CN-122017514-A - Semiconductor device testing method and device

Abstract

The present disclosure provides a semiconductor device testing method and apparatus. Acquiring test data, wherein the test data comprise data of a plurality of test devices, and the data of each test device comprise position information and various test parameters, and the position information comprises a mechanical arm used for transferring the test device, a station used when the mechanical arm transfers the test device and a position in a bearing disc during testing; analyzing the test data based on the position information to determine a yield, judging whether a mechanical arm fault, a station fault, a bearing disc fault or a communication fault exists according to the yield, and outputting an instruction for stopping the test of the semiconductor device if the mechanical arm fault, the station fault, the bearing disc fault or the communication fault exists.

Inventors

• WU HONGLEI

Assignees

• 京灿光电(广东)有限公司

Dates

Publication Date

20260512

Application Date

20260324

Claims (10)

1. 1. A method of testing a semiconductor device, the method comprising: Acquiring test data, wherein the test data comprise data of a plurality of test devices, the data of each test device comprise position information and various test parameters, and the position information comprises a mechanical arm used for transferring the test device, a station used when the mechanical arm transfers the test device and a position in a bearing disc during testing; Analyzing the test data based on the position information to determine the yield; Judging whether mechanical arm faults, station faults, bearing disc faults or communication faults exist according to the yield; And outputting an instruction for stopping the test of the semiconductor device if the mechanical arm fault, the station fault, the bearing disc fault or the communication fault exists.
2. 2. The method of claim 1, wherein analyzing the test data based on the location information to determine a yield comprises: selecting all test parameters of the test devices with the same mechanical arm from the test data, and determining the first yield of all the mechanical arms; selecting all the test parameters of the test devices with the same station from the test data, and determining the second yield of each station; And selecting all test parameters of the test devices with the same bearing disc from the test data, and determining the third yield of all the bearing discs.
3. 3. The method of claim 2, wherein determining whether there is a robot failure, a station failure, a carrier tray failure, or a communication failure based on the yield comprises: When the first yield of a first mechanical arm is smaller than a first threshold value, determining that the first mechanical arm has a mechanical arm fault, wherein the first mechanical arm is any mechanical arm; when the second yield of the first station is smaller than a second threshold value, determining that station faults exist in the first station, wherein the first station is any station; When the third yield of the first bearing disc is smaller than a third threshold value, determining that the first bearing disc is in a bearing disc fault, wherein the first bearing disc is any bearing disc; And when the first yield, the second yield or the third yield is empty, determining that communication faults exist.
4. 4. A method according to any one of claims 1 to 3, further comprising: and outputting the yield under different dimensions in the graphical interface, wherein the dimensions comprise a mechanical arm dimension, a station dimension and a bearing disc dimension.
5. 5. The method according to claim 4, wherein the method further comprises: Periodically acquiring the test data, analyzing the test data, and determining all the yield in the period; And dynamically outputting the yield under different dimensions in the graphical interface.
6. 6. A method according to any one of claims 1 to 3, further comprising: receiving test parameter options input by a user through a graphical interface; The obtaining test data includes: acquiring the test parameters corresponding to the test parameter options through an interface; acquiring the position of the test device in the bearing disc during test through an interface; And determining a mechanical arm used for transferring the test device and a station used for transferring the test device by the mechanical arm according to the position of the test device in the bearing disc during the test, so as to obtain the position information.
7. 7. A method according to any one of claims 1 to 3, further comprising: displaying the average value of each test parameter in a graphical interface; And determining whether the test unit has faults according to the average value of the test parameters.
8. 8. A semiconductor device testing apparatus, the apparatus comprising: The device comprises an acquisition module, a load-bearing disc and a test module, wherein the acquisition module is used for acquiring test data, the test data comprise data of a plurality of test devices, the data of each test device comprise position information and various test parameters, and the position information comprises a mechanical arm used for transferring the test devices, a station used when the mechanical arm transfers the test devices and a position in the load-bearing disc during testing; the determining module is used for analyzing the test data based on the position information and determining the yield; The judging module is used for judging whether mechanical arm faults, station faults, bearing disc faults or communication faults exist according to the yield; And the output module is used for outputting an instruction for stopping the test of the semiconductor device if the mechanical arm fault, the station fault, the bearing disc fault or the communication fault exists.
9. 9. A computer device comprising a processor, a memory configured to store processor-executable instructions, wherein the processor is configured to perform the method of any of claims 1 to 7.
10. 10. A computer readable storage medium, characterized in that instructions in the computer readable storage medium, when executed by a processor of a computer device, enable the computer device to perform the method of any one of claims 1 to 7.

Description

Semiconductor device testing method and device Technical Field The present disclosure relates to the field of semiconductor technologies, and in particular, to a method and an apparatus for testing a semiconductor device. Background Gallium nitride semiconductor devices such as gallium nitride (GaN) -based transistors are third generation semiconductors. For testing of gallium nitride semiconductor devices, the semiconductor devices are transferred to a bearing disc mainly through a mechanical arm, then the testing is carried out, and if the semiconductor devices are not installed in place, inaccurate testing results may be caused. Currently, this situation usually requires manual judgment, which easily results in waste of test productivity. Disclosure of Invention The embodiment of the disclosure provides a semiconductor device testing method and device. The technical scheme is as follows: in a first aspect, an embodiment of the present disclosure provides a method for testing a semiconductor device, the method including: Acquiring test data, wherein the test data comprise data of a plurality of test devices, the data of each test device comprise position information and various test parameters, and the position information comprises a mechanical arm used for transferring the test device, a station used when the mechanical arm transfers the test device and a position in a bearing disc during testing; Analyzing the test data based on the position information to determine the yield; Judging whether mechanical arm faults, station faults, bearing disc faults or communication faults exist according to the yield; And outputting an instruction for stopping the test of the semiconductor device if the mechanical arm fault, the station fault, the bearing disc fault or the communication fault exists. Optionally, analyzing the test data based on the location information, determining a yield rate includes: selecting all test parameters of the test devices with the same mechanical arm from the test data, and determining the first yield of all the mechanical arms; selecting all the test parameters of the test devices with the same station from the test data, and determining the second yield of each station; And selecting all test parameters of the test devices with the same bearing disc from the test data, and determining the third yield of all the bearing discs. Optionally, according to the yield, judging whether there is a mechanical arm fault, a station fault, a carrier tray fault or a communication fault, including: When the first yield of a first mechanical arm is smaller than a first threshold value, determining that the first mechanical arm has a mechanical arm fault, wherein the first mechanical arm is any mechanical arm; when the second yield of the first station is smaller than a second threshold value, determining that station faults exist in the first station, wherein the first station is any station; When the third yield of the first bearing disc is smaller than a third threshold value, determining that the first bearing disc is in a bearing disc fault, wherein the first bearing disc is any bearing disc; And when the first yield, the second yield or the third yield is empty, determining that communication faults exist. Optionally, the method further comprises: and outputting the yield under different dimensions in the graphical interface, wherein the dimensions comprise a mechanical arm dimension, a station dimension and a bearing disc dimension. Optionally, the method further comprises: Periodically acquiring the test data, analyzing the test data, and determining all the yield in the period; And dynamically outputting the yield under different dimensions in the graphical interface. Optionally, the method further comprises: receiving test parameter options input by a user through a graphical interface; The obtaining test data includes: And acquiring the test parameters corresponding to the test parameter options through an interface. Optionally, the acquiring test data further includes: acquiring the position of the test device in the bearing disc during test through an interface; And determining a mechanical arm used for transferring the test device and a station used for transferring the test device by the mechanical arm according to the position of the test device in the bearing disc during the test, so as to obtain the position information. Optionally, the method further comprises: displaying the average value of each test parameter in a graphical interface; And determining whether the test unit has faults according to the average value of the test parameters. In a second aspect, embodiments of the present disclosure provide a semiconductor device testing apparatus, the apparatus including: The device comprises an acquisition module, a load-bearing disc and a test module, wherein the acquisition module is used for acquiring test data, the test data comprise data of a plurality of test devices, the data