CN-122018203-A - Display module and display device

Abstract

The display module can comprise a display panel, a second flip chip film, at least two first flip chip films and at least two rigid circuit boards, wherein the first flip chip film is connected between each rigid circuit board and the display panel, and the second flip chip film is connected between at least part of adjacent two rigid circuit boards. The display module can reduce signal attenuation of at least part of signals on the connector and the flexible circuit board, improve eye pattern quality of a large-size high-resolution display panel, reduce cost by replacing the connector and the flexible circuit board with the second flip chip film, facilitate ultrathin design of the display device, and enable the second flip chip film and the first flip chip film to be subjected to binding process simultaneously, thereby facilitating productivity improvement.

Inventors

• PENG ZHAOYU
• ZHANG YINLONG
• LI SENWANG
• LIU JIANTAO
• MA WENPENG
• ZHOU LIUGANG
• Liu rongcheng
• Cui mingzhu

Assignees

• 北京京东方显示技术有限公司
• 京东方科技集团股份有限公司

Dates

Publication Date

20260512

Application Date

20241112

Claims (18)

1. 1. A display module, comprising: a display panel; At least two first flip chip films; At least two rigid circuit boards, wherein the first flip chip film is connected between each rigid circuit board and the display panel; and the second flip chip film is connected between at least part of adjacent two rigid circuit boards.
2. 2. The display module of claim 1, wherein the second flip-chip film comprises: a first portion connected to one of the adjacent two rigid circuit boards; a second portion connected to the other of the adjacent two rigid circuit boards; And the connecting part is connected between the first part and the second part.
3. 3. The display module assembly of claim 2, wherein a first connection binding pin is disposed at an end of the connection portion near the display panel, a panel binding pin is disposed at an end of the display panel near the second flip chip film, and the first connection binding pin is in binding connection with the panel binding pin.
4. 4. A display module according to claim 3, wherein the first connection bonding pin and the panel bonding pin are dummy bonding pins.
5. 5. The display module of claim 2, wherein a corner portion formed by the connection of the first portion and the connection portion is provided with a chamfer, and a corner portion formed by the connection of the second portion and the connection portion is provided with a chamfer.
6. 6. The display module of claim 2, wherein the second flip-chip film is provided with differential signal traces.
7. 7. The display module of claim 1, wherein the display panel is provided with connection traces, and the second flip-chip film comprises: The first part is connected between one of the two adjacent rigid circuit boards and the display panel and is bound to one end of the connecting wire; and the second part is connected between the other of the two adjacent rigid circuit boards and the display panel and is bound to the other end of the connecting wire.
8. 8. The display module of claim 7, wherein the first portion and the adjacent first flip-chip film are configured as an integral structure to form a comprehensive flip-chip film, and/or wherein the second portion and the adjacent first flip-chip film are configured as an integral structure to form a comprehensive flip-chip film.
9. 9. The display module of claim 8, wherein the end of the integrated flip-chip film connected to the display panel is a first end, the end of the integrated flip-chip film connected to the rigid circuit board is a second end, the width of the first end along a first direction is smaller than the width of the second end along the first direction, the first direction intersects with a second direction, and the second direction is the connection direction of the display panel, the first flip-chip film, and the rigid circuit board.
10. 10. The display module of claim 9, wherein a plurality of first binding pins are arranged at the first end portion, a plurality of second binding pins are arranged at the second end portion, a plurality of third binding pins are arranged on the display panel and are in binding connection with the first binding pins, the pitch and the width of the third binding pins are correspondingly the same as those of the first binding pins, a plurality of fourth binding pins are arranged on the rigid circuit board and are in binding connection with the second binding pins, the pitch and the width of the fourth binding pins are correspondingly the same as those of the second binding pins, the pitch of the first binding pins is smaller than that of the second binding pins, and the width of the first binding pins is smaller than that of the second binding pins.
11. 11. The display module of claim 8, wherein the connection trace comprises a first differential signal trace.
12. 12. The display module of claim 11, wherein at least two first flip-chip films are connected between the same rigid circuit board and the display panel, the first flip-chip film closest to the adjacent rigid circuit board is a composite flip-chip film, one of the composite flip-chip films is integrally formed with the first portion of the second flip-chip film, and the other of the composite flip-chip films is integrally formed with the second portion of the second flip-chip film.
13. 13. The display module of claim 12, wherein the display module further comprises: The central control board is electrically connected with the two adjacent rigid circuit boards, the second flip-chip film is not connected between the two adjacent rigid circuit boards connected with the central control board, or the central control board is electrically connected with one rigid circuit board.
14. 14. The display module of claim 13, wherein a first rigid circuit board is adjacent to the central control board and a second rigid circuit board is adjacent to the central control board, the first portion is connected between the first rigid circuit board and the display panel, and the second portion is connected between the second rigid circuit board and the display panel; A second differential signal wire is arranged on the first part, a third differential signal wire is arranged on the second part, and the second differential signal wire and the third differential signal wire are connected to two opposite ends of the first differential signal wire; A fourth differential signal wire is arranged on the first rigid circuit board, and one end of the fourth differential signal wire is connected with the central control board; A fifth differential signal wire is arranged on the second rigid circuit board, one end of the fifth differential signal wire is connected with the third differential signal wire, and the other end of the fifth differential signal wire is connected with the first flip-chip film connected with the second rigid circuit board.
15. 15. The display module of claim 6 or 11, wherein the display module further comprises: At least two connectors are arranged on at least two rigid circuit boards in a one-to-one correspondence manner; and the flexible circuit board is connected between two adjacent connectors.
16. 16. The display module of claim 15, wherein the flexible circuit board does not extend beyond the rigid circuit board in a second direction, the second direction being a connection direction of the display panel, the first flip chip film, and the rigid circuit board.
17. 17. The display module assembly of any one of claims 1-14, wherein, And a welding-resistant film is arranged on the first flip-chip film and the second flip-chip film.
18. 18. A display device, comprising: a display module according to any one of claims 1 to 17.

Description

Display module and display device Technical Field The disclosure relates to the technical field of display, in particular to a display module and a display device. Background In the display industry, no matter TFT-LCD (thin film transistor liquid crystal display) or OLED (organic light emitting diode display), an external circuit is required to realize display driving, and the external circuit is not separated from a printed circuit board (PCB, printed Circuit Board). The existing flexible circuit board FPC mounting mode is that a flip type connector is welded on a PCB, and then a production line worker manually plugs the flexible circuit board FPC on the connector. In the actual production process, errors such as oblique insertion and reverse insertion are easy to occur in manual operation of production line workers, lighting abnormality and repeated operation are caused, the manual operation consumes more man hours, the yield of products is affected, the productivity is reduced, and signals are seriously attenuated after passing through a flexible circuit board FPC and a connector, so that the quality of an eye pattern is poor. It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art. Disclosure of Invention The present disclosure aims to overcome the shortcomings of the prior art and provide a display module and a display device. According to an aspect of the present disclosure, there is provided a display module including: a display panel; At least two first flip chip films; At least two rigid circuit boards, wherein the first flip chip film is connected between each rigid circuit board and the display panel; and the second flip chip film is connected between at least part of adjacent two rigid circuit boards. In one exemplary embodiment of the present disclosure, the second flip chip film includes: a first portion connected to one of the adjacent two rigid circuit boards; a second portion connected to the other of the adjacent two rigid circuit boards; And the connecting part is connected between the first part and the second part. In an exemplary embodiment of the disclosure, a first connection binding pin is disposed at an end portion of the connection portion, which is close to the display panel, and a panel binding pin is disposed at an end portion of the display panel, which is close to the second flip chip film, and the first connection binding pin is in binding connection with the panel binding pin. In an exemplary embodiment of the present disclosure, the first connection bonding pin and the panel bonding pin are both dummy bonding pins. In an exemplary embodiment of the present disclosure, a corner portion formed by the connection of the first portion and the connection portion is provided with a chamfer, and a corner portion formed by the connection of the second portion and the connection portion is provided with a chamfer. In one exemplary embodiment of the present disclosure, the differential signal traces are disposed on the second flip chip film. In an exemplary embodiment of the present disclosure, the display panel is provided with connection traces thereon, and the second flip chip film includes: The first part is connected between one of the two adjacent rigid circuit boards and the display panel and is bound to one end of the connecting wire; and the second part is connected between the other of the two adjacent rigid circuit boards and the display panel and is bound to the other end of the connecting wire. In one exemplary embodiment of the present disclosure, the first portion and the adjacent first flip-chip film are disposed as an integral structure to form a composite flip-chip film, and/or the second portion and the adjacent first flip-chip film are disposed as an integral structure to form a composite flip-chip film. In an exemplary embodiment of the disclosure, an end of the integrated flip chip film connected to the display panel is a first end, an end of the integrated flip chip film connected to the rigid circuit board is a second end, a width of the first end along a first direction is smaller than a width of the second end along the first direction, the first direction intersects with a second direction, and the second direction is a connection direction of the display panel, the first flip chip film, and the rigid circuit board. In an exemplary embodiment of the disclosure, a plurality of first bonding pins are arranged at the first end portion, a plurality of second bonding pins are arranged at the second end portion, a plurality of third bonding pins are arranged on the display panel and are in bonding connection with the first bonding pins, the pitch and the width of the third bonding pins are correspondingly the same as those of the first bonding pins,