Search

CN-122018187-A - Vehicle-mounted screen integrated assembly processing method based on capacitive touch control

CN122018187ACN 122018187 ACN122018187 ACN 122018187ACN-122018187-A

Abstract

The invention discloses a capacitive touch-based vehicle-mounted screen integrated assembly processing method, which belongs to the field of vehicle-mounted display and touch device manufacturing and comprises the following specific steps of S1, substrate pretreatment, S2, touch electrode layer preparation, S3, insulating layer coating, S4, optical adjustment layer forming, S5, display function layer integrated forming, S6, electromagnetic shielding layer integration, S7, packaging and lead connection, S8, segmentation function detection, S9, reliability strengthening treatment, S10, final quality control and packaging. The invention adopts an integrated structure without separate optical glue for protecting the cover plate and attaching the touch module, obviously reduces the material cost, greatly reduces the interface reflectivity between the touch electrode and the display layer through gradient refractive index design, obviously improves the overall light transmittance and the display contrast, and can also support the manufacture of vehicle-mounted touch screens with different sizes and different forms.

Inventors

  • PENG GUANGHUA
  • SHE YICHUN
  • TANG CHENGHUA

Assignees

  • 四川艾瑞科精密电子有限公司

Dates

Publication Date
20260512
Application Date
20251223

Claims (8)

  1. 1. The integrated assembly processing method of the vehicle-mounted screen based on the capacitive touch control is characterized by comprising the following specific steps of: S1, preprocessing a substrate, namely selecting a borosilicate glass substrate, sequentially carrying out alkaline cleaning, acidic cleaning and ultrapure water rinsing, then carrying out hot air drying and ultraviolet sterilization, and finally detecting and screening the substrate with flatness error less than or equal to 1 mu m through laser flatness; S2, preparing a touch electrode layer, depositing a conductive layer by magnetron sputtering, forming a touch electrode array by femtosecond laser etching, and cleaning and detecting the electrode performance by plasma after etching; S3, coating an insulating layer, coating polyimide resin by adopting a spin-coating process, pre-curing and high-temperature curing to form the insulating layer, and detecting electrical insulation performance; s4, forming an optical adjustment layer, coating a high refractive index resin-low refractive index nanoparticle composite system by adopting slit coating, and detecting optical performance after baking and curing; S5, forming a display function layer integrally, sequentially completing TFT array preparation, pixel electrode and common electrode preparation, color filter layer preparation, liquid crystal filling and frame sealing, and detecting display function parameters after each step; S6, integrating the electromagnetic shielding layers, respectively preparing the electromagnetic shielding layers on the outer side of the opposite substrate of the display function layer and the inner side of the substrate of the touch electrode layer, and detecting shielding effectiveness and conductivity; S7, connecting the package with a lead, bonding and packaging by adopting a glass cover plate and ultraviolet curing glue, connecting a touch electrode with an FPC (flexible printed circuit) through laser micro-welding, and detecting the sealing property and the connection reliability of the package; S8, detecting the display performance, the touch performance and the EMC performance by detecting the sectional function, and repairing unqualified products in the current process; S9, performing reliability strengthening treatment, and performing high-low temperature circulation, wet heat aging and vibration test to ensure that the performance attenuation is less than or equal to 10 percent after the test; S10, final quality control and packaging, wherein the appearance defects are detected by proportional full-performance retesting, and then the packaging is performed by adopting an antistatic material.
  2. 2. The method of claim 1, wherein in the step S1, borosilicate glass substrate thickness is 0.5-0.7 mm, light transmittance is not less than 92%, thermal expansion coefficient is 3.2X10- -6 /° C, alkaline cleaning is 5% -8% potassium hydroxide solution at 50-60 ℃ and ultrasonic power is 300-400W for 5-8 min, acidic cleaning is 3% -5% hydrofluoric acid solution at 25-30 ℃ and ultrasonic power is 2-3 min, ultrapure water rinsing is 18.2MΩ & cm ultrapure water at 40-45 ℃ and ultrasonic power is 200-300W for 8-10 min, ultraviolet sterilization wavelength is 254nm, intensity is 10-15 mW/cm 2 , and ultrasonic power is 3-5 min.
  3. 3. The method of claim 1, wherein in the step S2, an ITO-ZnO composite target is adopted in magnetron sputtering, the argon flow is 20-25 sccm, the oxygen flow is 1-2 sccm, the vacuum degree is 5×10 -4 ～8×10 -4 Pa, the substrate temperature is 150-180 ℃, the power is 200-250W, the thickness of a conductive layer is 80-100 nm, fang Zu Ω/≡and the light transmittance is more than or equal to 90%, the femtosecond laser etching wavelength is 1064nm, the pulse width is 50-100 fs, the frequency is 1-2 kHz, the energy density is 1-2J/cm 2, the touch electrode array comprises a driving electrode along an X axis and an induction electrode along a Y axis, the plasma cleaning is argon atmosphere, the power is 100-150W, the time is 3-5 min, the uniformity deviation of the detection electrode sheet resistance is less than or equal to 5%, and the edge roughness is less than or equal to 0.5 μm.
  4. 4. The method of claim 1, wherein the polyimide resin in the steps S3 and S4 has a solid content of 30% -40%, a viscosity of 500-800 cps, a spin-coating speed of 3000-4000 rpm, a pre-curing temperature of 80-100 ℃ and a pre-curing time of 30-60 min, a high-temperature curing temperature of 200-220 ℃ and a pre-curing time of 120-180 min, an insulating layer thickness of 800-1200 nm, a crosslinking degree of more than or equal to 90%, a breakdown voltage of more than or equal to 100V/μm, a dielectric constant of less than or equal to 3.5 (1 kHz), a surface roughness of less than or equal to 0.1 μm, a high refractive index resin refractive index of 1.6-1.7 in the composite system, a low refractive index nanoparticle of silicon dioxide, a slit coating speed of 5-10 mm/S, a wet film thickness of 2-3 μm, a baking temperature of 120-150 ℃ and a pre-curing time of 60-90 min, an optical adjustment layer thickness of 1.5-2.5 μm, and a refractive index gradient of the interface reflectivity of less than or equal to 91% from the insulating layer side 1.6 to the display layer side in a thickness direction.
  5. 5. The method of claim 1, wherein the TFT array in step S5 is formed by depositing 50-80 nm amorphous silicon layer by CVD using LTPO process, laser annealing wavelength is 308nm, energy density is 300-400 mj/cm 2 , channel width of active layer is 10-20 μm, gate is molybdenum metal, source and drain are aluminum metal, thickness of ITO layer between pixel electrode and common electrode is 60-80 nm, thickness of color filter layer R/G/B photoresist is 1.5-2 μm, mask exposure wavelength is 365nm, energy is 100-150 mj/cm 2 , color gamut is more than or equal to NTSC95%, liquid crystal is nematic phase liquid crystal, sealant is ultraviolet curing energy is 2000-300 mj/cm 2 , TFT on current is more than or equal to 1 μa, pixel voltage deviation is less than or equal to 5%, liquid crystal pretilt angle deviation is less than or equal to 1 °.
  6. 6. The method of claim 1, wherein in the steps S6 and S7, an inner electromagnetic shielding layer is a copper-nickel alloy layer with 100-150 nm, a grid line width of 20-30 μm, a distance of 500-800 μm and a light transmittance of more than or equal to 85%, an outer electromagnetic shielding layer is screen printed by using 300-400 mesh screen conductive silver paste, the grid line width of 30-40 μm, the distance of 500-800 μm and the inner electromagnetic shielding layer are staggered, the inner electromagnetic shielding layer is baked for 30-60 min at 120-150 ℃, the detection shielding efficiency is more than or equal to 40dB, the node contact resistance is less than or equal to 100mΩ, a glass cover plate and a substrate glass are made of the same material, the ultraviolet curing glue refractive index is 1.5-1.6, the thickness is 50-100 μm, the curing shrinkage rate is less than or equal to 1%, the ultraviolet curing wavelength is 365nm, the energy is 1500-2000 mJ/cm 2 , the total thickness after packaging is less than or equal to 5mm, the laser micro-welding wavelength is 1064nm, the pulse energy is 1-2 mJ, the time is 10-20 μs, the soldering flux is low in residue, the ultrasonic cleaning power is 100-150W, the time is 2-150 min, the detection efficiency is more than or equal to -8 Pa·m 3 m, the drain contact resistance is less than or equal to 5 m.
  7. 7. The method of claim 1, wherein the display performance detection indexes in the steps S8 and S9 are that the brightness is more than or equal to 500cd/m 2 , the contrast is more than or equal to 1000:1, the color gamut is more than or equal to 95 percent of NTSC, the response time is less than or equal to 10ms, the brightness uniformity deviation is less than or equal to 5 percent, the touch performance detection indexes are that the triggering force is less than or equal to 50g, the accuracy deviation is less than or equal to 0.1mm, the supporting of 10 points is simultaneous, the response time is less than or equal to 5ms, the EMC performance meets CISPR25Class5 standard, the radiation emission is less than or equal to 40dB [ mu ] V/m@30-1000 MHz, the immunity is more than or equal to 200V/m@80-1000 MHz, the high and low temperature cycle temperature range is-40 ℃ -85 ℃, the wet heat aging is 85 ℃ and the vibration test is carried out in an RH environment for 1000h, and the performance attenuation amplitude after the test is less than or equal to 10 percent.
  8. 8. The method of claim 1, wherein the total performance retest ratio in the step S10 is 10%, the appearance defect detection standard is scratch depth less than or equal to 0.1 μm and bubble diameter less than or equal to 0.1mm, the packaging adopts antistatic foam with surface resistance of 10 6 ～10 9 omega and an aluminum foil bag with shielding effect of more than or equal to 30dB, and the product is independently placed.

Description

Vehicle-mounted screen integrated assembly processing method based on capacitive touch control Technical Field The invention relates to the technical field of manufacturing of vehicle-mounted display and touch devices, in particular to a vehicle-mounted screen integrated assembly processing method based on capacitive touch. Background Along with the transformation of the automobile industry to intelligent and electric, the vehicle-mounted display system is updated from a single information output terminal to a core control unit of display, touch control and interaction, and the requirements on the functional integration level, the performance stability and the environmental adaptability are continuously improved. Capacitive touch technology has become a mainstream scheme of vehicle-mounted touch interaction because of the advantages of high sensitivity, multi-point touch, no mechanical abrasion, quick response and the like. However, the manufacturing of the existing vehicle-mounted capacitive touch screen is still mainly based on a split type process, the mode is derived from the technical migration of the consumer electronic touch screen, various technical bottlenecks are exposed when the vehicle-mounted capacitive touch screen is adapted to a vehicle-mounted scene, and the high performance requirement of an intelligent vehicle is difficult to meet: the split type process is required to finish the processing of the touch control module and the display module respectively in two independent production lines, and the touch control module and the display module are secondarily assembled by transferring logistics to the laminating production line for multiple times, so that the production period is prolonged, and the inventory management cost and the material loss risk are increased. In the lamination process, the micron-sized flatness deviation and environmental particulate matter pollution of the touch control module and the display module are easy to cause optical defects such as bubbles, newton rings and the like after lamination, and the display effect is affected. Meanwhile, the existing technology needs to perform functional test after all the assembly is completed, if the defects of touch dead zone, display dark line and the like are detected, the whole module is required to be disassembled, most of disposable parts cannot be recovered, secondary damage to a substrate is possibly caused, and reworking time and cost are increased. In summary, the existing split type process cannot adapt to the requirements of the intelligent automobile on high integration, high reliability, low cost and light weight of the vehicle-mounted touch screen, and a novel processing method for realizing integrated manufacturing of touch control and display, simplifying the flow and improving the performance is developed, so that the novel processing method becomes a key direction for breaking through the technical bottleneck in the vehicle-mounted display industry. Disclosure of Invention Aiming at the defects of the prior art, the invention provides a vehicle-mounted screen integrated assembly processing method based on capacitive touch control, which solves the problems in the prior art. The integrated assembly processing method of the vehicle-mounted screen based on the capacitive touch control comprises the following specific steps of: S1, selecting a borosilicate glass substrate as a base, and firstly adopting a three-section cleaning process: In the alkaline cleaning stage, 5% -8% potassium hydroxide solution (the temperature is 50-60 ℃, the ultrasonic power is 300-400W, and the cleaning time is 5-8 min) is used for removing oil stains and organic pollutants on the surface; in the acid cleaning stage, 3% -5% hydrofluoric acid solution (the temperature is 25-30 ℃ and the soaking time is 2-3 min) is used for removing the surface oxide layer and the micro scratches; The ultra-pure water rinsing stage adopts 18.2M omega cm ultra-pure water (the temperature is 40-45 ℃, the ultrasonic power is 200-300W, and the rinsing time is 8-10 min); After cleaning, performing hot air drying (the temperature is 80-90 ℃ and the wind speed is 1-2 m/s) and ultraviolet sterilization (the wavelength is 254nm, the irradiation intensity is 10-15 mW/cm 2 and the time is 3-5 min), and finally, adopting laser flatness detection (the precision is +/-0.1 mu m), and screening a substrate with the flatness error less than or equal to 1 mu m for later use; S2, preparing a touch electrode layer, namely depositing a transparent conductive layer on the surface of a pretreated substrate by adopting a magnetron sputtering technology, wherein the sputtering target material is a composite target material (mass ratio of 9:1) of Indium Tin Oxide (ITO) and zinc oxide (ZnO), the sputtering environment is a mixed atmosphere of argon and oxygen (the argon flow is 20-25 sccm, the oxygen flow is 1-2 sccm), the vacuum degree is 5 multiplied by 10 -4～8×10-4 Pa, the substr