrical parameters corresponding to the FRD chips respectively, and determining abnormal core grains inside the FRD packaging device based on the plurality of core grain electrical parameters so as to realize effective detection of the FRD core grains connected in parallel in a packaging completion state.

Inventors

LI JIAYANG
HU XINGZHENG

Assignees

滁州华瑞微电子科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260122

Claims (10)

1. A method of packaging and inspection of an FRD device, comprising: Acquiring packaging structure information of an FRD packaging device to be tested, wherein the packaging structure information represents a packaging interconnection structure between a plurality of FRD chips and external pins which are connected in parallel in the FRD packaging device; based on the packaging structure information, establishing a packaging parasitic network model of the FRD packaging device; Applying a test excitation signal at an external pin of the FRD packaged device and determining a corresponding package response signal to perform sampling of the package response signal to obtain a package sampling signal; Performing a parameter inversion process on the package sampling signal based on the package parasitic network model to obtain a plurality of core particle electrical parameters respectively corresponding to the plurality of FRD chips; based on the plurality of die electrical parameters, it is determined whether an abnormal die is present inside the FRD packaged device.
2. The method of packaging and inspection of the FRD of claim 1 characterized in that establishing a packaging parasitic network model of the FRD packaged device based on the packaging structure information comprises: Electromagnetic simulation is carried out on the FRD packaging device based on the packaging structure information so as to obtain a plurality of core particle parasitic resistance parameters and a plurality of core particle parasitic inductance parameters which respectively correspond to the FRD chips; And determining an equivalent package parasitic network for characterizing the FRD package device according to the plurality of core particle parasitic resistance parameters and the plurality of core particle parasitic inductance parameters.
3. The method of package inspection of an FRD apparatus of claim 1 characterized in that applying a test stimulus signal at an external pin of the FRD packaged apparatus to cause the plurality of FRD chips to generate a package response signal associated with the test stimulus signal in a packaged state includes: Applying a forward conduction current pulse and a reverse turn-off voltage pulse at an external pin of the FRD packaging device to obtain a packaging response current and a packaging response voltage in a reverse recovery process of the FRD packaging device; the package response signal includes the package response current and/or the package response voltage.
4. The package inspection method of the FRD apparatus of claim 1, characterized in that performing sampling on the package response signal to obtain a package sampling signal includes: Performing time domain sampling on the package response signal with a sampling circuit to obtain the package sampling signal having a predetermined sampling bandwidth and sampling resolution; Preprocessing is performed on the packaged sample signal to obtain a preprocessed sample signal for a parametric inversion process.
5. The method of package inspection of the FRD of claim 4 characterized in that performing preprocessing on the package sample signal includes: Performing bandwidth-limited filtering processing on the packaged sample signal to suppress high-frequency noise components, and And executing waveform alignment processing on the filtered package sampling signals so as to establish a time corresponding relation between the test excitation signals and the package sampling signals.
6. The method of package inspection of an FRD apparatus of claim 1 characterized in that performing a parameter inversion process on the package sampling signal based on the package parasitic network model to obtain a plurality of die electrical parameters respectively corresponding to the plurality of FRD chips, comprises: Constructing an equivalent circuit of the FRD packaging device based on the packaging parasitic network model; And determining a plurality of core particle electrical parameters respectively corresponding to the FRD chips according to the equivalent circuit.
7. The method of packaging and inspection of the FRD of claim 6 characterized in that determining a plurality of electrical parameters of the die corresponding to the plurality of FRD chips, respectively, from the equivalent circuit includes: and determining estimated values of the plurality of core particle electrical parameters according to error metrics between the simulated response signals and the package sampling signals determined by the package parasitic network model.
8. The method of package inspection of an FRD of claim 1 characterized in that the plurality of die electrical parameters include at least one of: Forward voltage drop parameters of each FRD chip under preset forward current; reverse recovery charge parameters of each FRD chip in the reverse recovery process; reverse recovery time parameters of each FRD chip in the reverse recovery process; Reverse leakage current parameters of each FRD chip at a predetermined reverse voltage.
9. The method of packaging and inspection of an FRD of claim 1 characterized in that the FRD packaging device under test further includes a plurality of die current sensing branches corresponding to the plurality of FRD chips, respectively.
10. A package inspection system for an FRD device, comprising: The device comprises an acquisition module, a detection module and a control module, wherein the acquisition module is used for acquiring the packaging structure information of an FRD packaging device to be detected, and the packaging structure information represents a packaging interconnection structure between a plurality of FRD chips and external pins which are connected in parallel in the FRD packaging device; the processing module is used for establishing a packaging parasitic network model of the FRD packaging device based on the packaging structure information; the processing module is further used for applying a test excitation signal to an external pin of the FRD packaging device and determining a corresponding packaging response signal so as to sample the packaging response signal to obtain a packaging sampling signal; the processing module is further configured to perform parameter inversion processing on the packaged sampling signal based on the packaged parasitic network model, so as to obtain a plurality of core particle electrical parameters corresponding to the plurality of FRD chips respectively; And the determining module is used for determining whether abnormal core particles exist in the FRD packaging device or not based on the plurality of core particle electrical parameters.

Description

Packaging detection method and system for FRD (field effect transistor) device Technical Field The application relates to a device encapsulation technology, in particular to an encapsulation detection method and system for an FRD device. Background Fast recovery diodes (Fast Recovery Diode, FRD) are used as typical power semiconductors for high frequency, high power electronic systems such as switching power supplies, frequency converters, motor drives, and vehicle power supplies. With the continuous improvement of the power level and the current level, the unlimited amplification of the single chip area can bring about the problems of yield reduction, uneven heat distribution, increased mechanical stress and the like, so that the packaging mode that a plurality of FRD chips are connected in parallel in the same packaging is widely adopted in the industry, and anodes and cathodes of a plurality of FRD chips are converged to a limited number of external power pins through interconnection structures such as a lead frame, a copper substrate, a DBC substrate or a metal busbar, so that the device is externally presented as a single high-current FRD device. In such multi-chip parallel FRD packages, each core should achieve approximate current sharing to ensure balance of junction temperature, thermal stress and lifetime distribution, and once critical parameters such as forward voltage drop, reverse recovery characteristics or leakage current of a certain core are abnormally shifted, internal current redistribution, local overheating and even early failure of the whole device may be possibly caused, so a method for effectively detecting parallel FRD cores in a packaged state is needed. Disclosure of Invention The application provides a packaging detection method and a packaging detection system for FRD devices, which are used for effectively detecting parallel FRD core particles in a packaging completion state. In a first aspect, the present application provides a method for detecting a package of an FRD device, including: Acquiring packaging structure information of an FRD packaging device to be tested, wherein the packaging structure information represents a packaging interconnection structure between a plurality of FRD chips and external pins which are connected in parallel in the FRD packaging device; based on the packaging structure information, establishing a packaging parasitic network model of the FRD packaging device; Applying a test excitation signal at an external pin of the FRD packaged device and determining a corresponding package response signal to perform sampling of the package response signal to obtain a package sampling signal; Performing a parameter inversion process on the package sampling signal based on the package parasitic network model to obtain a plurality of core particle electrical parameters respectively corresponding to the plurality of FRD chips; based on the plurality of die electrical parameters, it is determined whether an abnormal die is present inside the FRD packaged device. In a second aspect, the present application provides a package inspection system for an FRD device, comprising: The device comprises an acquisition module, a detection module and a control module, wherein the acquisition module is used for acquiring the packaging structure information of an FRD packaging device to be detected, and the packaging structure information represents a packaging interconnection structure between a plurality of FRD chips and external pins which are connected in parallel in the FRD packaging device; the processing module is used for establishing a packaging parasitic network model of the FRD packaging device based on the packaging structure information; the processing module is further used for applying a test excitation signal to an external pin of the FRD packaging device and determining a corresponding packaging response signal so as to sample the packaging response signal to obtain a packaging sampling signal; the processing module is further configured to perform parameter inversion processing on the packaged sampling signal based on the packaged parasitic network model, so as to obtain a plurality of core particle electrical parameters corresponding to the plurality of FRD chips respectively; And the determining module is used for determining whether abnormal core particles exist in the FRD packaging device or not based on the plurality of core particle electrical parameters. According to the method and the system for detecting the package of the FRD device, package structure information of the FRD package device to be detected is obtained, a package parasitic network model of the FRD package device is built based on the package structure information, then, a test excitation signal is applied to an external pin of the FRD package device, so that a plurality of FRD chips generate package response signals related to the test excitation signal in a package state, sampling is pe