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CN-122018655-A - Multi-parameter monitoring and thermal diffusion inhibition linkage system for electronic element heat insulation sheath

CN122018655ACN 122018655 ACN122018655 ACN 122018655ACN-122018655-A

Abstract

The invention relates to the technical field of electronic equipment thermal safety protection and temperature control, and particularly discloses a multi-parameter monitoring and thermal diffusion inhibition linkage system of an electronic element heat insulation sheath. According to the invention, the thermal field distribution, the pressure change and the heat flow rate data in the heat insulation sheath are synchronously acquired in real time, the time sequence fusion is carried out to generate a multi-dimensional thermal state vector, the thermal anomaly judgment model is input to comprehensively evaluate the coupling relation, the output linkage control instruction drives the execution module to execute the cooperative inhibition action on the corresponding thermal diffusion path, the problem that the response time delay and the early stage of the thermal runaway are difficult to be rapidly interfered due to insufficient dimensionality of the traditional offline detection or single temperature sensing monitoring, lack of cooperation of monitoring and inhibition is solved, the rapid linkage response of the thermal anomaly identification and the inhibition action is realized, the thermal diffusion path is blocked in time, the heat accumulation and spreading are avoided, and the thermal safety protection capability and the steady operation guarantee level of the electronic element and the whole system are improved.

Inventors

  • ZHU CHENYING

Assignees

  • 常州市美和电子有限公司

Dates

Publication Date
20260512
Application Date
20260126

Claims (10)

  1. 1. An electronic component insulating sheath multiparameter monitoring and thermal diffusion suppression linkage system, the system comprising: The multi-parameter sensing module is used for synchronously acquiring the thermal field distribution parameter, the internal pressure parameter and the heat flow rate parameter in the heat insulation sheath of the electronic element in real time; The data acquisition and monitoring control module is used for carrying out time sequence fusion on the thermal field distribution parameter, the internal pressure parameter and the heat flow rate parameter, generating a multi-dimensional fusion thermal state vector representing the real-time thermal state of the heat insulation sheath, inputting the multi-dimensional fusion thermal state vector into a preset thermal anomaly judgment model, comprehensively evaluating the coupling relation of the thermal field gradient, the pressure change trend and the heat flow anomaly rate through the thermal anomaly judgment model to judge the thermal anomaly state, and outputting a linkage control instruction containing the inhibition position and the inhibition strength through the thermal anomaly judgment model when the thermal anomaly state is judged; and the thermal diffusion inhibition execution module is used for executing cooperative inhibition action on the corresponding thermal diffusion path of the heat insulation sheath according to the inhibition position and the inhibition strength in the linkage control instruction.
  2. 2. The electronic component insulation jacket multiparameter monitoring and thermal diffusion suppression linkage system of claim 1, wherein the multiparameter sensing module is specifically configured to: Synchronously acquiring temperature data of a plurality of spatial position points in the heat insulation sheath through a distributed temperature sensor array arranged in the heat insulation sheath, and calculating and generating the thermal field distribution parameters based on the temperature data of the plurality of spatial position points; synchronously acquiring the environmental pressure data in the heat insulation sheath by using a micro-pressure sensor arranged in the heat insulation sheath as the internal pressure parameter; and synchronously acquiring heat power data of a designated section flowing through the inside of the heat insulation sheath by a heat flux sensor arranged in the inside of the heat insulation sheath, and taking the heat power data as the heat flow rate parameter.
  3. 3. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 1, wherein the data acquisition and monitoring control module is specifically configured to: based on a unified time reference, aligning the thermal field distribution parameter, the internal pressure parameter and the heat flow rate parameter which are synchronously acquired in the same sampling time window; Extracting a spatial thermal field gradient characteristic from the aligned thermal field distribution parameters, extracting a time sequence pressure change rate characteristic from the aligned internal pressure parameters, and extracting an instantaneous thermal current value from the aligned thermal current rate parameters; and combining the spatial thermal field gradient characteristic, the time sequence pressure change rate characteristic and the instantaneous thermal current value according to a preset dimension sequence to form the multidimensional fusion thermal state vector representing the comprehensive thermal state of the heat insulation sheath in the sampling time window.
  4. 4. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 3, wherein the data acquisition and monitoring control module is specifically configured to: The multi-dimensional fusion thermal state vector is input into the thermal anomaly judgment model, the spatial thermal field gradient characteristic, the time sequence pressure change rate characteristic and the instantaneous thermal current value in the multi-dimensional fusion thermal state vector are analyzed through the thermal anomaly judgment model, the spatial thermal field gradient characteristic, the time sequence pressure change rate characteristic and the instantaneous thermal current value are subjected to weighted fusion calculation based on a preset coupling weight coefficient, a comprehensive anomaly score is generated, and when the comprehensive anomaly score exceeds a preset anomaly threshold value, the thermal anomaly state is judged to appear.
  5. 5. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 4, wherein the thermal anomaly determination model is specifically configured to: Establishing reference weights corresponding to the spatial thermal field gradient characteristics, the time sequence pressure change rate characteristics and the instantaneous thermal current values respectively through offline training based on historical operation data of the heat insulation sheath, and taking the reference weights as initial values of dynamic coupling weight coefficients; In a real-time operation process, dynamically adjusting the dynamic coupling weight coefficient according to the numerical value change of adjacent sampling time windows in the multi-dimensional fusion thermal state vector, wherein the larger the change amplitude of the spatial thermal field gradient characteristic is, the higher the adjustment gain of the corresponding dynamic coupling weight coefficient is, the more obvious the accumulated change trend of the time sequence pressure change rate characteristic is, the higher the adjustment gain of the corresponding dynamic coupling weight coefficient is, the greater the degree that the instantaneous heat flow value exceeds a preset normal threshold is, and the higher the adjustment gain of the corresponding dynamic coupling weight coefficient is; and carrying out nonlinear weighted fusion on the spatial thermal field gradient characteristics, the time sequence pressure change rate characteristics and the instantaneous thermal current value by using the adjusted dynamic coupling weight coefficient, introducing correction factors based on cross influence among characteristics, and calculating to obtain the comprehensive abnormal score.
  6. 6. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 5, wherein the composite anomaly score The calculation formula of (2) is as follows: Wherein, the For the spatial thermal field gradient characteristics, As a characteristic of the time-series pressure change rate, For the value of the instantaneous heat flow, 、 、 Respectively a dynamic coupling weight coefficient of the spatial thermal field gradient characteristic, a dynamic coupling weight coefficient of the time sequence pressure change rate characteristic and a dynamic coupling weight coefficient of the instantaneous thermal current value, 、 、 Respectively a preset index greater than 1, As a first non-linear correction factor, As a second non-linear correction factor, Is a cross-influence coefficient.
  7. 7. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 6, wherein the thermal anomaly determination model is specifically configured to: When the thermal anomaly state is judged, determining a space coordinate corresponding to the maximum value of the thermal field gradient in the heat insulation sheath according to the space thermal field gradient characteristic in the multi-dimensional fusion thermal state vector, and mapping the space coordinate to the inhibition position; Calculating the suppression intensity based on the composite anomaly score, a maximum of the spatial thermal field gradient features, the temporal pressure change rate feature, and the instantaneous thermal current value; And combining the inhibition position and the inhibition strength to form the linkage control instruction.
  8. 8. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 7, wherein the suppression strength is calculated as: Wherein, the In order for the intensity of the inhibition to be as high as possible, For the maximum value in the spatial thermal field gradient profile, For the value of the instantaneous heat flow, 、 、 、 Is a preset adjustment coefficient.
  9. 9. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of claim 8, wherein the thermal diffusion suppression execution module is specifically configured to: receiving the linkage control instruction and analyzing the inhibition position and the inhibition strength in the linkage control instruction; activating one or more local inhibition units which are arranged inside the heat insulation sheath and correspond to the heat diffusion paths according to the inhibition positions; dynamically adjusting an operating parameter of the one or more local suppression units according to the suppression intensity, the operating parameter including a refrigeration power of the local suppression unit or a triggering rate of a phase change material; and controlling the one or more local inhibition units to synchronously start according to the working parameters, forming a directional blocking area on the thermal diffusion path of the heat insulation sheath, and executing the cooperative inhibition action.
  10. 10. The electronic component insulation sheath multiparameter monitoring and thermal diffusion suppression linkage system of any one of claims 5-9, wherein the data acquisition and monitoring control module is further configured to perform a feedback optimization process comprising: after the thermal diffusion suppression execution module executes the cooperative suppression action, updated thermal field distribution parameters, internal pressure parameters and heat flow rate parameters synchronously acquired by the multi-parameter sensing module are acquired; generating a subsequent multi-dimensional fusion thermal state vector according to the updated parameters, and calculating the state difference degree between the subsequent multi-dimensional fusion thermal state vector and the multi-dimensional fusion thermal state vector according to which the linkage control instruction is triggered; And dynamically adjusting at least one dynamic coupling weight coefficient in the thermal anomaly determination model through a preset gradient descent algorithm according to the state difference degree and the inhibition intensity.

Description

Multi-parameter monitoring and thermal diffusion inhibition linkage system for electronic element heat insulation sheath Technical Field The invention relates to the technical field of electronic equipment thermal safety protection and temperature control, in particular to a multi-parameter monitoring and thermal diffusion inhibition linkage system of an electronic element heat insulation sheath. Background As electronic devices move toward high density integration and high power, electronic element thermal insulation jackets face higher demands for safety and reliability as key components for thermal management. The prior art mainly relies on an off-line detection or single temperature sensing mode to monitor the state, has limited monitoring dimension, and is difficult to comprehensively reflect key parameters such as thermal field distribution, pressure change, heat flow rate and the like in the sheath. Meanwhile, due to the fact that a cooperative linkage mechanism is lacked between the monitoring unit and the thermal inhibition executing mechanism, time delay is commonly caused between thermal anomaly identification and inhibition action response, and a thermal diffusion path cannot be blocked in time. The architecture of mutual fracture of the monitoring and inhibiting measures makes it difficult to realize rapid intervention in the early stage of thermal runaway, and heat accumulation and spreading are easy to cause, so that the stable operation of electronic elements and the whole system is threatened, and the thermal safety protection capability is improved by a multi-parameter fusion sensing and linkage control technology. Accordingly, there is a need to provide a solution to the above-mentioned problems. Disclosure of Invention In order to solve the technical problems, the invention provides a multi-parameter monitoring and thermal diffusion inhibition linkage system of an electronic element heat insulation sheath, which has the following technical scheme: The multi-parameter sensing module is used for synchronously acquiring the thermal field distribution parameter, the internal pressure parameter and the heat flow rate parameter in the heat insulation sheath of the electronic element in real time; The data acquisition and monitoring control module is used for carrying out time sequence fusion on the thermal field distribution parameter, the internal pressure parameter and the heat flow rate parameter, generating a multi-dimensional fusion thermal state vector representing the real-time thermal state of the heat insulation sheath, inputting the multi-dimensional fusion thermal state vector into a preset thermal anomaly judgment model, comprehensively evaluating the coupling relation of the thermal field gradient, the pressure change trend and the heat flow anomaly rate through the thermal anomaly judgment model to judge the thermal anomaly state, and outputting a linkage control instruction containing the inhibition position and the inhibition strength through the thermal anomaly judgment model when the thermal anomaly state is judged; and the thermal diffusion inhibition execution module is used for executing cooperative inhibition action on the corresponding thermal diffusion path of the heat insulation sheath according to the inhibition position and the inhibition strength in the linkage control instruction. According to the technical scheme, the thermal field distribution, the pressure change and the heat flow rate data in the heat insulation sheath are synchronously acquired in real time, the time sequence fusion is carried out to generate a multi-dimensional thermal state vector, the multi-dimensional thermal state vector is input into the thermal anomaly judgment model to comprehensively evaluate the coupling relation, the output linkage control instruction drives the execution module to execute the cooperative inhibition action on the corresponding thermal diffusion path, the problem that the response time delay and the early stage of thermal runaway are difficult to be quickly interfered due to insufficient monitoring dimensions and lack of cooperation of monitoring and inhibition of the traditional offline detection or single temperature sensing is solved, the quick linkage response of the thermal anomaly identification and the inhibition action is realized, the thermal diffusion path is timely blocked, the heat accumulation and the spread are avoided, and the thermal safety protection capability and the stable operation guarantee level of an electronic element and the whole system are improved. The foregoing description is only an overview of the present invention, and is intended to be implemented in accordance with the teachings of the present invention in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present invention more readily apparent. Drawings In order to more clearly illustrate the embodiments of the