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CN-122018652-A - Server device

CN122018652ACN 122018652 ACN122018652 ACN 122018652ACN-122018652-A

Abstract

The invention relates to the technical field of electronic power, in particular to a server, which comprises a data processing device and a first radiator, wherein the data processing device comprises a load group and a power supply module, the load group comprises at least two loads, the power supply module supplies power to the loads, the first radiator is thermally connected with the power supply module, at least part of projection of the first radiator in a first plane is positioned at the outer side of a load area, the first plane is parallel to the upper surface of the loads, the load area is a minimum outline projection area of the load group which can cover all the loads in the first plane, the power supply module and the loads can separate and dissipate heat, the first radiator does not occupy the heat dissipation space of the loads, the heat dissipation effect of the loads is good, meanwhile, at least part of projection of the first radiator in the first plane is positioned at the outer side of the load area, fluid flowing through the first radiator of a rear row cannot be preheated by the front row of load radiator, and the temperature of cooling medium is kept low, so that the heat dissipation capacity of the first radiator is strong.

Inventors

  • LI YINGJUE
  • ZHAO JIE
  • LIANG LE
  • ZHOU MIN

Assignees

  • 台达电子企业管理（上海）有限公司

Dates

Publication Date
20260512
Application Date
20241105

Claims (20)

  1. 1. The server is characterized by comprising a data processing device and a first radiator, wherein the data processing device comprises a load group and a power supply module, the load group comprises at least two loads, the power supply module supplies power to the load group, the first radiator is thermally connected with the power supply module, at least part of the projection of the first radiator in a first plane is located outside a load area, the load comprises an upper surface and a lower surface which are oppositely arranged, the first plane is parallel to the upper surface of the load, and the load area is a minimum outline projection area which can cover all the loads in the first plane.
  2. 2. The server of claim 1, wherein at least 10% of the projection of the first heat sink in the first plane is located outside of the load region.
  3. 3. The server of claim 1, wherein the portion of the first heat sink outside the load area is distributed outside at least two edges of the load area.
  4. 4. A server according to any one of claims 1-3, further comprising a housing and a second heat sink located above the load for dissipating heat from the load, the first heat sink, the second heat sink and the load bank each being located within the housing, at least part of the first heat sink being located between a side wall of the housing and a side wall of the second heat sink located opposite the side wall of the housing in a projection of the first plane, the part of the first heat sink being located between the side wall of the housing and the side wall of the second heat sink having a width of at least 10% of the distance between the side wall of the second heat sink and the side wall of the housing.
  5. 5. The server of claim 4, wherein at least a portion of the first heat sink is in contact with the housing.
  6. 6. The server according to claim 4, wherein the power supply module includes at least one power supply module, and third heat sinks are respectively disposed on two sides of the second heat sink, and each of the third heat sinks includes a third heat conduction portion and a third heat dissipation portion, the third heat conduction portion is thermally connected to the power supply module, the third heat dissipation portion is thermally connected to the third heat conduction portion, and at least a portion of a projection of the third heat sink in the first plane is located in the load area.
  7. 7. The server of claim 6, wherein the third heat sink is a wind scooper structure, the power supply module is thermally connected to the wind scooper, and the wind scooper is disposed around a circumference of the power supply module.
  8. 8. A server according to any one of claims 1 to 3, wherein the data processing device further comprises a first carrier plate, the power supply module supplying power to the load group through the first carrier plate; the first carrier plate is arranged between the load group and the power supply module, or the load group and the power supply module are arranged on the same side of the first carrier plate; At least part of the first radiator is positioned at one side of the power supply module, which is far away from the first carrier plate.
  9. 9. The server of claim 8, wherein a projected area of the first carrier plate in the first plane is larger than the load area, and at least a portion of a projection of the first heat sink in the first plane is located between the load area and a projected area of the first carrier plate in the first plane, or wherein at least a portion of a projection of the first heat sink in the first plane is located outside of the projected area of the first carrier plate in the first plane.
  10. 10. The server of claim 8, wherein the first carrier plate comprises at least two sub-carrier plates, the at least two sub-carrier plates are respectively connected with at least two of the loads in the load group, the power supply module comprises at least two power supply sub-modules, the at least two power supply sub-modules are respectively connected with the at least two sub-carrier plates, and the projection area of the first carrier plate in the first plane is a minimum outline projection area of the first carrier plate in the first plane, wherein the minimum outline projection area of the first carrier plate can cover all the sub-carrier plates.
  11. 11. The server of claim 8, further comprising a housing, at least a portion of the first heat sink being located between the housing and an edge of the first carrier, a portion of the first heat sink being located between the housing and the edge of the first carrier having a width that is at least 10% of a distance between the edge of the first carrier and a sidewall of the housing opposite the edge.
  12. 12. The server of claim 8, further comprising a second carrier plate positioned below the first carrier plate, at least a portion of the first heat sink being positioned above the second carrier plate.
  13. 13. The server of claim 12, wherein the first heat sink includes a first heat conducting portion, the second carrier is provided with a first through hole, the first heat conducting portion includes a first protruding portion, and the first protruding portion is disposed through the first through hole to dissipate heat from the power supply module.
  14. 14. The server of claim 12, wherein the first heat sink comprises a first heat sink portion, the first heat sink portion being disposed entirely below the second carrier.
  15. 15. The server of claim 12, further comprising an additional heat source and a fourth heat spreader, the additional heat source disposed on the second carrier plate; the second carrier plate is provided with a second through hole, and the fourth radiator comprises a second protruding part which penetrates through the second through hole and is in thermal connection with the additional heat source; And/or the second carrier plate is provided with a third through hole, a heat conducting column is arranged in the third through hole, and the additional heat source is thermally connected with the fourth radiator through the heat conducting column.
  16. 16. A server according to any one of claims 1 to 3, further comprising a second carrier, the load group and the power supply module being arranged on the same side of the second carrier, the first heat sink being located above the power supply module.
  17. 17. A server according to any one of claims 1-3, wherein the power supply module comprises at least one power supply module, the first heat sink comprises a first heat conducting portion and a first heat dissipating portion, at least part of the first heat conducting portion is arranged below the power supply module, at least part of the first heat dissipating portion is located outside the load area, and the first heat dissipating portion is thermally connected with the first heat conducting portion.
  18. 18. The server of claim 17, wherein the first heat sink is a wind scooper structure, the power supply module is thermally connected to the wind scooper, and the wind scooper is disposed around a circumference of the power supply module.
  19. 19. The server of claim 17, wherein the first thermally conductive section comprises one or more of a heat pipe, a temperature equalization plate, a metallic thermally conductive plate, and a non-metallic thermally conductive structure.
  20. 20. The server of claim 17, wherein the first heat sink includes one or more of a heat sink fin, a water cooled plate, a metal plate, and a non-metallic heat sink structure.

Description

Server device Technical Field The disclosure relates to the technical field of electronic power, in particular to a server. Background With the demands of artificial intelligence and cloud computing industries for high computational power, a power supply system is oriented to kilowatt chips. The power supply architecture adopted by the existing server mainly comprises a horizontal power supply architecture and a vertical power supply architecture. In the horizontal power supply scheme, the transmission path of current through the circuit board is longer, the loss of a current transmission network (PDN, power Delivery Network) is larger, the power supply efficiency of the system is lower, and in the vertical power supply scheme, a radiator for radiating the power supply module occupies the radiating space of a load, the radiating capacity of the load is limited, and the computing power exertion of the load is influenced. Meanwhile, the radiator of the rear-row power supply module is affected by the front-row load radiator, so that the heat dissipation capacity is poor, and the heat dissipation requirement of the power supply module cannot be met. Disclosure of Invention The present disclosure is directed to a server to meet the heat dissipation requirement of a power supply module and improve the performance of the server. Based on the above purpose, the present disclosure provides a server, which comprises a data processing device and a first radiator, wherein the data processing device comprises a load group and a power supply module, the load group comprises at least two loads, the power supply module supplies power to the load group, the first radiator is thermally connected with the power supply module, at least part of the projection of the first radiator in a first plane is located outside a load area, the load comprises an upper surface and a lower surface which are oppositely arranged, the first plane is parallel to the upper surface of the load, and the load area is a minimum outline projection area of the load group which can cover all the loads in the first plane. In one embodiment of the present disclosure, at least 10% of the projection of the first heat sink into the first plane is located outside the load region. In one embodiment of the present disclosure, the portion of the first heat sink located outside the load region is distributed outside at least two edges of the load region. In one embodiment of the disclosure, the server further includes a housing and a second heat sink, the second heat sink is located above the load and is used for dissipating heat to the load, the first heat sink, the second heat sink and the load group are located in the housing, at least part of the first heat sink is located between a side wall of the housing and a side wall of the second heat sink located opposite to the side wall of the housing in a projection of the first plane, and a width of a part of the first heat sink located between the side wall of the housing and the side wall of the second heat sink is at least 10% of a distance between the side wall of the second heat sink and the side wall of the housing. In one embodiment of the present disclosure, at least a portion of the first heat sink is in contact with the housing. In one embodiment of the disclosure, the power supply module includes at least one power supply module, two sides of the second radiator are respectively provided with a third radiator, the third radiator includes a third heat conduction portion and a third heat dissipation portion, the third heat conduction portion is thermally connected with the power supply module, the third heat dissipation portion is thermally connected with the third heat conduction portion, and at least a portion of a projection of the third radiator in the first plane is located in the load area. In one embodiment of the disclosure, the third heat sink is a wind scooper structure, the power supply module is thermally connected with the wind scooper, and the wind scooper is disposed around a circumference of the power supply module. In one embodiment of the disclosure, the data processing apparatus further includes a first carrier board, and the power supply module supplies power to the load group through the first carrier board; the first carrier plate is arranged between the load group and the power supply module, or the load group and the power supply module are arranged on the same side of the first carrier plate; At least part of the first radiator is positioned at one side of the power supply module, which is far away from the first carrier plate. In one embodiment of the present disclosure, the projection area of the first carrier plate in the first plane is larger than the load area, and at least part of the projection of the first heat sink in the first plane is located between the load area and the projection area of the first carrier plate in the first plane, or at least part of the projection o