CN-122018230-A - Photosensitive resin composition, photosensitive resin layer, and semiconductor device using the photosensitive resin layer

Abstract

A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided, the photosensitive resin composition including an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, wherein the alkali-soluble resin includes a polymer including a structural unit represented by chemical formula 1 and a polymer including a structural unit represented by chemical formula 2, and includes a polymer including a structural unit represented by chemical formula 1 and a polymer including a structural unit represented by chemical formula 2 in a weight ratio of about 1:1 to about 1:2. In chemical formula 1 and chemical formula 2, each substituent is as defined in the detailed description. Chemical formula 1 Chemical formula 2

Inventors

• Pu Bingxu
• JIN SHANGZHU
• Bai Zhaijin
• JIANG XIGUI
• JIN MINJIAN
• JIANG ZHENXI
• Hong Zhongfan
• JIN ZHIYOU
• LIU HUJUN

Assignees

• 三星SDI株式会社

Dates

Publication Date

20260512

Application Date

20250815

Priority Date

20241111

Claims (10)

1. 1. A photosensitive resin composition comprising: An alkali-soluble resin; A photopolymerizable compound; A photoinitiator, and The solvent is used for the preparation of the aqueous solution, Wherein the alkali-soluble resin comprises a polymer containing a structural unit represented by chemical formula 1 and a polymer containing a structural unit represented by chemical formula 2, and comprises the polymer containing the structural unit represented by chemical formula 1 and the polymer containing the structural unit represented by chemical formula 2 in a weight ratio of 1:1 to 1:2: Chemical formula 1 Chemical formula 2 Wherein in chemical formula 1 and chemical formula 2, L1 is a substituted or unsubstituted C1 to C20 alkylene, a substituted or unsubstituted C6 to C20 arylene, or a combination thereof, L2 is a single bond, -O-, -S-, -c≡c-, -C (=o) -, -NR0-, -substituted or unsubstituted C1 to C20 alkylene, substituted or unsubstituted C6 to C20 arylene, substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof, wherein R0 is substituted or unsubstituted C1 to C10 alkyl, L3 is-O-, -S-, -c≡c-, -C (=o) -, -NR0-, or a combination thereof, wherein R0 is a substituted or unsubstituted C1 to C10 alkyl group, and R1 and R2 are each independently represented by the formula R, Chemical formula R Wherein in the formula R, R3 is a (meth) acrylate group, and L4 is a substituted or unsubstituted C1 to C20 alkylene group.
2. 2. The photosensitive resin composition according to claim 1, wherein: the polymer comprising the structural unit represented by chemical formula 1 comprises a functional group represented by chemical formula S at least one of both ends: Chemical formula S
3. 3. The photosensitive resin composition according to claim 2, wherein: The polymer including the structural unit represented by chemical formula 1 includes a functional group represented by chemical formula S at one of two terminals, and the other of the two terminals is a hydrogen atom.
4. 4. The photosensitive resin composition according to claim 1, wherein: The photoinitiator is included in an amount of 2 to 5wt% based on the total amount of the photosensitive resin composition.
5. 5. The photosensitive resin composition according to claim 1, wherein: The photosensitive resin composition comprises a photosensitive resin composition containing, Based on 100 parts by weight of the resin, From 5 parts by weight to 20 parts by weight of the photopolymerizable compound, 3 To 20 parts by weight of the photoinitiator, and 100 To 500 parts by weight of the solvent.
6. 6. The photosensitive resin composition according to claim 1, wherein: the photosensitive resin composition further comprises a photosensitizer, a radical scavenger, a silane-based coupling agent, an organic acid, or a combination thereof.
7. 7. The photosensitive resin composition according to claim 1, wherein: the photosensitive resin composition is a negative photosensitive resin composition.
8. 8. A photosensitive resin layer produced using the photosensitive resin composition according to claim 1.
9. 9. The photosensitive resin layer according to claim 8, wherein: The photosensitive resin layer is a semiconductor rewiring layer insulating film.
10. 10. A semiconductor device comprising the photosensitive resin layer according to claim 8.

Description

Photosensitive resin composition, photosensitive resin layer, and semiconductor device using the photosensitive resin layer Cross reference to related applications The present application claims priority and rights of korean patent application No. 10-2024-0159380 filed in the korean intellectual property office on 11/2024, the entire contents of which are incorporated herein by reference. Technical Field Embodiments of the present disclosure relate to a photosensitive resin composition, a photosensitive resin layer using the same, and a semiconductor device. Background With the advent of the super-connection smart age, such as artificial intelligence, big data, internet of things (internet of things, ioT) devices, automated driving automobiles (self-DRIVING CAR), remote medical (remote MEDICAL TREATMENT), the development and popularity (distribution) of various electronic devices, such as smartphones, is accelerating. Therefore, fifth generation (fifth generation, 5G) communication technologies capable of wirelessly transmitting ultra-high speed and large capacity data are becoming particularly important, and in addition, the market size (market size) of communication component materials (communication component material) and components (component element) used in communication devices including smartphones is expected to grow exponentially from 2020 to 2026 and reach approximately 23 billions dollars (about 14,000 tons/year). In order to minimize or reduce propagation losses, dielectric substrates used in the frequency (below 6GHz and 28 GHz) bands of 5G communications utilize low dielectric constants (DIELECTRIC CONSTANT, dk) and low dielectric loss factors (DIELECTRIC LOSS FACTOR, df), which may not be satisfied by Polyimides (PI) primarily used for conventional fourth-generation (fourth generation, 4G) Long-Term Evolution (LTE) communications. Analysts Guo Ming (mig-Chi Kuo) in the world of the world (TF International) have expected that in 2018, "modified polyimide (modified polyimide, MPI) will replace liquid crystal polymer (liquid crystalpolymer, LCP) to become the dominant antenna technology for the new iPhone model in the next half year," meaning that since the Flexible copper clad laminate (Flexible copper CLAD LAMINATE, FCCL) manufacturing process is constructed from a production line (existing process) using polyimide film, the module manufacturer would prefer to perform the existing process rather than modify the equipment to a process using LCP, and thus he would like Modified PI (MPI) to be rapidly developed and applied. In addition, this suggests that MPI for compensating or solving the disadvantages of LCP is already under development. Recently, there is a rapid increase in demand for developing polyimide precursor resins (polyimide precursor resin) or other types (or kinds) of resins having low dielectric constants (Dk) and dielectric dissipation factors (Df). Disclosure of Invention Some example embodiments of the present disclosure provide a photosensitive resin composition including an alkali-soluble resin having a low dielectric constant (Dk) and a low dielectric loss factor (Df). Some example embodiments provide a photosensitive resin layer manufactured using a photosensitive resin composition. Some example embodiments provide a semiconductor device including a photosensitive resin layer. According to some example embodiments, a photosensitive resin composition includes an alkali-soluble resin, a photopolymerizable compound, a photoinitiator, and a solvent, wherein the alkali-soluble resin includes a polymer including a structural unit represented by chemical formula 1 and a polymer including a structural unit represented by chemical formula 2, and includes the polymer including a structural unit represented by chemical formula 1 and the polymer including a structural unit represented by chemical formula 2 in a weight ratio of about 1:1 to about 1:2. Chemical formula 1 Chemical formula 2 In the chemical formula 1 and the chemical formula 2, L 1 is a substituted or unsubstituted C1 to C20 alkylene, a substituted or unsubstituted C6 to C20 arylene, or a combination thereof, L 2 is a single bond (e.g., a single covalent bond), -O-, S-, c≡c-, C (=o) -, -NR 0 -, where R 0 is a substituted or unsubstituted C1 to C10 alkyl group), a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C6 to C20 arylene group, a substituted or unsubstituted C2 to C20 heterocyclic linking group, or a combination thereof, L 3 is-O-, -S-, -c≡c-, -C (=o) -, -NR 0 -, (wherein R 0 is a substituted or unsubstituted C1 to C10 alkyl group), or a combination thereof, and R 1 and R 2 are each independently represented by the formula R, Chemical formula R Wherein in the formula R, R 3 is a (meth) acrylate group, and L 4 is a substituted or unsubstituted C1 to C20 alkylene group. The polymer including the structural unit represented by chemical formula 1 may include a functional group rep