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CN-122018200-A - High heat conduction printing opacity combined material light guide plate and heat dissipation formula high brightness display module assembly

CN122018200ACN 122018200 ACN122018200 ACN 122018200ACN-122018200-A

Abstract

The invention discloses a high-heat-conductivity light-transmitting composite material light guide plate and a heat-dissipation type high-brightness display module, wherein the light guide plate is formed by compositing 10% -20% by volume of surface modified nano hexagonal boron nitride and polymethyl methacrylate, the light transmittance is more than or equal to 90%, the heat conductivity coefficient is more than or equal to 2.0W/(m.K), a heat-conducting micro-channel is arranged in the light guide plate, a light-conducting micro-structure is integrated on the surface of the light guide plate, the display module comprises an aluminum alloy frame and the light guide plate, the aluminum alloy frame is integrally formed with a micro-channel heat-dissipation structure through 3D printing, and the heat of an LED lamp strip is efficiently dissipated through the heat-conducting micro-channel of the light guide plate and the micro-channel heat-dissipation structure of the frame in sequence. According to the invention, through the cooperative innovation of the material and the structure, the light guide plate has high light transmittance and high heat conductivity, a low thermal resistance heat dissipation path is constructed, the heat dissipation efficiency of the LED is obviously improved, the junction temperature is reduced by more than 20 ℃, the high brightness, long service life and light weight of the display module are realized, and the light guide plate is suitable for the fields of vehicle-mounted, industrial control and high-end consumer electronics.

Inventors

  • ZHANG CHANGXING
  • HUANG XIAOYANG

Assignees

  • 溢洋光电（深圳）有限公司

Dates

Publication Date
20260512
Application Date
20260408

Claims (10)

  1. 1. A high-heat-conductivity light-transmitting composite material light guide plate is characterized by comprising a light guide plate, wherein the light guide plate is formed by compounding a high-heat-conductivity ceramic material and an optical polymer material, the high-heat-conductivity ceramic material is surface-modified nano-level hexagonal boron nitride, the optical polymer material is polymethyl methacrylate, the volume fraction of the nano-level hexagonal boron nitride is 10% -20%, the light transmittance of the light guide plate is more than or equal to 90%, the in-plane heat conductivity coefficient is more than or equal to 2.0W/(m.K), heat-conductivity micro channels are arranged in the lower layer of the light guide plate and extend from the light inlet surface to the edge side of the light guide plate, and a light guide microstructure is integrated on the upper surface of the light guide plate substrate.
  2. 2. The high thermal conductivity light transmitting composite material light guide plate according to claim 1, wherein the light guide plate comprises an upper layer, a middle layer and a lower layer which are sequentially arranged from top to bottom; The upper layer is a light-emitting layer with the thickness of 0.3-0.7mm, and the surface of the upper layer is integrated with the light guide microstructure; The middle layer is a transition layer with the thickness of 0.2-0.4mm and is used for separating the light guide microstructure and the heat conduction micro-channel; the lower layer is a heat dissipation layer with the thickness of 1.2-1.7mm, and the heat conduction micro-channel is arranged in the lower layer.
  3. 3. The light guide plate made of the high-heat-conductivity and light-transmitting composite material according to claim 1, wherein the heat-conducting micro-channels are round hollow channels with the diameters of 0.1-1.0mm and the pitches of 1-3mm and are longitudinally and parallelly distributed.
  4. 4. A method for preparing the high-thermal-conductivity light-transmitting composite material light guide plate as claimed in any one of claims 1 to 3, comprising the following steps: S1, placing polymethyl methacrylate particles into a vacuum drying oven, setting the temperature to be 80 ℃ and the drying time to be 4-8 hours, providing nano hexagonal boron nitride powder, wherein the particle size of the nano hexagonal boron nitride powder is 50-200nm, the thickness of a sheet layer is 10-50nm, carrying out surface modification treatment on the nano hexagonal boron nitride powder by adopting a silane coupling agent, wherein the modification condition is that the nano hexagonal boron nitride powder is stirred for 2 hours at the temperature of 80 ℃ and then washed and dried, placing the modified hexagonal boron nitride powder into the vacuum drying oven, setting the temperature to be 80 ℃ and the drying time to be 4-8 hours, and grinding and sieving the obtained product by a 200-300-mesh sieve to obtain modified hexagonal boron nitride nano powder; S2, adding the modified hexagonal boron nitride nano powder treated in the step S1 and polymethyl methacrylate particles into a high-speed mixer according to the volume ratio of 10% -20% to 80% -90%, mixing for 10-15 minutes at the rotating speed of 1000-1500rpm, adding the mixed materials into a double-screw extruder for melt blending, setting the temperature of the double-screw extruder to be 180-200 ℃ in one area, gradually increasing the temperature of the double-screw extruder to 220-240 ℃ in two areas to five areas, and the rotating speed of the screw to be 100-150rpm, and keeping for 2-3 minutes; And S3, drying the composite granules obtained in the step S2, and integrally forming the light guide plate with the light guide microstructure and the heat conduction micro-channels through an injection molding process or a photo-curing 3D printing process.
  5. 5. The method for preparing the light guide plate made of the high-heat-conductivity light-transmitting composite material, as claimed in claim 4, is characterized in that in the step S3, the injection molding process comprises the steps of drying composite granules at 80 ℃ for 4-6 hours, setting the temperature of a charging barrel to 220-240 ℃ by adopting a high-precision injection molding machine, setting the injection pressure to 80-100MPa, setting the injection speed to 60-100mm/S, setting the pressure maintaining pressure to 70-80% of the injection pressure, setting the pressure maintaining time to 5-10 seconds, setting the mold temperature to 65-85 ℃ and setting the cooling time to 10-20 seconds, molding the heat-conducting micro-channels by adopting a mold core pulling mechanism, and drawing the core pulling mechanism at a speed of 3-8mm/S during demolding to ensure that the inner walls of the channels are smooth and free from collapse.
  6. 6. The method for preparing the light guide plate made of the high-heat-conductivity light-transmitting composite materials, according to claim 4, is characterized in that in the step S3, the photocuring 3D printing process comprises the steps of mixing surface-modified hexagonal boron nitride powder with liquid polymethyl methacrylate according to the volume ratio of 10% -20% to 80% -90%, stirring at a high speed for 20-40 minutes, conducting ultrasonic dispersion for 40-80 minutes to obtain a photocuring liquid resin material with the solid content of less than or equal to 30%, setting a laser wavelength of 405nm by using an industrial SLA (laser light curing) printer, conducting printing by introducing a preset model at the laser power of 400-600mW at the scanning speed of 1500-2500mm/S and the layer thickness of 15-30 mu m, conducting ultrasonic cleaning for 5-15 minutes by using absolute ethyl alcohol after printing, removing uncured resin, conducting post-curing for 20-40 minutes in a UV curing box at the wavelength of 365nm, and obtaining the finished light guide plate.
  7. 7. The utility model provides a heat dissipation formula highlight display module assembly which characterized in that includes: The metal frame is integrally formed by adopting an additive manufacturing process and comprises a bottom wall and a side wall arranged around the bottom wall, the bottom wall and the side wall jointly enclose a mounting concave cavity, a micro-channel heat dissipation structure is arranged in the metal frame, and the metal frame is made of one or a combination of more of aluminum alloy, copper alloy, magnesium alloy or titanium alloy; the LED light bar is arranged on the inner surface of the side wall of the metal frame; And the high thermal conductivity light transmitting composite light guide plate as claimed in any one of claims 1 to 3; The light guide plate is arranged in the installation concave cavity, the light incident surface of the light guide plate is clung to the light emitting side of the LED light bar, and heat generated by the LED light bar is conducted and emitted through the heat conduction micro-channel of the light guide plate and the micro-channel heat dissipation structure of the metal frame in sequence.
  8. 8. The heat dissipation type high-brightness display module set according to claim 7, wherein the number of the LED light bars is one, two or four, and the LED light bars are respectively arranged on one side, the opposite sides or the periphery of the side wall, the LED light bars are fixed on the inner surface of the side wall of the metal frame through heat conduction double-sided adhesive tapes, and the LED light bars are an aluminum substrate or a ceramic substrate.
  9. 9. The heat dissipation type high-brightness display module according to claim 7, wherein the micro-channel heat dissipation structure of the metal frame comprises micro-channels arranged inside the bottom wall and/or the side wall, and heat dissipation fins arranged on the outer surface of the side wall.
  10. 10. The heat dissipation type high-brightness display module according to claim 7, further comprising a TFT display screen, a brightness enhancement film component and a reflecting film, wherein the TFT display screen, the brightness enhancement film component, the light guide plate and the reflecting film are sequentially overlapped in the installation cavity from top to bottom, and the brightness enhancement film component comprises a double brightness enhancement film, an upper prism film, a lower prism film and a diffusing film which are sequentially overlapped from top to bottom.

Description

High heat conduction printing opacity combined material light guide plate and heat dissipation formula high brightness display module assembly Technical Field The invention relates to the technical field of display modules, in particular to a high-heat-conductivity light-transmitting composite material light guide plate and a heat-dissipation type high-brightness display module provided with the light guide plate. Background With the development of display technology, the requirements of users on the brightness of the screen are higher and higher, especially in the fields of vehicle-mounted display, industrial control display and high-end consumer electronics, such as outdoor highlighting and HDR display, the screen is required to have clear visibility in a strong light environment, and the backlight source is required to be driven by adopting LEDs with higher power. However, high power driving entails a larger amount of heat generation. In the traditional display module assembly structure, PMMA or PC materials are adopted for the light guide plate, the heat conductivity coefficient is extremely low and is about 0.2W/(m.K), heat generated by the LEDs cannot be effectively conducted, common plastic materials are adopted for the backlight plastic frame, the heat conduction capacity is poor, heat generated by the LED lamp plate cannot be rapidly LED out, the heat is easily accumulated nearby the LEDs, the LED light attenuation is serious, the liquid crystal materials are accelerated to age, and the service life of the display module assembly is finally shortened. The existing light guide plate material cannot give consideration to light transmission and heat conduction performance, such as good heat conduction performance of a metal aluminum substrate but light impermeability, and PMMA or PC plastic substrate has good light transmission performance but extremely poor heat conduction performance, and cannot meet the heat dissipation requirement of a high-brightness module. In order to solve the heat dissipation problem, the prior art generally needs to additionally add a heat sink, a heat pipe or a fan, which results in a bulky structure and increased cost, and is not in line with the trend of light and thin. At present, the industry lacks an integrated composite material for manufacturing a light guide plate capable of efficiently guiding light and efficiently conducting heat and dissipating heat, and a heat-dissipating optimization structural scheme of a high-brightness display module combined with the light guide plate. Disclosure of Invention In view of this, this technical scheme aims at solving the technical pain point that light guide and heat dissipation function are separated, thermal resistance is big, the life-span is short, the light efficiency is low in the current TFT display module assembly, has proposed a high heat conduction printing opacity combined material light guide plate to and be equipped with this light guide plate and heat radiation structure's heat dissipation formula hi-lite display module assembly, thereby realize that the light guide plate of module possesses light guide and heat dissipation simultaneously, give consideration to the demand that the module is high in brightness, heat dispersion is good, and frivolity is thinned. The invention provides a light guide plate made of a high-heat-conductivity light-transmitting composite material, which is formed by compounding a high-heat-conductivity ceramic material and an optical polymer material, wherein the high-heat-conductivity ceramic material is surface-modified nano hexagonal boron nitride, the optical polymer material is polymethyl methacrylate, the volume fraction of the nano hexagonal boron nitride is 10% -20%, the light transmittance of the light guide plate is more than or equal to 90%, the in-plane heat conductivity coefficient is more than or equal to 2.0W/(m.K), heat-conductivity micro channels are arranged in the lower layer of the light guide plate, extend from the light inlet surface to the edge side of the light guide plate, and a light guide microstructure is integrated on the upper surface of the light guide plate substrate. Further, the light guide plate comprises an upper layer, a middle layer and a lower layer which are sequentially arranged from top to bottom, wherein the upper layer is a light emitting layer with the thickness of 0.3-0.7mm, the light guide microstructure is integrated on the surface of the upper layer, the middle layer is a transition layer with the thickness of 0.2-0.4mm and is used for separating the light guide microstructure and the heat conduction micro-channel, the lower layer is a heat dissipation layer with the thickness of 1.2-1.7mm, and the heat conduction micro-channel is arranged in the lower layer. Preferably, the heat conduction micro-channel is a round hollow channel, the diameter of the round hollow channel is 0.1-1.0mm, the distance is 1-3mm, and the round hollow channel is l