CN-122018236-A - Convenient wafer gluing equipment and gluing method

CN122018236ACN 122018236 ACN122018236 ACN 122018236ACN-122018236-A

Abstract

The invention discloses convenient wafer gluing equipment and a gluing method, which relate to the technical field of wafer processing equipment and comprise a rotary workbench, wherein a plurality of placing grooves matched with wafer workpieces are formed in the rotary workbench, a plurality of placing plates which are abutted to the lower parts of the wafer workpieces are arranged at the bottoms of the placing grooves, the placing grooves move along with the rotary workbench and sequentially pass through a feeding position, a gluing position and a discharging position, a lifting rotary machine table is arranged below the gluing position, a gluing system is arranged above the lifting rotary machine table, and the periphery of the lifting rotary machine table avoids the placing plates and jacks up the wafer workpieces. The automatic glue spreading device can improve the automation degree of the glue spreading process while guaranteeing the positioning effect, thereby achieving the effect of improving the mass production efficiency.

Inventors

TANG WEIDONG
ZHOU XIAOJUAN

Assignees

苏州杉树园半导体设备有限公司

Dates

Publication Date: 20260512
Application Date: 20260209

Claims (10)

1. A convenient wafer gluing device is characterized by comprising a rotary workbench, wherein a plurality of placing grooves matched with a wafer workpiece are formed in the rotary workbench, a plurality of placing plates which are abutted to the lower portion of the wafer workpiece are arranged at the bottom of the placing grooves, the placing grooves move along with the rotary workbench and sequentially pass through a feeding position, a gluing position and a discharging position, a lifting rotary machine table is arranged below the gluing position, a gluing system is arranged above the gluing position, and the periphery of the lifting rotary machine table avoids the placing plates and jacks up the wafer workpiece.
2. A convenient wafer glue application apparatus as in claim 1 wherein the placement plate is coupled to a placement drive that drives the placement plate into and out of the placement slot.
3. The apparatus of claim 2, wherein the placement drive comprises a rotating toothed plate having an inner periphery formed with a plurality of driven teeth and engaged therewith, and the placement plate is coupled to the driven teeth.
4. A convenient wafer gumming device as set forth in claim 3, wherein the outer periphery of said rotary toothed disc is provided with an outer tooth form and is engaged with a driving tooth connected to a motor for driving the rotary toothed disc to rotate.
5. The apparatus of claim 4, wherein the feeding, coating and discharging positions are provided in plural numbers, and a driving tooth drives the rotary toothed plate corresponding to the feeding/coating/discharging position to rotate together.
6. A convenient wafer gumming device as set forth in claim 2, wherein the blanking station comprises a blanking conveyor below the placement tank for the wafer workpiece to exit through the blanking conveyor after the placement plate exits the placement tank.
7. The wafer glue coating equipment is characterized in that the feeding level comprises a feeding conveyor belt and a lifting table, wherein the feeding conveyor belt is positioned below the placing groove, the feeding conveyor belt is abutted to two sides below the wafer workpiece, the lifting table is positioned below the middle part of the wafer workpiece, and the wafer workpiece is lifted into the placing groove from the feeding conveyor table.
8. The wafer glue spreading device according to claim 7, wherein the feeding conveyor belt is further provided with a corresponding arc groove, the corresponding side of the wafer workpiece is correspondingly placed in the arc groove, and the wafer workpiece is positioned and moved above the jacking table.
9. The apparatus of claim 1, wherein the wafer workpiece is inspected or dried in the position to be positioned.
10. A glue spreading method, which adopts the convenient wafer glue spreading equipment as in claim 1, and is characterized by comprising the following steps that a wafer workpiece is positioned and placed in a placing groove at a loading position and is supported by a placing plate; then the rotary workbench rotates, the wafer workpiece moves to a gluing position along with the rotary workbench, the wafer workpiece is jacked up at the gluing position through the lifting rotary machine, and the rotary machine adsorbs the wafer workpiece and drives the wafer workpiece to rotate when the gluing system realizes gluing and lifting, so that glue homogenizing is realized; Finally, the rotary table continues to rotate, and the wafer workpiece moves to a discharging position to be taken out.

Description

Convenient wafer gluing equipment and gluing method Technical Field The invention relates to the technical field of wafer processing equipment, in particular to convenient wafer gluing equipment and a gluing method. Background Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer; The photoresist is uniformly coated on the surface of the wafer by a photoresist coater, a high-resolution photosensitive layer is provided for subsequent exposure, development and other steps, and the wafer is fixed on a rotary platform in the photoresist coating process, and centrifugal force is generated by high-speed rotation, so that the photoresist is uniformly spread and a film with controllable thickness is formed, but the photoresist coating is generally low in production efficiency and inconvenient for mass production. Disclosure of Invention The invention aims to provide convenient wafer gluing equipment and a gluing method, which can improve the automation degree of a gluing process while ensuring the positioning effect, thereby improving the efficiency of mass production. The technical aim of the invention is realized by the following technical scheme: The utility model provides a convenient wafer rubber coating equipment, includes the swivel work head, is equipped with the standing groove of a plurality of and wafer work piece looks adaptation on the swivel work head, and the standing groove bottom is equipped with a plurality of butt in the placing plate of wafer work piece below, and the standing groove removes and passes through material loading position, rubber coating position and unloading position in proper order along with the swivel work head, and rubber coating position below is equipped with over-and-under type swivel work head, top and is equipped with the rubber coating system, and over-and-under type swivel work head periphery avoids placing plate and jack-up wafer work piece. Still further, the placement plate is connected to a placement drive that drives the placement plate into or out of the placement slot. Further, the placing driving piece comprises a rotating fluted disc, the inner periphery of the rotating fluted disc is provided with an inner tooth shape and meshed with a plurality of driven teeth, and the placing plate is connected with the driven teeth. Further, the periphery of the rotary fluted disc is provided with an outer tooth shape and meshed with a driving tooth, and the driving tooth is connected with a motor for driving the rotary fluted disc to rotate. Furthermore, the feeding position, the gluing position and the discharging position are all provided with a plurality of driving teeth for driving the rotary fluted discs corresponding to the feeding position, the gluing position and the discharging position to rotate together. Still further, the blanking level includes a blanking conveyor located below the placement slot for the wafer workpiece to exit through the blanking conveyor after the placement plate exits the placement slot. Still further, the material loading position is including the material loading conveyer belt and the jacking platform that are located the standing groove below, and material loading conveyer belt butt is in wafer work piece below both sides, and the jacking platform is located wafer work piece middle part below, with the wafer work piece jacking from material loading conveyer table to the standing groove in. Furthermore, the feeding conveyor belt is also provided with a corresponding arc-shaped groove, the corresponding side of the wafer workpiece is correspondingly placed in the arc-shaped groove, and the wafer workpiece is positioned and moved to the upper part of the lifting platform. Furthermore, a position to be positioned is arranged between the gluing position and the discharging position, and the wafer workpiece is detected or dried in the position to be positioned. The invention also discloses a gluing method, which comprises the following steps that the wafer workpiece is positioned and placed in the placing groove at the loading position and is supported by the placing plate; then the rotary workbench rotates, the wafer workpiece moves to a gluing position along with the rotary workbench, the wafer workpiece is jacked up at the gluing position through the lifting rotary machine, and the rotary machine adsorbs the wafer workpiece and drives the wafer workpiece to rotate when the gluing system realizes gluing and lifting, so that glue homogenizing is realized; Finally, the rotary table continues to rotate, and the wafer workpiece moves to a discharging position to be taken out. In summary, the invention has the