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CN-122018654-A - Integrated copper alloy radiator with air-cooled synergistic vapor chamber and preparation method thereof

CN122018654ACN 122018654 ACN122018654 ACN 122018654ACN-122018654-A

Abstract

The invention discloses an integrated copper alloy radiator with an air cooling synergistic vapor chamber and a preparation method thereof, wherein the radiator comprises a vapor chamber substrate, a capillary structure arranged in the vapor chamber substrate and an air cooling assembly arranged on the lower bottom surface of the vapor chamber substrate; the soaking plate matrix, the capillary structure and the air cooling component are metallurgically combined into an integrated structure, so that the contact thermal resistance between a base and the fins and between the soaking plate and the base in the traditional radiator is thoroughly eliminated, the shortest and the smoothest heat conduction path from a heat source to air is realized, and the radiating effect of the radiator is improved.

Inventors

  • ZHANG YAJUAN
  • WANG HONGZHOU
  • LI XUAN
  • ZHANG HUAN
  • PENG XIANYOU

Assignees

  • 陕西斯瑞铜合金创新中心有限公司

Dates

Publication Date
20260512
Application Date
20260115

Claims (9)

  1. 1. The integrated copper alloy radiator is characterized by comprising a soaking plate substrate (1), a capillary structure (2) arranged in the soaking plate substrate (1) and an air cooling assembly (3) arranged on the lower bottom surface of the soaking plate substrate (1), wherein a vacuum cavity (10) is arranged in the soaking plate substrate (1), and a liquid injection pipe (11) communicated with the inside of the vacuum cavity (10) is arranged at the end part of the soaking plate substrate (1); The plurality of capillary structures (2) are arranged, the capillary structures (2) are equidistantly distributed at the inner top of the vacuum cavity (10) along the length direction of the vacuum cavity (10), and the capillary structures (2) are three-dimensional porous net structures; The air cooling assembly (3) comprises an air guide cover (30) arranged on the lower bottom surface of the soaking plate base body (1) and a plurality of air cooling fins (31) which are equidistantly distributed in the air guide cover (30), wherein the air cooling fins (31) are wavy.
  2. 2. The integrated copper alloy radiator of the air-cooled synergistic vapor chamber according to claim 1, wherein the air-cooled fins (31) comprise a plurality of first radiating fins (310) and second radiating fins (311), the first radiating fins (310) and the second radiating fins (311) are identical in structure, a first radiating channel (3100) is arranged on the first radiating fins (310), a second radiating channel (3110) is arranged on the second radiating fins (311), the first radiating fins (310) and the second radiating fins (311) are arranged at intervals, and the first radiating channel (3100) and the second radiating channel (3110) are mutually staggered.
  3. 3. The integrated copper alloy radiator of the air-cooled collaborative vapor chamber according to claim 1 is characterized in that guide plates (4) are arranged at the inner bottom of the vacuum cavity (10), the guide plates (4) are distributed in a plurality along the length direction of the vacuum cavity (10) at equal intervals, and a plurality of inverted U-shaped bulges (40) are distributed on each guide plate (4) at equal intervals.
  4. 4. An integrated copper alloy radiator with an air-cooled synergistic vapor chamber according to claim 3, characterized in that the inverted U-shaped bulges (40) on two adjacent deflectors (4) are staggered with each other.
  5. 5. An integrated copper alloy radiator with an air-cooled synergistic vapor chamber according to claim 3, wherein each inverted U-shaped protrusion (40) is provided with a diversion hole (41) penetrating therethrough.
  6. 6. An integrated copper alloy radiator with an air-cooled synergistic vapor chamber according to claim 3, wherein the height difference between the inverted U-shaped protrusions (40) on two adjacent guide plates (4) is 1-3 mm.
  7. 7. The integrated copper alloy radiator of the air-cooled synergistic vapor chamber according to claim 1, wherein the vapor chamber base body (1), the capillary structure (2) and the air-cooled component (3) are all made of copper alloy materials, and the copper alloy materials adopt spherical powder suitable for a laser powder bed melting process, and the composition of the copper alloy materials is Cu, cuCr, cuCrZr, cuCrNb, and the thermal conductivity of the copper alloy materials is 350-400W/m.K.
  8. 8. The method for manufacturing the integrated copper alloy radiator with the air-cooled synergistic vapor chamber as claimed in claim 1, which is characterized by comprising the following steps: s1, constructing an integrated three-dimensional digital model of a radiator and performing printing pretreatment; s2, melting copper alloy powder in a protective atmosphere by adopting a laser powder bed melting process, and printing layer by layer to obtain a radiator blank with an unsealed vacuum cavity (10), wherein the radiator blank comprises a vapor chamber substrate (1), a capillary structure (2) and an air cooling assembly (3); S3, after printing is finished, taking down the radiator blank from the substrate by adopting linear cutting equipment, and cleaning and drying the radiator blank; S4, vacuumizing the vacuum cavity (10) through a liquid injection pipe (11) to enable the vacuum degree in the vacuum cavity (10) to reach 0.3-0.5 Pa, and then injecting a phase change working medium into the vacuum cavity (10) through the liquid injection pipe (11); and S5, sealing the liquid injection pipe (11) by adopting a resistance welding machine.
  9. 9. An integrated copper alloy radiator with an air-cooled synergistic vapor chamber as claimed in claim 1, wherein the inverted U-shaped protrusions (40) are each provided with a diversion trench (41) penetrating therethrough.

Description

Integrated copper alloy radiator with air-cooled synergistic vapor chamber and preparation method thereof Technical Field The invention relates to the technical field of radiators, in particular to an integrated copper alloy radiator with an air-cooled synergistic vapor chamber and a preparation method thereof. Background With the rapid development of high-performance computing chips and high-power density semiconductor devices, the heat flux density of the high-performance computing chips and the high-power density semiconductor devices is approaching or even exceeding the limit of the traditional heat dissipation technology. The existing mainstream heat dissipation schemes, such as copper-bottom heat pipe Fin radiator or traditional vapor chamber air-cooled radiator, are usually assembled by welding, riveting or Fin penetrating process through a plurality of components (base, heat pipe/vapor chamber, fins). These processes inevitably introduce thermal contact resistance, which becomes a bottleneck in the heat dissipation chain. Meanwhile, due to the traditional processing technology (such as extrusion, stamping and brazing), the design freedom of the geometric shape of the radiator (especially the internal capillary structure and the external three-dimensional air duct) is low, and the optimal matching with the heat source distribution and the airflow field is difficult to realize. The 3D printing technology provides possibility for manufacturing complex three-dimensional structures, but the related research at present is concentrated on aluminum, stainless steel materials or simple conformal cooling channels, and the potential of 3D printing in the aspects of high-heat-conductivity materials, special-shaped vacuum cavities and internal and external structure synchronous topological optimization cannot be fully exerted. Therefore, there is a need for an integrated heat dissipation solution that can completely eliminate interface thermal resistance, minimize heat transfer paths, and enable a customized and efficient design according to the heat dissipation scenario. Disclosure of Invention Aiming at the technical problems, the invention provides an integrated copper alloy radiator with an air-cooled synergistic vapor chamber and a preparation method thereof. The integrated copper alloy radiator comprises a soaking plate matrix, a capillary structure and air cooling fins, wherein the capillary structure and the air cooling fins are arranged in the soaking plate matrix, a vacuum cavity is arranged in the soaking plate matrix, a liquid injection pipe communicated with the inside of the vacuum cavity is arranged at the end part of the soaking plate matrix, the length of the soaking plate matrix is 70mm, the width of the soaking plate matrix is 21mm, the height of the soaking plate matrix is 7.7mm, the height of the vacuum cavity is 0.65mm, and the inner diameter of the liquid injection pipe is 2.5mm; The plurality of capillary structures are arranged, each capillary structure is equidistantly distributed at the inner top of the vacuum cavity along the length direction of the vacuum cavity, and the capillary structure is a three-dimensional porous reticular structure; The air cooling assembly comprises an air guide cover arranged on the lower bottom surface of the soaking plate substrate and a plurality of air cooling fins which are equidistantly distributed in the air guide cover, and the air cooling fins are wavy. The air cooling fins comprise a plurality of first radiating fins and second radiating fins, wherein the first radiating fins and the second radiating fins have the same structure, a first radiating channel is arranged on the first radiating fins, and a second radiating channel is arranged on the second radiating fins; The heat exchange device has the advantages that the external air firstly enters the first heat dissipation channels on the first heat dissipation fins and then is split through the second heat dissipation channels on the second heat dissipation fins, so that heat exchange between the external air and heat transferred by the phase-change working medium is realized, meanwhile, as the first heat dissipation channels and the second heat dissipation channels are mutually staggered, the heat exchange time of the external air and the air cooling fins is prolonged, the heat exchange contact surface of the external air and the air cooling fins is enlarged, and the heat exchange efficiency of the radiator is improved. Further, the bottom in the vacuum cavity is provided with a plurality of guide plates which are equidistantly distributed along the length direction of the vacuum cavity, and a plurality of inverted U-shaped bulges are uniformly distributed on each guide plate at intervals; the flow of the phase change working medium can be guided by the inverted U-shaped bulge on the guide plate, and the flow smoothness of the phase change working medium can be improved. Further, the inverted U-