CN-122018657-A - Heat dissipation control device and server

CN122018657ACN 122018657 ACN122018657 ACN 122018657ACN-122018657-A

Abstract

The application discloses a heat dissipation control device and a server, relates to the technical field of servers, and aims to control a heat dissipation assembly through a first controller under the condition that a substrate management controller fails. The heat dissipation control device comprises a substrate management controller, a plurality of heat dissipation controllers, a temperature information switching unit, a temperature sensor group and a heat dissipation assembly, wherein the substrate management controller is connected with the temperature information switching unit and is also connected with the heat dissipation controller, the temperature information switching unit is connected with the temperature sensor group and is also connected with the heat dissipation controller, the heat dissipation controller is electrically connected with the heat dissipation assembly, when the substrate management controller works normally, the substrate management controller acquires temperature information of the temperature sensor group through the temperature information switching unit and transmits the temperature information to the heat dissipation controller to adjust the heat dissipation assembly, and when the substrate management controller works abnormally, the heat dissipation controller adjusts the heat dissipation assembly according to the temperature information through the temperature information switching unit.

Inventors

DONG LIWEI
KONG XIANGTAO
Mu Zongyao

Assignees

苏州元脑智能科技有限公司

Dates

Publication Date: 20260512
Application Date: 20260126

Claims (10)

1. The heat dissipation control device is characterized by comprising a substrate management controller, a plurality of heat dissipation controllers, a temperature information switching unit, a temperature sensor group and a heat dissipation assembly; The substrate management controller is connected with the temperature information switching unit and also connected with the heat dissipation controller, and the temperature information switching unit is connected with the temperature sensor group and also connected with the heat dissipation controller; When the baseboard management controller works normally, the baseboard management controller acquires temperature information of the temperature sensor group through the temperature information switching unit, and transmits the temperature information to the heat dissipation controller to adjust the heat dissipation assembly; When the substrate management controller works abnormally, the heat dissipation controller adjusts the heat dissipation assembly according to the temperature information of the temperature sensor group through the temperature information switching unit.
2. The heat dissipation control apparatus according to claim 1, wherein the temperature information switching unit includes a first multiplexer; The first data input end of the first multiplexer is electrically connected with the communication end of the baseboard management controller, the second data input end of the first multiplexer is electrically connected with the communication end of the heat dissipation controller, the data output end of the first multiplexer is electrically connected with the temperature sensor group, and the selection control end of the first multiplexer is electrically connected with the general input and output end of the heat dissipation controller; And the heat dissipation controller is configured to send a switching instruction to the multiplexer through the general input/output end when the baseboard management controller works abnormally so as to control the first multiplexer to communicate the heat dissipation controller with the temperature sensor group.
3. The heat dissipation control of claim 1, wherein each of said heat dissipation controllers has unique identification information; the heat dissipation controllers are connected through an interconnection bus and configured to interact the identification information through the interconnection bus when the baseboard management controller works abnormally, and a master control heat dissipation controller is determined from the heat dissipation controllers according to a preset rule; the main control heat dissipation controller is used for acquiring the temperature information and calculating a rotating speed control strategy of the fan according to the temperature information; The heat sink controller is further configured to receive and execute a rotational speed control strategy of the fan over the interconnect bus when acting as a slave heat sink controller.
4. The heat dissipation control apparatus according to claim 3, wherein the identification information is a number of the heat dissipation module, and the preset rule is that when a master heat dissipation controller needs to be selected, a heat dissipation controller with a minimum number or a maximum number among all heat dissipation controllers is selected as the master heat dissipation controller.
5. The heat dissipation control apparatus of claim 1, further comprising a plurality of fan plates, each of said fan plates having a bumper disposed thereon, one of said bumpers being disposed on the same one of said fan plates as one of said heat dissipation controllers; The input end of the buffer is electrically connected with the signal output ends of other heat dissipation controllers; the buffer is used for receiving fan control signals generated by the other heat dissipation controllers and driving the heat dissipation assembly through the output end.
6. The heat dissipation control of claim 5, further comprising a plurality of signal selectors, at least one of said signal selectors being disposed on the same one of said fan plates as one of said heat dissipation controllers; the first input end of the signal selector is electrically connected with the signal output end of the heat dissipation controller and is used for receiving a fan control signal generated by the heat dissipation controller; The second input end of the signal selector is electrically connected with the output end of the buffer and is used for receiving standby control signals from other heat dissipation controllers; The signal selector is configured to communicate the output end to the first input end to output the fan control signal when the heat radiation controller is detected to work normally; When the abnormal operation of the heat dissipation controller is detected, the output end is communicated with the second input end so as to output the standby control signal, so that the heat dissipation assembly is controlled by other heat dissipation controllers.
7. The heat dissipation control of claim 6, wherein the signal selector is a second multiplexer.
8. The heat dissipation control of claim 3, wherein the heat dissipation controller is further configured to issue a fault alert signal containing its identification information when the heat dissipation controller switches to use a standby control signal from another heat dissipation controller or has an abnormality in its own state.
9. The heat dissipation control apparatus according to claim 1, further comprising a first switch connected to the temperature sensor group and further connected to the temperature information switching unit; The first switch is configured to transmit temperature information of a temperature sensor group to the baseboard management controller or the heat dissipation controller via the temperature information switching unit.
10. A server comprising the heat dissipation control apparatus according to any one of claims 1 to 9.

Description

Heat dissipation control device and server Technical Field The present application relates to the field of servers, and in particular, to a heat dissipation control device and a server. Background With the rapid development of cloud computing, artificial intelligence and high-performance computing, the computing density and power consumption of a server are rapidly increased, and the power consumption of a single machine is over 500 watts. Under the background, the heat dissipation efficiency directly determines the operation stability, energy efficiency and hardware service life of the server, and meanwhile, about 40% of the energy consumption of the data center is used for heat dissipation, so that the optimization of the heat dissipation technology becomes a core challenge of reducing the operation cost and realizing the green low-carbon target. Currently, air-cooled heat dissipation is commonly adopted in a server, and a main technical scheme is that a plurality of fans are arranged in a chassis, and the fans are usually installed on a fan board and controlled by a programmable logic device (Complex Programmable Logic Device, CPLD) on the board. Commands are issued to the programmable logic device via the I2C bus by a baseboard management controller (Baseboard Management Controller, BMC) to adjust fan speed, creating convective heat dissipation from the front/bottom of the chassis to draw in cool air and back/top exhaust hot air. However, when the baseboard management controller fails or is deactivated, the programmable logic device can only drive the fans to run at a fixed high rotation speed due to the fact that the information of the whole temperature sensor cannot be obtained, unnecessary energy consumption and noise are caused, accurate regulation and control cannot be performed according to real-time temperature, if the programmable logic device is damaged, the controlled fans are completely out of control, heat dissipation safety is seriously affected, in a high-density server adopting a plurality of fan boards, the programmable logic devices of the fan boards are difficult to cooperatively read global temperature information, and when the failure occurs, the positions of the fan boards with specific failures are difficult to accurately position, and operation and maintenance complexity and risks are increased. Disclosure of Invention The application provides a heat dissipation control device and a server, which at least solve the problem that when a baseboard management controller is in fault or deactivated, the whole heat dissipation control device can only adopt a fixed, high-energy consumption and high-noise heat dissipation mode because temperature information cannot be acquired. The application provides a heat dissipation control device which comprises a substrate management controller, a plurality of heat dissipation controllers, a temperature information switching unit, a temperature sensor group and a heat dissipation assembly, wherein the substrate management controller is connected with the temperature information switching unit and is also connected with the heat dissipation controller, the temperature information switching unit is connected with the temperature sensor group and is also connected with the heat dissipation controller, the heat dissipation controller is electrically connected with the heat dissipation assembly, when the substrate management controller works normally, the substrate management controller acquires the temperature information of the temperature sensor group through the temperature information switching unit and transmits the temperature information to the heat dissipation controller to adjust the heat dissipation assembly, and when the substrate management controller works abnormally, the heat dissipation controller adjusts the heat dissipation assembly according to the temperature information through the temperature information switching unit and the temperature information of the temperature sensor group. The application also provides a server which comprises the heat dissipation control device. The application also provides electronic equipment, which comprises a memory for storing a computer program and a processor for realizing the control process of the heat dissipation control device when the baseboard management controller works abnormally when the computer program is executed. The application also provides a computer readable storage medium, wherein the computer readable storage medium stores a computer program, and the computer program realizes the control process of the heat dissipation control device when the substrate management controller works abnormally when being executed by a processor. The application also provides a computer program product, which comprises a computer program, wherein the computer program realizes the control process of the heat dissipation control device when the substrate management controller works abnormally when bei