CN-122018191-A - Laminating module wiring system based on overall arrangement design

CN122018191ACN 122018191 ACN122018191 ACN 122018191ACN-122018191-A

Abstract

The invention provides a fitting module wiring system based on layout design, relates to the technical field of liquid crystal display devices and manufacturing processes, and aims to solve the technical problems that in a liquid crystal display module, a polaroid and a peripheral structure have stage differences, so that OCA glue is unevenly filled, and the conventional remedy scheme excessively depends on fitting process parameters to cause poor mass production consistency. The system calculates a level difference flush coefficient Pqx and a comprehensive fit filling coefficient Ttx through virtual stacking and fluid parameter collection, and guides and eliminates the level difference from the source in the digital design stage. Meanwhile, the system fits the two to fit the fit yield evaluation index Lpz, and double-layer closed-loop evaluation and grading early warning are carried out by utilizing a preset yield threshold. The invention thoroughly gets rid of the high dependence on the technological parameters of equipment and the environment, effectively avoids the risks of bubble, glue overflow and stress concentration, greatly widens the technological window, and really ensures the high yield and the product reliability of mass production.

Inventors

CHEN LIANG
XU HONGBIN
FANG LEIFENG
WEI HUAJIN

Assignees

万年联创显示科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260331

Claims (10)

1. Laminating module wiring system based on overall arrangement design, characterized by, include: the virtual structure stacking module is used for carrying out three-dimensional equal proportion modeling on each functional layer, peripheral wiring and upper polaroid in the preset liquid crystal display module, creating a visual attaching module structure demonstration model for a designer, and carrying out data display on the three-dimensional appearance of the simulated OCA optical adhesive attaching interface; The layout parameter acquisition module is used for monitoring and recording the height of the outer surface of the upper polaroid and the height data of the peripheral structures of the adjacent liquid crystal display modules in real time when the system performs structure stacking wiring design so as to construct a height proportioning state set, and monitoring and recording OCA colloid mobility performance data under different height proportioning in real time so as to construct a fluid filling set; the data processing module is used for preprocessing data of the height proportioning state set and the fluid filling set, and then transmitting the data to the cloud platform for data standardization processing; The level difference parallel analysis module is used for analyzing the relative height difference between the outer surface of the upper polaroid and the attaching reference surface of the liquid crystal display module according to the height proportioning state set so as to construct a level difference parallel coefficient Pqx and evaluate the level difference parallel coefficient so as to send out a structure early warning instruction, and after the structure early warning instruction is received, the module layout design interface is monitored and corresponding thickness or position adjustment prompt operation is carried out so as to eliminate the level difference from a structure source; The OCA filling simulation module is used for respectively analyzing dynamic filling states of the OCA optical cement in the visible area and the invisible transition area based on the fluid filling set, and comprehensively analyzing comprehensive fitting filling coefficients Ttx of the current layout design according to the filling states of the OCA optical cement in different areas so as to avoid generating partial bubble gaps which are not completely covered; The lamination yield evaluation module obtains a lamination yield evaluation index Lpz by correlating the level difference flush coefficient Pqx with the comprehensive lamination filling coefficient Ttx through fitting, presets a yield threshold W for comparison analysis, comprehensively evaluates the mass production consistency grade of the current module wiring system, and makes a corresponding structure optimization report according to the grade.
2. The layout-based bonding module wiring system of claim 1, wherein the virtual structure stacking module comprises a virtual three-dimensional unit and an interface display unit; The virtual three-dimensional unit is used for simulating a virtual stacked structure in the liquid crystal display module by using the parameters of the actual touch display module in equal proportion, and overlapping the height proportioning information in the actual simulation process, so that a designer is helped to know the flush state of the upper polaroid, the peripheral cover plate glass and the wiring reference plane in real time, and a tolerance analyzer matched with the actual laminating equipment is arranged; The interface display unit is used for providing visual interface observation experience for a designer by utilizing a three-dimensional rendering technology, the designer interacts with a virtual stacking environment through an input instruction, and meanwhile, a plurality of groups of virtual probes are utilized to collect interface flatness data in the stacking process, wherein the flatness data comprise but are not limited to visual section differences and edge step differences, the flatness data are fed back to the cloud platform in real time, and a thermodynamic diagram interface is displayed for the designer in a display, and comprises but is not limited to stress concentration marks, bubble high-emission areas and thickness adjustment suggestions.
3. The bonding module wiring system based on the layout design of claim 1, wherein the layout parameter acquisition module comprises a first acquisition unit and a second acquisition unit; The first acquisition unit is used for monitoring and recording the mutual height matching state of each structural layer in the module in real time so as to acquire relevant height matching state data information, wherein the relevant height matching state data information comprises an upper polaroid, a high polaroid and adjacent liquid crystal display module peripheral structure height liquid crystal display modules in each monitoring sampling point, and the average polaroid of the upper polaroid height in the monitoring period and the average liquid crystal display module of the liquid crystal display module peripheral structure height in the monitoring period are calculated respectively according to the upper polaroid high polaroid in each monitoring sampling point and the adjacent liquid crystal display module peripheral structure height liquid crystal display module; The second acquisition unit is used for monitoring and recording continuous state data of the OCA attaching interface under each stacking scheme and filling performance data under corresponding states, the continuous state data comprise a completely flush state of a visible area and a partial step buffering state of a non-visible area, horizontal gaps of the modules under the flush state and vertical fall of the modules under the step buffering state are recorded respectively, and the filling performance data under the corresponding states comprise horizontal filling rate deviation values Sppc and vertical filling rate deviation values Czpc of OCA colloid under the flush state at different positions of the modules, and horizontal stress deviation values Spc and vertical stress deviation values Czc of OCA colloid under the step buffering state at different positions of the modules.
4. The layout-design-based bonding module wiring system as in claim 3, wherein said level difference level analysis module comprises a level response analysis unit, a structure early warning unit and an adjustment notification unit; the flush response analysis unit is used for collecting according to the height proportioning state, calculating and obtaining a level difference flush coefficient Pqx by using the upper polaroid, the high polaroid, the peripheral structure height H of the adjacent liquid crystal display module and the liquid crystal display module; Specifically, for each monitoring sampling point, a first ratio and a second ratio are calculated respectively, wherein the first ratio is an absolute value of a difference between the upper POL height in the sampling point and the average value of the upper POL heights in the monitoring period, and then the absolute value is divided by a value obtained by dividing the average value of the upper POL heights in the monitoring period; Multiplying the first ratio by a first weight coefficient, multiplying the second ratio by a second weight coefficient, and adding the products of the first ratio and the second weight coefficient to obtain a single-point parallel and level value of the sampling point; and finally, accumulating and summing the single-point parallel and level values corresponding to all the monitoring sampling points, wherein the obtained sum is the level difference parallel and level coefficient.
5. The bonding module wiring system based on the layout design of claim 4, wherein the structure early warning unit is configured to preset a level threshold value Q, and perform a comparison analysis on the level threshold value Q and the level difference level coefficient Pqx to preliminarily determine whether a local void risk exists when the current system layout design faces the OCA optical cement bonding process, and specifically comprises: If the level difference flush coefficient Pqx exceeds the flush threshold value Q, initially judging that the lamination interface caused by the current stacking design is in a non-flush state, wherein the fact that the current module design has a stage difference and high risk of bubble generation is indicated, the current module design cannot be remedied by only adjusting technological parameters such as lamination pressure or temperature, and a structure early warning instruction is sent outwards at the moment; If the level difference flush coefficient Pqx does not exceed the flush threshold value Q, at this time, it is preliminarily judged that the fitting reference plane corresponding to the current stacking design is in the same plane or basically flush state, which means that the level difference risk has been eliminated in the source for the current structure, and at this time, an additional structure early warning instruction is not required to be sent outwards.
6. The layout-based bonding module wiring system of claim 4, wherein the adjustment notification unit is configured to monitor and record parameter settings of each functional layer in the module design interface in time after receiving the structure early warning command sent by the structure early warning unit; The method comprises the steps of checking parameters of a lower supporting frame or an optical compensation layer, judging whether a step is generated by the joint reference surface of a liquid crystal display module corresponding to an OCA glue layer on the outer surface of an upper polarizer due to the problem of height proportion of a supporting structure, automatically matching the compensation thickness and repairing the step if the parameters of the supporting structure are abnormal, and providing visual prompts for designers through a display screen of a design interface if the parameters of the supporting structure are not abnormal, wherein the parameters of the supporting structure are not abnormal, and the middle buffer layer is required to be actively increased or the film thickness of the upper polarizer is locally changed to eliminate step risks.
7. The fitting module wiring system based on the layout design as set forth in claim 3, wherein the OCA filling simulation module comprises a region state analysis unit and a fluid precision analysis unit, wherein the region state analysis unit is used for analyzing filling deformation conditions of OCA glue in a visible region of the module, namely a flush state, and stress distribution conditions of the OCA glue in a non-visible region, namely a step buffer state, through a fluid filling set so as to respectively calculate a visible region filling factor Vtc and a non-visible region filling factor Ntc of the corresponding region; the method for obtaining the filling factor of the visual area comprises the following steps: Dividing the vertical deviation value by the comprehensive deviation base of the visual area, multiplying by a third weight coefficient, and finally accumulating and summing the calculation results obtained under all sampling distances in the visual area to obtain the filling factor of the visual area; The non-visual area filling factor obtaining method comprises the steps of obtaining a vertical deviation value and a horizontal deviation value of stress in each non-visual area according to sampling distance in each non-visual area, adding squares of the vertical deviation value and the horizontal deviation value, dividing the square root of the square of the vertical deviation value and the square of the horizontal deviation value to obtain a non-visual area comprehensive deviation base, dividing the vertical deviation value by the non-visual area comprehensive deviation base, multiplying the non-visual area comprehensive deviation base by a fourth weight coefficient, and finally accumulating and summing calculation results obtained in all sampling distances in the non-visual area to obtain the non-visual area filling factor.
8. The bonding module wiring system based on layout design according to claim 7, wherein the fluid accurate analysis unit is configured to comprehensively evaluate the overall leveling coverage of the OCA optical cement according to the visible region filling factor Vtc and the non-visible region filling factor Ntc, so as to analyze and calculate a comprehensive bonding filling factor Ttx of the current layout, and the specific calculation process includes calculating a difference between the visible region filling factor under each visible region sampling distance and a mean value of the visible region filling factors in the simulation process, squaring the difference, and multiplying the squared difference by a fifth weight coefficient to obtain a visible region single point variance weighting value; Calculating the difference between the non-visual area filling factor under each non-visual area sampling distance and the non-visual area filling factor mean value in the simulation process, squaring the difference, and multiplying the squared difference by a sixth weight coefficient to obtain a non-visual area single-point variance weighted value; And accumulating and summing all the single-point variance weighted values of the visible area, accumulating and summing all the single-point variance weighted values of the non-visible area, and adding the results of the accumulating and summing to obtain the comprehensive fitting filling coefficient.
9. The bonding module wiring system based on the layout design of claim 1, wherein the bonding yield evaluation module comprises a comprehensive analysis unit and a yield evaluation unit, the comprehensive analysis unit is used for correlating the level difference parallel coefficients Pqx with the comprehensive bonding filling coefficients Ttx, fitting and calculating bonding yield evaluation indexes Lpz after dimensionless processing, the specific acquisition mode comprises the steps of multiplying the level difference parallel coefficients by a seventh weight coefficient to obtain first evaluation sub-items, multiplying the comprehensive bonding filling coefficients by an eighth weight coefficient to obtain second evaluation sub-items, and adding and summing the first evaluation sub-items, the second evaluation sub-items and preset correction constants to obtain the bonding yield evaluation indexes.
10. The layout-based bonding module wiring system according to claim 9, wherein the yield estimation unit is configured to preset a yield threshold W, including a first yield threshold W1 and a second yield threshold W2, and the first yield threshold W1 is greater than the second yield threshold W2; Comparing and analyzing the fit yield evaluation index Lpz with the first yield threshold W1 and the second yield threshold W2 to comprehensively evaluate the mass production consistency grade of the current module wiring system, and making a corresponding structure optimization report according to the grade, wherein the method specifically comprises the following steps: if the fit yield evaluation index Lpz is greater than or equal to the first yield threshold W1, it indicates that the fit yield of the current module layout design is in an unqualified state (i.e., severely depends on the process parameter to remedy and has poor stability). At the moment, a return feedback report of the design is provided for a design team, a specific level difference exceeding position and a thickness modification suggestion are pointed out, and the height proportion of the stacking structure of the liquid crystal display module is compulsorily required to be readjusted; if the second yield threshold W2 is less than or equal to the bonding yield evaluation index Lpz < the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in a critical state (i.e., there is a local yield risk). At the moment, an optimized feedback report of the design is provided for a design team, a specific edge area needing to be improved is pointed out, and special optimized design is carried out on a height gradual change transition layer from a non-visual area to a visual area; If the bonding yield evaluation index Lpz is smaller than the second yield threshold W2, it indicates that the bonding yield of the current module layout design is in an excellent state, the interface is continuous and smooth, and the OCA optical adhesive can completely fill the visible area. At this time, a feedback report of the design is provided to the design team, the stacking scheme of the whole structure is affirmed, and then a final module layout drawing for mass production test production is output.

Description

Laminating module wiring system based on overall arrangement design Technical Field The invention relates to the technical field of liquid crystal display devices and manufacturing processes, in particular to a fitting module wiring system based on layout design. Background The liquid crystal display module is generally formed by stacking a liquid crystal panel, a polarizer, a backlight source, a driving circuit and the like, and image display is realized by controlling the orientation of liquid crystal molecules between an upper substrate and a lower substrate. Along with the continuous improvement of the requirements of smart phones, tablet computers and vehicle-mounted display terminals on display effects, an optical full-lamination process is widely adopted to reduce reflection and improve contrast and visibility. In the process, the OCA optical adhesive is used for firmly attaching the cover plate or the touch panel to the liquid crystal display module, and the filling uniformity and the interface quality of the OCA optical adhesive directly influence the optical performance and the appearance quality of the display module. However, in the conventional structural design, there is often a height difference between the upper polarizer and the surrounding or adjacent liquid crystal display module structure (e.g. frame, supporting structure, etc.), which forms a step. The OCA optical adhesive needs to span the level difference region in the bonding process, and is difficult to fully fill the level difference gap due to the limitation of the conditions such as the thickness, the fluidity and the bonding pressure of the adhesive layer, so that partial gaps which are not completely covered are easily generated near the level difference, and particularly, the position close to the visible region is more obvious. The prior art generally attempts to remedy by adjusting the lamination process parameters, such as increasing the lamination pressure, extending the lamination time, or increasing the process temperature, in an effort to increase the flowability and filling capacity of the OCA, but these measures are highly sensitive to material lot, environmental conditions, and equipment conditions, narrow process window, and poor mass production consistency. Once improper control is performed, not only bubble defects can still be generated in a visible area to influence the display appearance and the light transmittance, but also new problems such as glue overflow, local stress concentration and the like can be introduced, so that the reliability and the yield of the product are difficult to ensure stably. Disclosure of Invention The present invention is directed to a layout-based bonding module wiring system, so as to solve the problems set forth in the background art. In order to achieve the above purpose, the present invention provides the following technical solutions: A layout-based conformable module routing system, comprising: the virtual structure stacking module is used for carrying out three-dimensional equal proportion modeling on each functional layer, peripheral wiring and upper polaroid in the preset liquid crystal display module, creating a visual attaching module structure demonstration model for a designer, and carrying out data display on the three-dimensional appearance of the simulated OCA optical adhesive attaching interface; The layout parameter acquisition module is used for monitoring and recording the height of the outer surface of the upper polaroid and the height data of the peripheral structures of the adjacent liquid crystal display modules in real time when the system performs structure stacking wiring design so as to construct a height proportioning state set, and monitoring and recording OCA colloid mobility performance data under different height proportioning in real time so as to construct a fluid filling set; the data processing module is used for preprocessing data of the height proportioning state set and the fluid filling set, and then transmitting the data to the cloud platform for data standardization processing; The level difference parallel analysis module is used for analyzing the relative height difference between the outer surface of the upper polaroid and the attaching reference surface of the liquid crystal display module according to the height proportioning state set so as to construct a level difference parallel coefficient Pqx and evaluate the level difference parallel coefficient so as to send out a structure early warning instruction, and after the structure early warning instruction is received, the module layout design interface is monitored and corresponding thickness or position adjustment prompt operation is carried out so as to eliminate the level difference from a structure source; The OCA filling simulation module is used for respectively analyzing dynamic filling states of the OCA optical cement in the visible area and the invisible transition area based