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CN-122018070-A - Backlight module for brushing ink on light inlet side of light guide plate of explosion-proof lamp and preparation method of backlight module

CN122018070ACN 122018070 ACN122018070 ACN 122018070ACN-122018070-A

Abstract

The invention discloses a backlight module for brushing ink on the light inlet side of a light guide plate of an explosion-proof lamp and a preparation method thereof. The backlight module comprises a light guide plate, wherein a lower white ink layer and an upper black ink layer are sequentially arranged on the surface of the light incident side of the light guide plate. The white ink layer is used for reflecting light, the black ink layer is used for absorbing light and sealing, and the white ink layer and the light guide plate form an integrated structure, so that the physical gap between the light guide plate and the LED reflecting component in the traditional design is thoroughly eliminated, and zero-gap sealing is realized. The invention also provides a corresponding preparation method, which comprises the steps of pretreatment, precise spraying of double-layer ink, UV curing and the like. The invention fundamentally solves the light leakage problem of the light inlet side of the light guide plate, remarkably improves illumination uniformity and light efficiency, enhances the reliability and environmental adaptability of the structure, prolongs the service life, simplifies the production process, reduces the production cost, and is particularly suitable for the explosion-proof lighting field with strict requirements on tightness and light efficiency.

Inventors

  • LIN ZHIFENG

Assignees

  • 广州欧讯光电有限公司

Dates

Publication Date
20260512
Application Date
20251229

Claims (10)

  1. 1. The utility model provides a backlight unit of explosion-proof lamp light guide plate income light side brush printing ink, includes the light guide plate, its characterized in that, the income light side surface of light guide plate is equipped with double-deck printing ink structure, double-deck printing ink structure includes: the lower white ink layer is coated on the light incident side surface of the light guide plate and used for reflecting light rays; And the upper black ink layer is covered on the white ink layer and is used for absorbing light and sealing.
  2. 2. The backlight module of claim 1, wherein the white ink layer has a thickness of 30-50 μm and a reflectivity of not less than 95%, and the black ink layer has a thickness of 20-30 μm and a light transmittance of not more than 0.1%.
  3. 3. The backlight module for brushing ink on the light incident side of a light guide plate of an explosion-proof lamp according to claim 1 or 2, wherein the adhesion between the white ink layer and the light guide plate is not lower than 5N/cm, and the adhesion between the black ink layer and the white ink layer is not lower than 4N/cm.
  4. 4. The backlight module of claim 1, wherein the spraying area of the white ink layer covers the projection range of the light emitting surface of the LED by 0.3mm, the two ends of the spraying area are retracted into the light guide plate by 1mm, the spraying area of the black ink layer completely covers the white ink layer, the two sides of the spraying area are respectively extended by 0.1mm, and the length of the spraying area is consistent with that of the light guide plate.
  5. 5. The backlight module of claim 1, wherein the light guide plate is made of PMMA or PC, the thickness of the white ink layer is 30-40 μm and 40-50 μm, and the thickness of the black ink layer is 20-25 μm and 25-30 μm.
  6. 6. A method for preparing a backlight module with ink for an incident side of an explosion-proof light guide plate, the method being used for preparing the backlight module with ink for an incident side of an explosion-proof light guide plate according to any one of claims 1 to 5, comprising the steps of: preprocessing the light incident side of the light guide plate, including cleaning and plasma activation; Spraying lower-layer white ink, and forming a white ink layer through UV curing; Spraying black ink on the upper layer, and forming a black ink layer through UV curing; the post-treatment and the detection are carried out, ensure no light leakage and no gap.
  7. 7. The method for manufacturing a backlight module with ink applied to the light incident side of a light guide plate of an explosion-proof lamp according to claim 6, wherein in the pretreatment step, the power of the plasma treatment is 50-80W, the treatment time is 10-15s, and the surface energy is raised to not lower than 40mN/m.
  8. 8. The method for manufacturing the backlight module with the ink brushed on the light inlet side of the light guide plate of the explosion-proof lamp according to claim 6, wherein the white ink is sprayed by an automatic precise spraying machine, the spraying pressure is 0.2-0.3MPa, the spraying distance is 15-20cm, the running speed is 50-80mm/s, and the spraying is completed in two times.
  9. 9. The method for preparing the backlight module with the ink brushed on the light inlet side of the light guide plate of the explosion-proof lamp according to claim 6, wherein the black ink is sprayed by replacing a nozzle with the same spraying equipment, the spraying pressure is 0.15-0.25MPa, the spraying distance is 15-20cm, the running speed is 60-90mm/s, and the black ink is sprayed and molded once.
  10. 10. The method of claim 6, wherein in the step of UV curing, the curing energy of the white ink layer is 800-1000mJ/cm2 and the curing energy of the black ink layer is 600-800mJ/cm2.

Description

Backlight module for brushing ink on light inlet side of light guide plate of explosion-proof lamp and preparation method of backlight module Technical Field The invention relates to the technical field of semiconductor display, in particular to a backlight module with ink brushed on the light inlet side of a light guide plate of an explosion-proof lamp and a preparation method thereof. Background In the field of design and manufacture of anti-explosion lamp backlight modules, in order to solve the problem of light leakage of the light incident side of a light guide plate, the conventional technology generally adopts an NB structure and combines and pastes an LED reflection adhesive tape and a design scheme of a U-folded process. According to the scheme, the LED reflecting adhesive tape is stuck on the light incident side of the light guide plate, and the Z-direction gap between the light guide plate and the LED reflecting component is compressed to about 0.07mm by means of the U-shaped folding structure, so that the risks of light leakage and lamp explosion are reduced. However, this solution still has the following significant drawbacks: Firstly, although the Z-direction gap is greatly reduced, the gap exists objectively, so that part of light overflows from the gap between the light guide plate and the LED reflecting adhesive tape, light leakage phenomenon is caused, and the illumination uniformity and the use safety of the explosion-proof lamp are affected. And secondly, the LED reflecting adhesive tape is in physical adhesion connection with the light guide plate, and is easy to shift due to ageing, weakening of viscosity or influence of environmental factors in the long-term use process, so that the gap is increased, the light leakage problem is aggravated, and the structural reliability and the service life are influenced. In addition, the U-folded structure has higher requirements on processing precision and assembly process, not only increases production difficulty and cost, but also is difficult to completely ensure gap consistency in batch production, and has poor process controllability. In summary, the existing anti-explosion lamp backlight module still has the problems that the structure depends on external attaching components, the long-term reliability is insufficient, the process is complex, the gap is difficult to thoroughly eliminate and the like on the light-entering side light leakage prevention design of the light guide plate, and the further improvement of the anti-explosion lamp light effect and the safety is restricted. Therefore, it is necessary to provide a light-entering side structure scheme of the light guide plate which is more reliable, has simplified process and can fundamentally eliminate the hidden trouble of light leakage. Disclosure of Invention Aiming at the defects of the prior art, the invention discloses a backlight module for brushing ink on the light inlet side of a light guide plate of an explosion-proof lamp and a preparation method thereof, which are used for thoroughly eliminating the light leakage phenomenon caused by the existence of a physical gap (Z-direction gap) between the light guide plate and an LED reflecting part, improving illumination uniformity and light efficiency, improving structural reliability and long-term stability of the backlight module, and avoiding performance attenuation caused by the problems of tape aging, displacement and the like. Simplifying the production process, reducing the dependence on complex processes such as high-precision U-folded structures and the like, thereby reducing the production cost and improving the production efficiency. The invention is realized by the following technical scheme: in a first aspect, the invention provides a backlight module for brushing ink on an incident side of a light guide plate of an explosion-proof lamp, which comprises a light guide plate, and the improvement is that the surface of the incident side of the light guide plate is provided with a double-layer ink structure, and the double-layer ink structure comprises: The lower white ink layer is directly coated on the surface of the light inlet side of the light guide plate and is used for efficiently reflecting light which is emitted by the LED and possibly overflows outwards back to the light source area, so that the light utilization rate is improved; The upper black ink layer is covered on the white ink layer and is used for absorbing stray light and forming tight and gapless contact with an external structure (such as an LED reflecting surface) to realize optical sealing and fundamentally block a light leakage path. Preferably, the white ink layer has a thickness of 30-50 μm and a reflectance of not less than 95%, and the black ink layer has a thickness of 20-30 μm and a transmittance of not more than 0.1%. This parameter range ensures an optimal balance of lower reflection efficiency and upper sealed absorption effect. As a further