CN-122017530-A - Method, device, equipment and medium for generating gong band of impedance slice of circuit board

CN122017530ACN 122017530 ACN122017530 ACN 122017530ACN-122017530-A

Abstract

The invention discloses a method, a device, equipment and a medium for generating a gong band of a circuit board impedance slice. According to the invention, the target impedance line is read from the impedance file of the impedance first test board, the target impedance line is taken as a reference, the slicing track line is automatically generated, the line width of the slicing track line is adjusted to be the same as the diameter of the gong tool, the gong belt positioning hole is determined from the drilled hole of the impedance first test board, the slicing track line with the line width adjusted and the gong belt positioning hole are packed into the gong belt, so that the automatic generation of the gong belt is realized, the gong belt generation efficiency is improved, the cost is reduced, the gong belt error caused by human factors is avoided, and the gong belt accuracy is improved.

Inventors

ZHOU ZHENHUA
ZHANG DEJIN
CAO BIN

Assignees

广州广合科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260212

Claims (10)

1. The utility model provides a gong area generating method of circuit board impedance section which characterized in that includes: Reading a target impedance line from an impedance file of an impedance first test board, wherein the target impedance line is one of a plurality of impedance lines of the impedance first test board; Taking the target impedance line as a reference, generating a slicing trajectory line meeting preset requirements, wherein the slicing trajectory line is used for defining a travel trajectory of a milling cutter; the line width of the slicing trajectory line is adjusted to be the same as the diameter of the milling cutter; Determining a tape-routing positioning hole from the drilling hole of the impedance first test board; and packaging the slicing trajectory line with the line width adjusted and the gong band positioning hole into a gong band.
2. The gong belt generation method of circuit board impedance slicing according to claim 1, wherein the target impedance line includes a plurality of segments, and the slice trajectory line meeting a preset requirement is generated with the target impedance line as a reference, including: arranging all the segments of the target impedance line in descending order according to the length to obtain a segment sequence; Selecting a segment with the largest length from the segment sequence as a target segment; Generating candidate slice track lines meeting preset requirements on a slice layer by taking the target segment as a reference; Judging whether the candidate slice trajectory line intersects with slice trajectory lines of other impedance lines generated in advance or whether the distance between the candidate slice trajectory line and the slice trajectory line of other impedance lines is smaller than the diameter of the milling cutter; If yes, selecting the next segment from the segment sequence as a target segment, and returning to execute the step of taking the target segment as a reference to generate a candidate slice trajectory line meeting the preset requirement on a slice layer until the slice trajectory line of the target impedance line is obtained or all segments in the segment sequence are traversed; If not, taking the candidate slicing trajectory line as the slicing trajectory line of the target impedance line, taking the next impedance line as the target impedance line, and returning to execute the step of taking the target impedance line as a reference to generate the slicing trajectory line meeting the preset requirement on the slicing map layer until all the impedance lines of the impedance first-time test board are traversed.
3. The gong band generation method of circuit board impedance slicing according to claim 2, wherein generating a candidate slicing trajectory line meeting a preset requirement with the target segment as a reference includes: Generating nodes on two sides of a preset distance from the target segment by taking the midpoint of the target segment as a reference point, wherein the preset distance is half of the slice width; Drawing a line segment along the parallel direction of the target segment, wherein the line segment takes the node as a midpoint, and the length of the line segment is the length of a slice; connecting the end points of the two wire sections to obtain a slicing wire frame; taking one corner of the slicing wire frame as a starting point, respectively backing back along the length direction and the width direction of the slice by a set distance to obtain a reserved rib for enabling the slice to be connected with the impedance first test board; and respectively taking the two points after the back movement as a tool setting point and a tool lifting point of the milling tool to obtain candidate slice track lines.
4. The gong band generation method of circuit board impedance slicing according to claim 2, wherein determining whether there is an intersection or a distance smaller than a diameter of a gong of the slicing trajectory line of the candidate slicing trajectory line with the slice trajectory line of the other impedance line previously generated includes: Copying slice trace lines of other impedance lines generated in advance in the slice layer to a touch layer; Performing touch testing on the candidate slice trajectory line and slice trajectory lines of other impedance lines generated in advance in the touch map layer, wherein the touch testing is used for judging whether the candidate slice trajectory line intersects with the slice trajectory lines of other impedance lines generated in advance or whether the distance between the candidate slice trajectory line and the slice trajectory line of other impedance lines generated in advance is smaller than the diameter of a milling cutter; When the candidate slice trajectory line touches the slice trajectory line of any one of the other previously generated impedance lines, selecting the next segment from the segment sequence as a target segment, and returning to execute the step of taking the target segment as a reference to generate a candidate slice trajectory line meeting the preset requirement on a slice map layer until the slice trajectory line of the target impedance line is obtained or all segments in the segment sequence are traversed; And when the candidate slice trajectory line does not touch the slice trajectory line of any other previously generated impedance line, copying the candidate slice trajectory line serving as the slice trajectory line of the target impedance line into the touch map layer, taking the next impedance line as the target impedance line, and returning to execute the step of generating the slice trajectory line meeting the preset requirement on the slice map layer by taking the target impedance line as a reference until all the impedance lines of the impedance first-time test board are traversed.
5. The gong band generation method of circuit board impedance slicing according to any one of claims 1 to 4, wherein adjusting the line width of the slicing trajectory to be the same as the diameter of the gong blade comprises: And calling a channel conversion function in Genesis software, and converting the slice image layer into a gong band channel layer, so that the line width of the slice track line is adjusted to be the same as the diameter of the gong tool.
6. The gong band generation method of circuit board impedance slice according to any one of claims 1-4, wherein determining a gong band positioning hole from a drilled hole of the impedance first test board comprises: determining the vertex of the impedance first test board; screening out holes which are closest to the vertex and have apertures meeting the requirements of band milling positioning holes from a band drilling layer of the impedance first test board as candidate holes, wherein the band drilling layer comprises all drill holes of the impedance first test board; And generating holes which are concentric with the candidate holes and have the aperture smaller than that of the candidate holes as band-milling positioning holes.
7. The gong band generation method of circuit board impedance slicing according to any one of claims 1-4, further comprising, after packing the line width-adjusted slice trajectory and the gong band positioning hole into a gong band: Outputting a file reflecting the positions of the slicing trajectory line and the gong belt positioning hole on the impedance first test board; and outputting an impedance information table corresponding to the slicing trajectory line, wherein the impedance information table comprises the type of the impedance line, a signal layer where the impedance line is positioned, a reference layer of the impedance line, a line width, a line distance, an impedance value and an impedance tolerance.
8. The utility model provides a gong area generating device of circuit board impedance section which characterized in that includes: the impedance line reading module is used for reading a target impedance line from an impedance file of the impedance first test board, wherein the target impedance line is one of a plurality of impedance lines of the impedance first test board; the track drawing module is used for generating a slicing track line meeting preset requirements by taking the target impedance line as a reference, wherein the slicing track line is used for defining a travel track of the milling cutter; the line width adjusting module is used for adjusting the line width of the slicing trajectory line to be the same as the diameter of the milling cutter; the positioning hole determining module is used for determining a tape-routing positioning hole from the drilling hole of the impedance first test board; And the gong belt generation module is used for packaging the slicing trajectory line with the line width adjusted and the gong belt positioning hole into gong belts.
9. An electronic device, comprising: one or more processors; a storage means for storing one or more programs; when the one or more programs are executed by the one or more processors, the one or more processors implement the gong band generation method of circuit board impedance slicing as claimed in any one of claims 1-7.
10. A computer readable storage medium having stored thereon a computer program, which when executed by a processor, implements a method of generating a gong of a circuit board impedance slice as claimed in any one of claims 1-7.

Description

Method, device, equipment and medium for generating gong band of impedance slice of circuit board Technical Field The present invention relates to a circuit board impedance testing technology, and in particular, to a method, an apparatus, a device, and a medium for generating a gong band for a circuit board impedance slice. Background The impedance board is a Printed Circuit Board (PCB) which enables a signal transmission line on the circuit board to have specific characteristic impedance through optimal design and manufacture, and has the core function of solving the signal integrity problem in high-speed and high-frequency signal transmission. Before mass production of the impedance plates, whether the impedance design is reasonable or not needs to be confirmed through first test production of the impedance plates (IMPEDANCE FIRST ARTICLE, IFA), and the design is adjusted according to the test result of the first impedance plates so as to ensure that the mass production can meet the impedance requirements of customers. Therefore, the first test board needs to be sliced, namely, the position of the impedance line is sliced, and then analysis is performed, so that whether the impedance design of the impedance line is reasonable or not is ensured. The key point of slicing analysis on the impedance first test board is to find out the position of the impedance line and output the sliced gong belt (a numerical control program for controlling the gong machine to operate). Currently, the method mainly adopts manual searching of impedance lines, drawing of routing tracks of a milling cutter and manual writing of milling belts. Along with the increasingly dense integration degree of the circuit board, the design level is also higher and higher, the impedance lines to be controlled are also more and more, the process of manually generating the gong belt is longer, the working efficiency is low, and errors are easily caused by human factors. Disclosure of Invention The invention provides a method, a device, equipment and a medium for generating a gong belt of a circuit board impedance slice, which are used for realizing automatic generation of the gong belt, improving the gong belt generation efficiency, reducing the cost, avoiding the gong belt error caused by factors and improving the gong belt accuracy. In a first aspect, the present invention provides a method for generating a gong band for impedance slicing of a circuit board, including: Reading a target impedance line from an impedance file of an impedance first test board, wherein the target impedance line is one of a plurality of impedance lines of the impedance first test board; Taking the target impedance line as a reference, generating a slicing trajectory line meeting preset requirements, wherein the slicing trajectory line is used for defining a travel trajectory of a milling cutter; the line width of the slicing trajectory line is adjusted to be the same as the diameter of the milling cutter; Determining a tape-routing positioning hole from the drilling hole of the impedance first test board; and packaging the slicing trajectory line with the line width adjusted and the gong band positioning hole into a gong band. Optionally, the target impedance line includes a plurality of segments, and generating a slice trajectory line meeting a preset requirement with the target impedance line as a reference includes: arranging all the segments of the target impedance line in descending order according to the length to obtain a segment sequence; Selecting a segment with the largest length from the segment sequence as a target segment; Generating candidate slice track lines meeting preset requirements on a slice layer by taking the target segment as a reference; Judging whether the candidate slice trajectory line intersects with slice trajectory lines of other impedance lines generated in advance or whether the distance between the candidate slice trajectory line and the slice trajectory line of other impedance lines is smaller than the diameter of the milling cutter; If yes, selecting the next segment from the segment sequence as a target segment, and returning to execute the step of taking the target segment as a reference to generate a candidate slice trajectory line meeting the preset requirement on a slice layer until the slice trajectory line of the target impedance line is obtained or all segments in the segment sequence are traversed; If not, taking the candidate slicing trajectory line as the slicing trajectory line of the target impedance line, taking the next impedance line as the target impedance line, and returning to execute the step of taking the target impedance line as a reference to generate the slicing trajectory line meeting the preset requirement on the slicing map layer until all the impedance lines of the impedance first-time test board are traversed. Optionally, generating a candidate slice trajectory line meeting a preset requirement by taki