Search

CN-122018653-A - Heat dissipation mechanism

CN122018653ACN 122018653 ACN122018653 ACN 122018653ACN-122018653-A

Abstract

The invention provides a heat dissipation mechanism which is suitable for a notebook computer, wherein the notebook computer comprises at least one heat source, and the heat dissipation mechanism comprises a temperature equalizing plate, a plurality of upright posts, a capillary structure, working fluid, a plurality of first fins and at least one fan. The temperature equalizing plate is provided with a first surface and a second surface which are opposite to each other, and a first cavity is formed between the first surface and the second surface. The second face contacts the heat source. The posts are formed by the second face protruding outwardly. Each upright post is provided with a second cavity which is communicated with the first cavity to form a closed cavity. The capillary structure is configured on the wall surfaces of the first chamber and the second chamber. The working fluid fills the first chamber and the second chamber. The first fins are arranged on the second face and are sleeved on the upright post in a stacked mode, and each first fin surrounds at least part of the upright post. The fan is arranged in the notebook computer and provided with at least one air outlet towards the first fins.

Inventors

  • HUANG SONGQUAN
  • QIU YINGZHE

Assignees

  • 华硕电脑股份有限公司

Dates

Publication Date
20260512
Application Date
20241112

Claims (9)

  1. 1. A heat dissipation mechanism adapted for a notebook computer, the notebook computer comprising at least one heat source, the heat dissipation mechanism comprising: the temperature equalizing plate is provided with a first surface and a second surface which are opposite, a first cavity is formed between the first surface and the second surface, and the second surface is suitable for contacting with the at least one heat source; The upright posts are formed by protruding outwards from the second face, each upright post is provided with a second cavity, and the second cavities are respectively communicated with the first cavities and form closed cavities with the first cavities; A capillary structure disposed on a wall surface of the first chamber and the second chamber; a working fluid filled in the first chamber and the second chamber; a plurality of first fins disposed on the second surface and stacked over the plurality of posts, each of the first fins surrounding at least a portion of the posts, and The fan is arranged in the notebook computer and is provided with at least one air outlet, and the air outlet faces the plurality of first fins.
  2. 2. The heat dissipation mechanism of claim 1, wherein the plurality of first fins are parallel to the temperature equalization plate.
  3. 3. The heat dissipation mechanism according to claim 1, wherein the plurality of columns are arranged in the condensation area of the temperature equalization plate along the axial direction, the at least one heat source is abutted against the evaporation area of the temperature equalization plate, the at least one fan is located beside the evaporation area of the temperature equalization plate, and the air outlet of the fan faces the condensation area.
  4. 4. The heat dissipation mechanism as recited in claim 3 wherein the number of said at least one fan is two and is located beside said evaporation zone of said temperature equalization plate, and said at least one heat source is located between two of said fans.
  5. 5. The heat dissipating mechanism of claim 4, wherein each of said two fans has a secondary air outlet facing each other and facing said evaporation zone of said temperature equalization plate.
  6. 6. The heat dissipation mechanism of claim 1, wherein the plurality of first fin sections are divided into a plurality of first fin groups, each of the first fin groups being nested with at least one of the posts.
  7. 7. The heat dissipation mechanism of claim 1, further comprising a second set of fins disposed on the first face of the temperature plate, the plurality of first fins and the second set of fins being located on opposite surfaces of the temperature plate.
  8. 8. The heat dissipation mechanism of claim 7, wherein the plurality of second fins of the second set of fins are each perpendicular to the temperature equalizing plate.
  9. 9. The heat dissipation mechanism according to claim 1, wherein the at least one fan comprises a first fan, a second fan and a third fan, which are respectively adjacent to three different side edges of the evaporation zone of the temperature equalization plate, the first fan has a first air outlet and a first auxiliary air outlet, the second fan has a second air outlet and a second auxiliary air outlet, the third fan has a third air outlet, wherein the first air outlet and the second air outlet are respectively directed toward the condensation zone of the temperature equalization plate, the first auxiliary air outlet and the second auxiliary air outlet are opposite to each other with the heat source thereon across the temperature equalization plate, and the third air outlet is directed toward the evaporation zone and the condensation zone and is opposite to the condensation zone across the evaporation zone.

Description

Heat dissipation mechanism Technical Field The invention relates to a heat dissipation mechanism. Background The operation of the electronic device is accompanied by the generation of a large amount of heat energy, and if the heat energy cannot be effectively removed, the internal electronic components are overheated, so that the problems of functional failure, machine halt and the like are caused. Accordingly, the electronic device is generally configured with a corresponding heat dissipation system to ensure that the operation of the component does not exceed the default operating temperature range Taking a notebook computer as an example, a heat dissipation mechanism consisting of a heat pipe, a fan and heat dissipation fins is arranged in the notebook computer. However, with the technology becoming more and more, the product update rate of notebook computers is also increasing, and there are many different models applied to different demands each year, which also means that the heat dissipation mechanisms in these models need to be adjusted according to the models or demands. This tends to increase the burden and cost of manufacturing the heat dissipation mechanism. Therefore, how to provide a modularized heat dissipation mechanism to facilitate the manufacture and to meet the above-mentioned different models and requirements is a real problem that needs to be considered and solved by the related technicians. Disclosure of Invention The invention is directed to a heat dissipation mechanism which is suitable for notebook computers and provides modularized components so that the heat dissipation mechanism can be adjusted according to different models or requirements. According to an embodiment of the invention, the heat dissipation mechanism is suitable for a notebook computer, the notebook computer comprises at least one heat source, and the heat dissipation mechanism comprises a temperature equalizing plate, a plurality of upright posts, a capillary structure, a working fluid, a plurality of first fins and at least one fan. The temperature equalizing plate is provided with a first surface and a second surface which are opposite to each other, and a first cavity is formed between the first surface and the second surface. The second face is in thermal contact with a heat source. The posts are formed by the second face protruding outwardly. Each upright post is provided with a second cavity which is respectively communicated with the first cavity and forms a closed cavity with the first cavity. The capillary structure is configured on the inner wall surfaces of the first chamber and the second chamber. The working fluid fills the first chamber and the second chamber. The first fins are arranged on the second face and are sleeved on the upright post in a stacked mode, and each first fin surrounds at least part of the upright post. The fan is arranged in the notebook computer and provided with at least one air outlet facing the first fins. Based on the above, in the heat dissipation mechanism of the notebook computer of the present disclosure, a heat dissipation plate having a first chamber is matched with a plurality of columns having a second chamber to form a base structure, wherein the second surface of the heat dissipation plate is used for thermally contacting with a heat source of the notebook computer, and the plurality of first fins are respectively sleeved on the columns located on the second surface, and then a capillary structure is configured on the inner wall surface of the heat dissipation plate and the inner wall surface of the columns, and the working fluid is filled in the capillary structure. In this way, the capillary structure can extend from the first chamber to the second chamber, which also means that the working fluid in the first chamber can absorb heat from the heat source and change from a liquid state to a vapor state (vapor), and then is transferred from the first chamber to the second chamber, and the first fins stacked outside the upright post are gradually cooled by the air flow of the fan, and then change from the vapor state to the liquid state in the second chamber, so as to be beneficial to flowing back to the first chamber again along the capillary structure. Based on the above, the second chamber is vertical to the first chamber like a chimney, so that the transmission of the working fluid in a vapor state is facilitated, and the working fluid in a liquid state flows back to the first chamber of the temperature equalizing plate along the capillary structure, so that the working fluid forms a heat dissipation cycle between the temperature equalizing plate and the upright post due to the generated phase change, thereby achieving the effect of dissipating heat of the heat source. Furthermore, the first fins are arranged on the upright posts in a sleeved mode, so that the size and the number of the upright posts and the size and the number of the first fins on the upright p