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CN-122017528-A - Chip high temperature test system structure

CN122017528ACN 122017528 ACN122017528 ACN 122017528ACN-122017528-A

Abstract

The invention relates to the technical field of chip testing, in particular to a chip high-temperature testing system structure which comprises a constant-temperature controller, a plurality of chip high-temperature testing sockets, double-headed spring pins and a chip function testing circuit board, wherein the plurality of chip high-temperature testing sockets are detachably and electrically connected with the constant-temperature controller through temperature control cables, socket pin dies are fixedly arranged on the upper surfaces of the chip high-temperature testing sockets, and the double-headed spring pins are embedded in the socket pin dies along the vertical direction. According to the invention, the heating pressing plate is directly arranged at the bottom of the upper cover of the chip high-temperature test socket, the temperature regulating effect of the thermocouple, the constant-temperature controller radiator and the cooling fan is combined, the high-temperature test environment is directly constructed for a single chip, meanwhile, the LED panel is fixedly arranged on the outer side wall of the chip high-temperature test socket and is electrically connected with the chip function test circuit board through the constant-temperature controller, so that the qualification or bad state of the tested chip can be visually displayed, and an operator can directly position and sort the qualified and unqualified chips.

Inventors

  • JIN YINGJIE
  • LIANG ZHIXIAN

Assignees

  • 深圳市世坤科技实业有限公司

Dates

Publication Date
20260512
Application Date
20260209

Claims (9)

  1. 1. The chip high-temperature test system structure is characterized by comprising a constant temperature controller (1), a plurality of chip high-temperature test sockets (2), double-ended spring pins (3) and a chip function test circuit board (4), wherein the chip high-temperature test sockets (2) are all detachably and electrically connected with the constant temperature controller (1) through a temperature control cable (5), a socket pin die (6) is fixedly arranged on the upper surface of the chip high-temperature test socket (2), the double-ended spring pins (3) are embedded in the socket pin die (6) along the vertical direction, and the lower ends of the double-ended spring pins (3) are in compression type electric contact with circuit contacts of the chip function test circuit board (4); The chip high-temperature test socket is characterized in that a heating pressing plate (7) is horizontally and fixedly arranged on one side, close to the chip function test circuit board (4), of a socket upper cover (201) of the chip high-temperature test socket (2), the lower surface of the heating pressing plate (7) is correspondingly arranged with the upper surface of a chip to be tested, and a thermocouple (8) is embedded in the heating pressing plate (7) along the horizontal direction.
  2. 2. The chip high-temperature test system structure according to claim 1, wherein the signal output end of the thermocouple (8) is electrically connected with the signal input end of the constant-temperature controller (1) through a temperature control cable (5), and the power input end of the heating pressing plate (7) is electrically connected with the power output end of the constant-temperature controller (1) through the temperature control cable (5).
  3. 3. The chip high-temperature test system structure according to claim 1, wherein a radiator (9) and a cooling fan (10) are arranged at the top of the chip high-temperature test socket (2), and the radiator (9) is fixedly assembled at the top of the chip high-temperature test socket (2) through bolts.
  4. 4. The structure of claim 3, wherein the lower end of the radiator (9) extends to the upper surface of the heating pressing plate (7), the cooling fan (10) is mounted on the upper surface of the radiator (9), and the power input end of the cooling fan (10) is electrically connected with the power output end of the constant temperature controller (1) through the temperature control cable (5).
  5. 5. The chip high-temperature test system structure according to claim 1, wherein the LED panels (11) are fixedly arranged on the outer side walls of the chip high-temperature test sockets (2), the signal input ends of the LED panels (11) are electrically connected with the signal output ends of the chip function test circuit board (4) through temperature control cables (5), and the power input ends of the LED panels (11) are electrically connected with the power output ends of the constant-temperature controller (1) through the temperature control cables (5).
  6. 6. The structure of a chip high temperature test system according to claim 1, wherein the back of the constant temperature controller (1) is provided with a plurality of temperature control interfaces (12), and each temperature control interface (12) is electrically connected with one chip high temperature test socket (2) through an independent temperature control cable (5).
  7. 7. The structure of claim 6, wherein a plurality of connection contacts (13) are disposed in the temperature control interface (12), and the plurality of connection contacts (13) are respectively a heating block+, a cooling fan+, a heating block-, a cooling fan-, an LED (GD, NG) +, an LED (GD) -, a thermocouple-, a thermocouple+, and an LED (NG) -.
  8. 8. The system structure according to claim 1, wherein the high-temperature test socket (2) comprises a socket base (201) and a socket upper cover (202).
  9. 9. The high temperature test system structure of claim 8, wherein the socket base (201) is fixedly mounted on the upper surface of the chip function test circuit board (4), and the socket pin die (6) is matched with the inner wall of the socket base (201) in a positioning manner through a positioning pin.

Description

Chip high temperature test system structure Technical Field The invention relates to the technical field of chip testing, in particular to a chip high-temperature testing system structure. Background The electrical performance test under the high temperature environment is a key link before the chip mass production, the mainstream chip high temperature test scheme in the industry at present adopts the high temperature environment case as the control by temperature change carrier, with test socket built-in environment case, the test socket passes environment case heat preservation wall through long distance test cable and is connected with outside test function board, after the chip location centre gripping of being surveyed is on the test socket, the chip pin only need through test cable can form electric loop with external equipment, and then accomplish electric parameter test. Along with the development of semiconductor chip technology to high-speed and radio-frequency, in the existing test scheme, high-speed signals and radio-frequency signals can generate serious attenuation in the long-distance cable transmission process, so that test data are distorted, test requirements cannot be met, meanwhile, a temperature control component is separated from a test socket in the traditional test scheme, temperature feedback is delayed, and test result feedback depends on external equipment to read data, an operator needs to open an environment box to position unqualified chips according to the external data, and the complexity and time consumption of chip sorting are increased. Therefore, a chip high temperature test system structure is proposed to solve the above-mentioned problems. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a chip high-temperature test system structure, which is characterized in that a heating pressing plate is directly arranged in a chip high-temperature test socket, the temperature regulation effect of a thermocouple, a constant-temperature controller radiator and a cooling fan is combined, a high-temperature test environment is directly constructed for a single chip, meanwhile, an LED panel fixedly arranged on the outer side wall of the chip high-temperature test socket is connected with a constant-temperature controller through a temperature control cable, a chip function test circuit board transmits qualified and bad information of chip test to the constant-temperature controller through an RS232 or 485 communication cable, the constant-temperature controller controls the LED to be turned on and off through the temperature control cable, the qualified or bad state of the tested chip can be visually displayed, an operator can directly locate and search the unqualified chip, the chip sorting flow is greatly simplified, the sorting time is effectively shortened, and the problem in the background technology can be solved. The technical scheme includes that the device comprises a constant temperature controller, a plurality of chip high-temperature test sockets, double-headed spring pins and a chip function test circuit board, wherein the chip high-temperature test sockets are detachably and electrically connected with the constant temperature controller through temperature control cables, socket pin dies are fixedly arranged in socket bases of the chip high-temperature test sockets, the double-headed spring pins are embedded in the socket pin dies along the vertical direction, and the lower ends of the double-headed spring pins and circuit contacts of the chip function test circuit board form compression type electric contact; the upper socket cover of the chip high-temperature test socket is horizontally and fixedly provided with a heating pressing plate at one side close to the chip function test circuit board, the lower surface of the heating pressing plate is correspondingly arranged with the upper surface of the chip to be tested, and a thermocouple is embedded in the heating pressing plate along the horizontal direction. Preferably, the signal output end of the thermocouple is electrically connected with the signal input end of the constant temperature controller through a temperature control cable, and the power input end of the heating pressing plate is electrically connected with the power output end of the constant temperature controller through the temperature control cable. Preferably, a radiator and a radiator fan are arranged at the top of the chip high-temperature test socket, the bottom side surface of the radiator is fixedly assembled on the upper side surface of the heating pressing plate through bolts, and fins on the upper part of the radiator are arranged at the top of the chip high-temperature test socket. Preferably, the heating pressing plate is mounted on the upper portion of the upper cover of the socket through an elastic bolt and connected in a floating mode, the cooling fan is mounted on the upper surface of the radiator,