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CN-122018443-A - Automatic PCB wiring method, system and storage medium

CN122018443ACN 122018443 ACN122018443 ACN 122018443ACN-122018443-A

Abstract

The embodiment of the invention provides an automatic PCB wiring method, system and storage medium, wherein the method comprises the steps of acquiring multi-dimensional parameters of a PCB to be wired in real time, wherein the multi-dimensional parameters comprise flying line cross interference coefficients, pad spacing and device pad number, the flying line cross interference coefficients represent interference degrees among different flying lines, the pad spacing represents straight line distances among adjacent pads to be wired, the device pad number represents total number of pads to be wired contained in a single device, determining a wiring sequence table of each pad to be wired according to the flying line cross interference coefficients, the pad spacing and the device pad number, and wiring each pad to be wired according to the wiring sequence table to obtain a target PCB. And calculating the wiring priority of each pad to be wired through the multi-dimensional parameters, and sequentially wiring according to the wiring priority, so that the quality of PCB wiring is improved, and the manufacturing cost of the PCB is reduced.

Inventors

  • Ou Bangxiong

Assignees

  • 深圳嘉立创科技集团股份有限公司

Dates

Publication Date
20260512
Application Date
20260414

Claims (10)

  1. 1. An automatic wiring method for a PCB, comprising: Acquiring multi-dimensional parameters of a PCB to be wired in real time, wherein the multi-dimensional parameters comprise flying line cross interference coefficients, pad distances and device pad numbers, the flying line cross interference coefficients represent interference degrees among different flying lines, the pad distances represent linear distances among adjacent pads to be wired, and the device pad numbers represent the total number of the pads to be wired contained in a single device; determining a wiring sequence table of each pad to be wired according to the flying line cross interference coefficient, the pad spacing and the device pad number; and wiring each pad to be wired according to the wiring sequence table to obtain the target PCB.
  2. 2. The automatic PCB routing method of claim 1, wherein the acquiring in real time the multi-dimensional parameters of the PCB board to be routed comprises: Before wiring, acquiring first parameters of the PCB to be wired in real time; In wiring, acquiring a second parameter of the PCB to be wired in real time, and updating the first parameter to the second parameter, wherein the first parameter and the second parameter both represent the multidimensional parameter.
  3. 3. The automatic routing method of PCBs according to claim 1, wherein the calculating of the flying lead cross interference coefficient comprises: Acquiring coordinate information of all flying lines to be distributed; calculating the crossing times of each wire to be distributed and other wires to be distributed according to the coordinate information; and carrying out standardization processing on the crossing times to obtain the flying line cross interference coefficient.
  4. 4. The automatic routing method of PCBs according to claim 1, wherein the calculating of the pad pitch comprises: Acquiring pad coordinates of adjacent pads to be wired; calculating a pad linear distance between adjacent pads to be wired according to the pad coordinates; and carrying out standardization processing on the linear distance of the bonding pads to obtain the bonding pad spacing.
  5. 5. The automatic routing method of PCBs according to claim 1, wherein the calculating of the number of device pads comprises: Acquiring the total number of all pads to be wired of a single device; Calculating the average value of the bonding pads corresponding to the total number of the bonding pads of all devices; and normalizing the total number of the bonding pads and the average bonding pad value to obtain the number of bonding pads of the device.
  6. 6. The automatic routing method of PCBs according to claim 1, wherein the determining a routing order table of each pad to be routed according to the flying lead cross interference coefficient, the pad pitch, and the number of device pads comprises: constructing a preset wiring priority evaluation model, wherein the wiring priority evaluation model is obtained by training in advance; and inputting the flying line cross interference coefficient, the pad spacing and the number of the device pads into the wiring priority evaluation model for calculation to obtain the wiring sequence table of each pad to be wired.
  7. 7. The automatic routing method of PCBs according to claim 6, wherein the method of calculating the routing order table by the routing priority evaluation model comprises: Adjusting a first weight coefficient corresponding to the flying line cross interference coefficient, a second weight coefficient corresponding to the pad spacing and a third weight coefficient corresponding to the number of the device pads according to wiring requirements; Multiplying the flying line cross interference coefficient by the first weight coefficient to obtain a first weight component, multiplying the pad spacing by the second weight coefficient to obtain a second weight component, and multiplying the inverse of the number of the device pads by the third weight coefficient to obtain a third weight component; Superposing the first weight component, the second weight component and the third weight component to obtain a wiring priority value corresponding to the pad to be wired; and sequencing the wiring priority values of the pads to be wired from small to large to obtain the wiring sequence table.
  8. 8. The automatic PCB routing method according to claim 1, wherein the routing each pad to be routed according to the routing order table to obtain the target PCB board includes: wiring the target bonding pad according to the wiring sequence table to obtain a first PCB, wherein the target bonding pad represents a bonding pad to be wired for wiring; Under the condition that all the pads to be wired on the wiring sequence table are uniformly distributed, configuring the first PCB as the target PCB; Under the condition that a pad to be wired exists on the wiring sequence table, the multidimensional parameter is acquired again, and the wiring sequence table is updated; and wiring the next pad to be wired according to the updated wiring sequence table to obtain the first PCB.
  9. 9. A PCB automatic wiring system is characterized by comprising a controller, wherein the controller comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, and the processor realizes the PCB automatic wiring method according to any one of claims 1-8 when executing the computer program.
  10. 10. A computer storage medium having stored thereon computer executable instructions for performing the PCB automated routing method of any one of claims 1-8.

Description

Automatic PCB wiring method, system and storage medium Technical Field The invention relates to the technical field of PCB wiring, in particular to an automatic PCB wiring method, an automatic PCB wiring system and a storage medium. Background The PCB (Printed Circuit Board ) is the core carrier of the electronic device, and its wiring quality directly determines the performance, volume and reliability of the electronic device. In the existing automatic wiring technology of the PCB, most of the automatic wiring technology adopts a random wiring sequence or a fixed wiring sequence to carry out wiring planning, the method does not fully consider the relevance constraint in the wiring process, wiring objects are selected blindly, the reason that the wiring objects occupy reasonable paths in the prior period is easily caused in the subsequent wiring, the wiring areas are forced to bypass, and additional bypass is further generated, meanwhile, the unreasonable wiring sequence can increase the wiring intersection among different layers, so that the number of through holes is greatly increased, the manufacturing cost of the PCB is increased, the electrical performance of the PCB is possibly influenced, and the wiring quality is reduced. Disclosure of Invention The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims. The embodiment of the invention mainly aims to provide an automatic PCB wiring method, an automatic PCB wiring system and a storage medium, which can improve the quality of PCB wiring and reduce the manufacturing cost of a PCB. In a first aspect, an embodiment of the present invention provides an automatic PCB routing method, including: Acquiring multi-dimensional parameters of a PCB to be wired in real time, wherein the multi-dimensional parameters comprise flying line cross interference coefficients, pad distances and device pad numbers, the flying line cross interference coefficients represent interference degrees among different flying lines, the pad distances represent linear distances among adjacent pads to be wired, and the device pad numbers represent the total number of the pads to be wired contained in a single device; determining a wiring sequence table of each pad to be wired according to the flying line cross interference coefficient, the pad spacing and the device pad number; and wiring each pad to be wired according to the wiring sequence table to obtain the target PCB. In some optional embodiments, the acquiring, in real time, the multi-dimensional parameter of the PCB board to be wired includes: Before wiring, acquiring first parameters of the PCB to be wired in real time; In wiring, acquiring a second parameter of the PCB to be wired in real time, and updating the first parameter to the second parameter, wherein the first parameter and the second parameter both represent the multidimensional parameter. In some alternative embodiments, the calculating of the fly-by cross interference coefficient includes: Acquiring coordinate information of all flying lines to be distributed; calculating the crossing times of each wire to be distributed and other wires to be distributed according to the coordinate information; and carrying out standardization processing on the crossing times to obtain the flying line cross interference coefficient. In some alternative embodiments, the calculating of the pad pitch includes: Acquiring pad coordinates of adjacent pads to be wired; calculating a pad linear distance between adjacent pads to be wired according to the pad coordinates; and carrying out standardization processing on the linear distance of the bonding pads to obtain the bonding pad spacing. In some alternative embodiments, the calculating of the device pad number includes: Acquiring the total number of all pads to be wired of a single device; Calculating the average value of the bonding pads corresponding to the total number of the bonding pads of all devices; and normalizing the total number of the bonding pads and the average bonding pad value to obtain the number of bonding pads of the device. In some alternative embodiments, the determining a routing order table of each pad to be routed according to the flying line cross interference coefficient, the pad pitch, and the device pad number includes: constructing a preset wiring priority evaluation model, wherein the wiring priority evaluation model is obtained by training in advance; and inputting the flying line cross interference coefficient, the pad spacing and the number of the device pads into the wiring priority evaluation model for calculation to obtain the wiring sequence table of each pad to be wired. In some alternative embodiments, the method of calculating the routing order table by the routing priority assessment model includes: Adjusting a first weight coefficient corresponding to the flying line cross interference coefficient, a second weight coeff