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CN-122018608-A - Clean gas temperature and humidity adjusting device and adjusting method suitable for photoetching environment

CN122018608ACN 122018608 ACN122018608 ACN 122018608ACN-122018608-A

Abstract

A clean gas temperature and humidity adjusting device and method suitable for a photoetching environment comprise a machine body, a clean gas inlet and a clean gas outlet formed at two opposite ends of the machine body, wherein the machine body comprises a humidifying module used for humidifying clean gas, a heating module arranged in front of the humidifying module and used for heating the clean gas and a heat exchange module arranged behind the humidifying module and used for controlling the temperature of the clean gas, the heating module is used for improving the sustainable saturated water vapor partial pressure of the clean gas through heating so as to improve the humidifying capacity, a wet film which only enables water molecules to pass through is arranged in the humidifying module, a cooling medium used for exchanging heat with the humidified clean gas is introduced into the heat exchange module, the final temperature control of the humidified clean gas is realized through changing the flow rate or the temperature of the cooling medium, and compared with the prior art, the long-term operation stability is guaranteed through multi-module cooperative control logic, the severe requirements of a constant temperature and constant humidity clean gas are perfectly adapted, and the alignment precision and the process reliability are effectively improved.

Inventors

  • YUAN SHIFANG
  • LIU CHENGWEI
  • XUE FEI
  • FU JINGYUAN

Assignees

  • 浙江启尔机电技术有限公司

Dates

Publication Date
20260512
Application Date
20260403

Claims (10)

  1. 1. The clean gas temperature and humidity adjusting device suitable for the photoetching environment comprises a machine body, and a clean gas inlet (6) and a clean gas outlet (13) which are formed at two opposite ends of the machine body, and is characterized in that the machine body comprises a humidifying module (3) for humidifying the clean gas, a heating module (1) arranged in front of the humidifying module (3) and used for heating the clean gas, and a heat exchange module (5) arranged behind the humidifying module (3) and used for controlling the temperature of the clean gas, wherein the heating module (1) is arranged corresponding to the clean gas inlet (6), and the heat exchange module (5) is arranged corresponding to the clean gas outlet (13); the heating module (1) increases the sustainable saturated water vapor partial pressure of clean gas by heating so as to increase the humidification amount; A wet film (10) which only can pass water molecules is arranged in the humidifying module (3), the humidifying module (3) is divided into a humidifying liquid cavity (18) and a humidifying gas cavity (19) by the wet film (10), and ultrapure water which is used for humidifying clean gas and is used for performing primary temperature control on the clean gas is introduced into the humidifying liquid cavity (18); And the heat exchange module (5) is filled with a cooling medium for exchanging heat with the humidified clean gas, and the final temperature control of the humidified clean gas is realized by changing the flow or the temperature of the cooling medium.
  2. 2. The clean gas temperature and humidity adjusting device suitable for the lithography environment according to claim 1, wherein a first collecting cavity (2) for collecting clean gas is arranged between the heating module (1) and the humidifying module (3), and a second collecting cavity (4) for collecting the humidified clean gas is arranged between the humidifying module (3) and the heat exchanging module (5).
  3. 3. The clean gas temperature and humidity adjusting device suitable for lithography environment according to claim 1, wherein the heating module (1) comprises a plurality of diffusion channels (8) communicated with the clean gas inlet (6), and heating plates (7) for heating the clean gas in the diffusion channels (8) in a sectional temperature control manner are arranged in the heating module (1).
  4. 4. The clean gas temperature and humidity adjusting device suitable for the lithography environment according to claim 2, wherein a plurality of wet films (10) used for humidifying the clean gas are arranged in the humidifying module (3), and a humidifying gas cavity (19) is correspondingly communicated with the first collecting cavity (2).
  5. 5. The clean gas temperature and humidity adjusting device suitable for lithography environment according to claim 4, wherein the humidifying module (3) is provided with a humidifying water inlet (9) for inputting ultrapure water and a humidifying water outlet (17) for outputting ultrapure water, and the humidifying water inlet (9) and the humidifying water outlet (17) are arranged corresponding to a water inlet and a water outlet of the humidifying liquid chamber (18).
  6. 6. The clean gas temperature and humidity adjusting device suitable for the lithography environment according to claim 2, wherein a heat exchange tube (12) for dividing the heat exchange module (5) into a heat exchange liquid cavity (16) and a heat exchange gas cavity (15) is arranged in the heat exchange module (5), the heat exchange gas cavity (15) is located in the heat exchange tube (12), a cooling medium for exchanging heat of the clean gas in the heat exchange gas cavity (15) is filled in the heat exchange liquid cavity (16), and the heat exchange gas cavity (15) is communicated with the second collecting cavity (4).
  7. 7. A clean gas temperature and humidity adjustment device suitable for use in a lithography environment according to claim 6, wherein the heat exchange module (5) is provided with a medium inlet (11) for the input of a cooling medium and a medium outlet (14) for the output of the cooling medium.
  8. 8. A method for adjusting a clean gas temperature and humidity adjusting device suitable for a lithography environment based on the clean gas temperature and humidity adjusting device suitable for a lithography environment according to any one of claims 1 to 7, comprising the steps of: step S1, temperature pretreatment, namely flowing clean gas into each diffusion flow channel (8) of the heating module (1) through a clean gas inlet (6), and heating the clean gas in each diffusion flow channel (8) through a heating plate (7); S2, gas humidification and primary temperature control, namely flowing the clean gas heated in the step S1 into a humidification module (3), inputting ultrapure water with stable temperature into a humidification liquid cavity (18), and enabling ultrapure water molecules in the humidification liquid cavity (18) to enter a humidification liquid cavity (19) through a wet film (10) to humidify the heated clean gas; step S3, secondary temperature control, namely controlling the temperature of the cooling medium to a preset calibration temperature in advance, and calibrating the temperature of the clean gas to a required target output temperature by performing heat exchange between the clean gas humidified in the step S2 and the cooling medium; and S4, outputting clean gas, outputting the clean gas after the temperature is calibrated, and detecting the temperature and the humidity of the output clean gas in real time.
  9. 9. The method according to claim 8, wherein the stable temperature of the ultra-pure water in the step S2 is set according to the heating amount of the heating sheet (7) in the step S1, and the preset calibration temperature of the cooling medium in the step S3 is set according to the target output temperature in the step S3.
  10. 10. The method according to claim 8, wherein the output power of the heating plate (7) is increased when the humidity of the clean gas detected in the step S4 does not reach the requirement, and the steps S1 to S4 are repeated.

Description

Clean gas temperature and humidity adjusting device and adjusting method suitable for photoetching environment Technical Field The invention relates to the technical field of lithography, in particular to a clean gas temperature and humidity adjusting device and method suitable for a lithography environment. Background The photoetching technology is a core process of micro-nano manufacturing, also called as a photoetching machine in the semiconductor industry, and is essentially characterized in that a precise pattern on a mask is transferred to a photoresist layer on the surface of a wafer through light projection and chemical etching, and then the micro-nano structure is prepared through processes such as development, etching and the like, so that the photoetching technology is a key technology for realizing ultra-fine patterning in the fields such as chips, semiconductor devices, MEMS, panel display and the like, and the precision directly determines the process node of the device. Because of the requirements of overlay accuracy and photoresist performance fluctuation, extremely high requirements are put on the temperature and humidity stability and cleanliness of a working environment in the photoetching process, wherein humidification in the photoetching environment is used for meeting the photochemical reaction requirements of the photoresist, stabilizing the critical dimension, inhibiting static electricity and particle pollution and guaranteeing the coating/developing uniformity. In the existing photolithography clean humidification technology, a membrane humidifier that allows only water molecules to pass through is generally used as a main component of humidification, but the existing membrane humidifier has no active control function. Chinese patent CN113457318a discloses an ultra-clean wet air preparation apparatus and a photolithography device, which comprises an air inlet unit, a gas washing unit connected with the air inlet unit, a porous structure arranged in the gas washing unit for increasing the contact area between the injected gas and the clean water, and a gas outlet unit connected with the gas washing unit. The preparation device disclosed by the above provides high-flow high-humidity wet air through the porous structure, but cannot effectively and accurately control the output humidity, and cannot effectively control the temperature of the output wet air in the humidifying process, and meanwhile, the humidity of the preparation device is limited by the area of the porous structure, so that the phenomenon of limited humidifying capacity exists. Disclosure of Invention The invention aims to overcome the defects in the prior art, and provides a clean gas temperature and humidity adjusting device and method which are suitable for a photoetching environment and are used for film type clean humidification and multistage temperature cooperative regulation. In order to achieve the above object, the present invention adopts the following technical scheme: The clean gas temperature and humidity adjusting device suitable for the photoetching environment comprises a machine body, and a clean gas inlet and a clean gas outlet which are formed at two opposite ends of the machine body, wherein the machine body comprises a humidifying module for humidifying the clean gas, a heating module arranged in front of the humidifying module and used for heating the clean gas, and a heat exchange module arranged behind the humidifying module and used for controlling the temperature of the clean gas, the heating module is arranged corresponding to the clean gas inlet, and the heat exchange module is arranged corresponding to the clean gas outlet; The heating module improves the sustainable saturated water vapor partial pressure of clean gas through heating so as to improve the humidification amount; The humidifying module is internally provided with a wet film which only can pass water molecules, the wet film divides the humidifying module into a humidifying liquid cavity and a humidifying gas cavity, and ultrapure water used for humidifying clean gas and performing primary temperature control on the clean gas is introduced into the humidifying liquid cavity; And the heat exchange module is filled with a cooling medium for exchanging heat with the humidified clean gas, and the final temperature control of the humidified clean gas is realized by changing the flow or the temperature of the cooling medium. As a preferable scheme of the invention, a first collecting cavity for collecting clean gas is arranged between the heating module and the humidifying module, and a second collecting cavity for collecting the humidified clean gas is arranged between the humidifying module and the heat exchange module. As a preferable scheme of the invention, the heating module comprises a plurality of diffusion flow channels communicated with the clean gas inlet, and heating plates for heating the clean gas in the diffusion flow