CN-122018658-A - Hard disk module and server

CN122018658ACN 122018658 ACN122018658 ACN 122018658ACN-122018658-A

Abstract

The application relates to a hard disk module and a server. The hard disk module comprises a hard disk bracket, a hard disk and a heat conduction module. The hard disk bracket is provided with an accommodating space. The hard disk comprises a hard disk body and a hard disk electric connector. The hard disk body is arranged in the accommodating space. The hard disk electric connector is connected to the hard disk body. The heat conduction module comprises a first plate body and a second plate body. The first plate body is connected to the second plate body. The first plate body and the second plate body are respectively and thermally coupled to two different sides of the hard disk body. The first plate body and the hard disk electric connector are positioned on the same side of the hard disk body. A server comprises a shell, a cold plate and a hard disk module.

Inventors

YU PENG
JI YIDONG
Zhu Kangguang

Assignees

英业达科技有限公司
英业达股份有限公司

Dates

Publication Date: 20260512
Application Date: 20260128

Claims (10)

1. A hard disk module, comprising: A hard disk bracket with a containing space; the hard disk comprises a hard disk body and a hard disk electric connector, wherein the hard disk body is arranged in the accommodating space, the hard disk electric connector is connected with the hard disk body, and The heat conduction module comprises a first plate body and a second plate body, wherein the first plate body is connected with the second plate body, the first plate body and the second plate body are respectively and thermally coupled to the different sides of the hard disk body, and the first plate body and the hard disk electric connector are positioned on the same side of the hard disk body.
2. The hard disk module of claim 1, wherein: The hard disk bracket further comprises a connecting plate and two assembly plates, wherein two opposite sides of the connecting plate are respectively connected with the two groups of the plates, and the connecting plate and the two groups of the plates jointly surround the accommodating space.
3. The hard disk module of claim 1, wherein: The heat conduction module further comprises a first heat conduction gasket, a second heat conduction gasket and a third heat conduction gasket, wherein the first heat conduction gasket and the second heat conduction gasket are respectively and thermally coupled to two opposite sides of the first plate body, the first heat conduction gasket is thermally coupled to one side of the hard disk body, and two opposite sides of the third heat conduction gasket are respectively and thermally coupled to the second plate body and the other side of the hard disk body.
4. A hard disk module as claimed in claim 3, wherein: The hard disk further comprises a hard disk golden finger, the hard disk golden finger and the hard disk electric connector are located on the same side of the hard disk body, the heat conduction module further comprises an insulating sheet, the insulating sheet is used for electrically insulating the first plate body and the hard disk golden finger, the insulating sheet is arranged on one side, facing the hard disk body, of the first plate body, and the insulating sheet is far away from the second plate body compared with the first heat conduction gasket.
5. The hard disk module of claim 1, wherein: The heat conduction module further comprises a hollowed-out portion, and the hollowed-out portion is located at one side, far away from the first plate, of the second plate.
6. A hard disk module as claimed in claim 3, wherein: The heat conduction module further comprises a third plate body, the third plate body is connected with the first plate body, the hard disk body is arranged between the second plate body and the third plate body, and the third plate body is thermally coupled with the hard disk body.
7. The hard disk module of claim 6, wherein: the heat conduction module further comprises a fourth heat conduction gasket, and two opposite sides of the fourth heat conduction gasket are respectively and thermally coupled with the third plate body and the hard disk body.
8. The hard disk module of claim 7, wherein: the heat conductivity of the first heat conduction gasket, the second heat conduction gasket, the third heat conduction gasket and the fourth heat conduction gasket is all 6-10W/(meter Kelvin).
9. The hard disk module of claim 2, wherein: The heat conduction module further comprises a first clamping part and at least one third clamping part, the first clamping part protrudes out of the first plate body, at least one third clamping part protrudes out of the second plate body, the third clamping part is positioned between the hard disk body and one of the two groups of plates, the hard disk bracket further comprises a second clamping part and at least one fourth clamping part, the second clamping part is positioned on one side, close to the first plate body, of the two groups of plates, at least one fourth clamping part protrudes out of the two groups of plates, the first clamping part is clamped with the second clamping part, and the third clamping part is clamped with the fourth clamping part so that the heat conduction module is assembled with the hard disk bracket.
10. A server for a server, which comprises a server and a server, characterized by comprising the following steps: A housing including a bottom plate; The cold plate is arranged on the bottom plate; hard disk module, set up in the cold plate is kept away from one side of bottom plate includes: A hard disk bracket with a containing space; the hard disk comprises a hard disk body and a hard disk electric connector, wherein the hard disk body is arranged in the accommodating space, the hard disk electric connector is connected with the hard disk body, and The heat conduction module comprises a first plate body and a second plate body, wherein the first plate body is connected with the second plate body, the first plate body and the second plate body are respectively and thermally coupled to the different two sides of the hard disk body, the first plate body and the hard disk electric connector are positioned on the same side of the hard disk body, and the first plate body is thermally coupled to the cold plate and guides heat generated by the hard disk body to the cold plate.

Description

Hard disk module and server Technical Field The present application relates to the field of computing devices, and in particular, to a hard disk module and a server. Background With the development of high-density servers, hard disks are used as core data storage devices, and the read-write speed is higher and higher, so that the heat generated by high-speed operation is increased. If the heat is not removed effectively in real time, the working temperature of the hard disk is too high, so that the data reading and writing efficiency is reduced, the ageing of electronic elements is aggravated, and even the risks of data loss or unstable system operation are possibly caused. The current common heat dissipation modes of the hard disk mainly comprise air cooling and liquid cooling. For the cold plate type liquid cooling server, if an effective and stable heat conduction path is not available between the hard disk and the cold plate, heat generated by the hard disk is difficult to be smoothly guided to the cold plate, and therefore the heat dissipation efficiency of the liquid cooling system is affected. Therefore, how to design a hard disk module capable of efficiently conducting heat generated by a hard disk to a cold plate and rapidly discharging the heat to an external environment is one of the problems to be solved by research personnel. Disclosure of Invention In view of the above, it is necessary to provide a hard disk module and a server. The invention provides a hard disk module, comprising: A hard disk bracket with a containing space; the hard disk comprises a hard disk body and a hard disk electric connector, wherein the hard disk body is arranged in the accommodating space, and the hard disk electric connector is connected with the hard disk body; And the heat conduction module comprises a first plate body and a second plate body, the first plate body is connected with the second plate body, the first plate body and the second plate body are respectively and thermally coupled to the different two sides of the hard disk body, and the first plate body and the hard disk electric connector are positioned on the same side of the hard disk body. In one embodiment, the hard disk bracket further comprises a connecting plate and two assembling plates, wherein two opposite sides of the connecting plate are respectively connected with two groups of the plates, and the connecting plate and the two groups of the plates jointly surround the accommodating space. In one embodiment, the heat conducting module further includes a first heat conducting pad, a second heat conducting pad and a third heat conducting pad, the first heat conducting pad and the second heat conducting pad are respectively and thermally coupled to two opposite sides of the first plate body, the first heat conducting pad is thermally coupled to one side of the hard disk body, and two opposite sides of the third heat conducting pad are respectively and thermally coupled to the second plate body and the other side of the hard disk body. In one embodiment, the hard disk further comprises a hard disk golden finger, the hard disk golden finger and the hard disk electric connector are located on the same side of the hard disk body, the heat conduction module further comprises an insulating sheet, the insulating sheet is used for electrically insulating the first plate body and the hard disk golden finger, the insulating sheet is arranged on one side, facing the hard disk body, of the first plate body, and the insulating sheet is far away from the second plate body compared with the first heat conduction gasket. In one embodiment, the heat conducting module further includes a hollowed portion, and the hollowed portion is located at a side, away from the first plate, of the second plate. In one embodiment, the heat conduction module further includes a third plate body, the third plate body is connected to the first plate body, the hard disk body is interposed between the second plate body and the third plate body, and the third plate body is thermally coupled to the hard disk body. In one embodiment, the heat conducting module further includes a fourth heat conducting pad, and two opposite sides of the fourth heat conducting pad are respectively and thermally coupled to the third plate body and the hard disk body. In one embodiment, the thermal conductivity of the first thermal conductive pad, the second thermal conductive pad, the third thermal conductive pad, and the fourth thermal conductive pad is between 6 and 10 watts/. In one embodiment, the heat conducting module further includes a first engaging portion and at least one third engaging portion, the first engaging portion protrudes from the first plate body, at least one third engaging portion protrudes from the second plate body, the third engaging portion is located between the hard disk body and one of the two groups of plates, the hard disk bracket further includes a second engaging portion