CN-122017523-A - Chip testing method and device, electronic equipment and storage medium

CN122017523ACN 122017523 ACN122017523 ACN 122017523ACN-122017523-A

Abstract

The application provides a chip testing method which comprises the steps of collecting images of a chip according to preset detection data to obtain a first chip image. And controlling at least 2 probes to contact with the chip according to the first chip image, and responding to the pressure detected by the at least 2 probes to reach a preset pressure threshold value, and carrying out image acquisition on the chip and the at least 2 probes to obtain a second chip image. The second chip image is identified to determine if at least 2 probes are in contact with the detection sites of the chip. And responding to successful contact between at least 2 probes and the detection position, outputting detection signals to at least 1 probe, and detecting the output signals of at least 1 probe to obtain a chip detection result. Thus, accurate testing of the chip is achieved.

Inventors

Gan Yunxuan
SHEN XIAOSHUANG
Gong yajie
MEI LIANG
REN XIANG
ZHANG LINGFENG
NIE ZHIJUN

Assignees

航天科工防御技术研究试验中心

Dates

Publication Date: 20260512
Application Date: 20260116

Claims (10)

1. A method of chip testing, comprising: acquiring an image of a chip according to preset detection data to obtain a first chip image; Controlling at least 2 probes to be in contact with the chip according to the first chip image, and acquiring images of the chip and the at least 2 probes to obtain a second chip image in response to the fact that the pressure detected by the at least 2 probes reaches a preset pressure threshold; Identifying the second chip image, and determining whether the at least 2 probes are in contact with the detection position of the chip; and responding to the successful contact of the at least 2 probes with the detection positions, outputting detection signals to at least 1 probe, and detecting the output signals of at least 1 probe to obtain a chip detection result.
2. The chip testing method according to claim 1, wherein before the image acquisition of the chip according to the preset detection data, further comprising: determining detection data according to preset basic parameters of a chip, wherein the basic parameters at least comprise the outline dimension, the number of bonding pads, the distribution of bonding pads, the qualified standard of needle insertion and the qualified threshold of electric parameters of the chip; and determining the detection position of the chip according to the detection data.
3. The chip testing method according to claim 1, wherein after the image acquisition is performed on the chip according to the preset detection data, the method further comprises: determining the first position information according to the first chip image, and comparing the first position information with the detection data; And in response to the deviation of the first position information from the detection data being greater than a preset first deviation threshold, fine-tuning the positions of the at least 2 probes so as to align the at least 2 probes with the detection positions of the chip.
4. The chip testing method according to claim 1, wherein the identifying the second chip image, determining whether the at least 2 probes are in contact with the detection positions of the chip, specifically includes: Performing image extraction on the second chip image according to a preset image segmentation algorithm to obtain the needle mark contours of the at least 2 probes; calculating the deviation value between the needle mark and the center of the chip bonding pad according to the needle mark outline, and calculating the coverage area of the needle mark to the chip bonding pad; and responding to the deviation value meeting a preset deviation threshold value, and the coverage area meeting a preset area threshold value, so that the at least 2 probes are successfully contacted with the detection position of the chip.
5. The chip testing method of claim 4, wherein the method further comprises: And controlling the at least 2 probes to move in a direction away from the chip and contact with the chip again in response to the deviation value failing to meet the deviation threshold and/or the coverage area failing to meet the area threshold, and acquiring images of the chip and the at least 2 probes to obtain an updated second chip image.
6. The chip testing method according to claim 5, wherein after the image capturing is performed on the chip and the at least 2 probes, the updated second chip image is obtained, further comprising: Setting retry times, and updating the second chip image in response to the updated deviation value corresponding to the second chip image failing to meet the deviation threshold and/or the coverage area failing to meet the area threshold, and enabling the at least 2 probes to move in a direction away from the chip and contact with the chip again; and marking the current chip as a chip to be rechecked according to the times that the deviation value corresponding to the second chip image cannot meet the deviation threshold value and/or the coverage area cannot meet the area threshold value exceeds the retry times.
7. The chip testing method according to claim 1, wherein after the obtaining the chip test result, further comprising: Determining whether the chip detection result meets preset chip parameters; Controlling the at least 2 probes to move in a direction far away from the chip and to contact with the chip again in response to the fact that the chip detection result cannot meet preset chip parameters, and acquiring images of the chip and the at least 2 probes to obtain an updated second chip image; identifying the updated second chip image, and determining whether the at least 2 probes are in contact with the detection position of the chip; Responding to successful contact between the at least 2 probes and the detection position, outputting detection signals to at least 1 probe, and detecting the output signals of at least 1 probe to obtain updated chip detection results; Setting detection times, and marking the current chip as a disqualified chip in response to the fact that the continuous times of the chip detection result do not meet the chip parameters exceeds the detection times.
8. A chip testing apparatus for performing the method of any of claims 1-7, the apparatus comprising: the visual identification module is used for acquiring the first chip image and the second chip image; The probe station module is used for driving the probe to move and monitoring the contact pressure; The test instrument module is used for outputting detection signals to at least 1 probe and collecting output signals of at least 1 probe; And the upper computer module is used for controlling the visual identification module, the probe station module and the test instrument module.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the method of any one of claims 1 to 7 when the program is executed.
10. A non-transitory computer readable storage medium storing computer instructions for causing a computer to perform the method of any one of claims 1 to 7.

Description

Chip testing method and device, electronic equipment and storage medium Technical Field The application relates to the technical field of chip effectiveness detection, in particular to a chip testing method. Background With the miniaturization and intelligent development demands of communication technology and microelectronic technology, bare chips replace traditional packaging products with the advantages of small size and low cost, and are increasingly widely applied in the fields of microwaves, radio frequency, power devices and the like. Before the bare chip is used, a user can send the bare chip to a professional detection mechanism for identification and screening, and the bare chip is often required to be tested by using a probe station and related instruments and meters so as to ensure the reliability of the bare chip. In the current bare chip test process, the judgment of the test effectiveness of the bare chip mainly comprises the judgment of the needle insertion effect and the judgment of the electrical parameter test result, wherein the judgment is mostly dependent on manual judgment, the detection result is very dependent on the experience of professional detection personnel, no definite and strict judgment standard exists, and the comparison is influenced by the subjective consciousness of the person. For judging the puncture effect of the bare chip test, the judgment standards of different operators on the positions of the needle marks are inconsistent, so that the judgment result of the test effectiveness is unstable. If a large number of tests are carried out, the eyes can cause visual fatigue of people for a long time, and misjudgment and missed judgment occur. In addition, the manual visual inspection efficiency is lower, the batch test requirement is difficult to meet, the tiny needle mark offset or poor contact is difficult to identify by naked eyes, and the test effectiveness is easy to misjudge. For judging the electrical parameter test result of the bare chip test, the physical contact state in the test process is difficult to be comprehensively reflected only by the electrical parameter test result fed back by the instrument and meter, and when the electrical parameter test result is unqualified, whether the electrical parameter test result is due to the contact problem of the probe or the defect of the chip is difficult to be quickly positioned. Disclosure of Invention In view of the above, the present application provides a chip testing method, a device, an electronic apparatus, and a storage medium. Based on the above object, the application provides a chip testing method, which comprises the steps of acquiring images of a chip according to preset detection data to obtain a first chip image. And controlling at least 2 probes to contact with the chip according to the first chip image, and responding to the pressure detected by the at least 2 probes to reach a preset pressure threshold value, and carrying out image acquisition on the chip and the at least 2 probes to obtain a second chip image. The second chip image is identified to determine if at least 2 probes are in contact with the detection sites of the chip. And responding to successful contact between at least 2 probes and the detection position, outputting detection signals to at least 1 probe, and detecting the output signals of at least 1 probe to obtain a chip detection result. In some embodiments, before the image acquisition of the chip according to the preset detection data, the method further comprises determining the detection data according to preset chip basic parameters. The basic parameters at least comprise the outline dimension of the chip, the number of bonding pads, the distribution of the bonding pads, the qualified standard of needle insertion and the qualified threshold of electric parameters. And determining the detection position of the chip according to the detection data. In some embodiments, after the image acquisition is performed on the chip according to the preset detection data to obtain the first chip image, the method further comprises determining first position information according to the first chip image, and comparing the first position information with the detection data. And in response to the deviation of the first position information from the detection data being greater than a preset first deviation threshold, fine-tuning the positions of the at least 2 probes so as to align the at least 2 probes with the detection positions of the chip. In some embodiments, the second chip image is identified to determine whether at least 2 probes are in contact with the detection positions of the chip, and specifically includes performing image extraction on the second chip image according to a preset image segmentation algorithm to obtain the trace contours of the at least 2 probes. And calculating the deviation value of the needle mark and the center of the chip bonding pad according to the needl