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CN-122018659-A - Novel soaking plate structure and radiator

CN122018659ACN 122018659 ACN122018659 ACN 122018659ACN-122018659-A

Abstract

The invention discloses a novel soaking plate structure and a radiator, wherein the soaking plate comprises a diffusion plate 11, a heat conducting plate 12 and cooling liquid positioned between the diffusion plate 11 and the heat conducting plate 12, a plurality of water absorbing columns 13 which are arranged in a crossed mode are arranged between the diffusion plate 11 and the heat conducting plate 12, at least one side of each water absorbing column 13 is an arc surface, and one side of the arc surface faces to a central heat source. The water absorption columns 13 are arranged between the diffusion plate 11 and the heat conducting plate 12 to absorb water vapor and conduct flow, so that the heat exchange efficiency between the diffusion plate 11 and the heat conducting plate 12 is improved, and the water absorption columns 13 are arranged in a staggered mode from the central heat source outwards, so that the water vapor can be absorbed to the greatest extent in the process of diffusing from the central heat source to the periphery, channels can be kept orderly and unblocked, each water absorption column 13 can play a role, and the heat dissipation performance is improved to the greatest extent.

Inventors

  • LI NA
  • LIN ZHENHUA
  • LIN JIAQI

Assignees

  • 东莞市宸精电子科技有限公司

Dates

Publication Date
20260512
Application Date
20260204

Claims (10)

  1. 1. The utility model provides a novel soaking plate structure, is including diffuser plate (11) and heat conduction board (12) and be located the coolant liquid between diffuser plate (11) and heat conduction board (12), its characterized in that: A plurality of water absorption columns (13) which are arranged in a crossed mode are arranged between the diffusion plate (11) and the heat conducting plate (12), at least one side of each water absorption column (13) is an arc surface, and one side of the arc surface faces to the central heat source.
  2. 2. The novel soaking plate structure according to claim 1, wherein the water absorbing columns (13) are arc-top prismatic, one side of the arc top faces to the central heat source, and the water absorbing columns (13) are distributed in a staggered mode in the front-back row.
  3. 3. The novel soaking plate structure according to claim 1, wherein the water absorption columns (13) are prisms with water drop-shaped cross sections, one side with arc length faces to a central heat source, and the water absorption columns (13) are distributed in a staggered mode in front-back rows.
  4. 4. The novel soaking plate structure of claim 1, wherein the water absorption column (13) is suspended on the diffusion plate (11) or the heat conduction plate (12) in a bowl-shaped convex part (16), and the bottom of the water absorption column (13) extends to the heat conduction plate (12) or the diffusion plate (11) to be contacted.
  5. 5. The novel soaking plate structure according to claim 4, wherein the water absorption column (13) is suspended on the diffusion plate (11) in a shape of a bowl-shaped convex part (16), the bottom of the bowl-shaped convex part (16) is in a shape of a column or a water drop and continuously extends to the heat conduction plate (12), and the bowl-shaped convex part (16) is inlaid with the bottom of the column or the water drop in a smooth transition manner.
  6. 6. The novel soaking plate structure according to claim 1, wherein the water absorption columns (13) are vertical walls which are staggered around the front and rear rows of the central heat source, and a plurality of ventilation holes (131) which transversely penetrate through the vertical walls are formed in the vertical walls.
  7. 7. The soaking plate structure according to claim 1, further comprising a wind guide hole (14) penetrating through the diffusion plate (11) and the heat conducting plate (12), wherein the wind guide hole (14) is led to one side of the chip.
  8. 8. The novel soaking plate structure according to claim 7, wherein the air guide holes (14) are tapered, and the aperture from the diffusion plate (11) to the heat conducting plate (12) is gradually changed from large to small.
  9. 9. The novel soaking plate structure according to claim 1, wherein supporting copper columns (15) which are positioned at the central heat source and used for resisting the pressure of the chip are further arranged between the diffusion plate (11) and the heat conducting plate (12), and the water absorbing columns (13) are distributed on the periphery of the supporting copper columns (15) in a crossed mode.
  10. 10. A radiator characterized by comprising a soaking plate (1) according to any one of claims 1-8, a heat conducting tube (2) in contact with the soaking plate (1) for conducting heat, a fin group (3) for the heat conducting tube (2) to pass through, and a fan group (4) arranged on the fin group (3), wherein a diffusion plate (11) and a heat conducting plate (12) of the soaking plate (1) are respectively in contact with the heat conducting tube (2) and a chip.

Description

Novel soaking plate structure and radiator Technical Field The invention relates to the technical field of radiators, in particular to a novel soaking plate structure and a radiator. Background For electronic products such as high-performance display cards, the performance of the radiator directly determines the running stability of equipment, the release of calculation force and the service life. When the electronic element works under high load, partial electric energy can be converted into heat energy through impedance generated by current flowing through the semiconductor, and if the heat cannot be timely dissipated, the frequency reduction can be triggered, the ageing of the element can be accelerated, and even the hardware is damaged. The main flow traditional heat dissipation mode has the advantages of simple air cooling structure, low cost and wide application, but has insufficient heat dissipation efficiency in a high-performance scene, high-efficiency and low-noise liquid cooling heat dissipation, adaptation to high-end requirements, complex structure, high cost and leakage prevention, high heat conduction speed of a heat pipe, and obvious heat dissipation effect attenuation under high load due to the restriction of the upper heat bearing limit and structural design. A Vapor Chamber (Vapor Chamber) is used as an upgrade scheme and is a core heat dissipation component of high-performance equipment, and the efficiency is far superior to that of a traditional heat pipe. The heat dissipation device is of a vacuum capillary cavity structure, is internally provided with working fluid, dissipates heat through rapid conduction of phase change closed loop of evaporation, condensation and backflow, has the advantages of two-dimensional plane soaking, high heat conduction efficiency and strong suitability, can be custom designed and is compatible with various heat dissipation systems, and the problem of local high temperature of cores is effectively solved. For example, the patent of Chinese patent grant publication No. CN 215117437U discloses a radiator and a heat pipe radiating structure thereof, wherein the heat pipe radiating structure comprises a first radiating fin unit, a second radiating fin unit, a soaking plate and a plurality of heat pipes, the first radiating fin unit comprises a first connecting groove, the second radiating fin unit comprises a second connecting groove, one end of each heat pipe is integrally formed with the soaking plate and is arranged in the first connecting groove, and the other end of each heat pipe is inserted into the second connecting groove. The heat pipe heat dissipation structure has uniform heat dissipation and reduces welding contact thermal resistance. Because the heat transfer is performed by the vaporization and liquefaction of the cooling liquid in the vapor chamber, how to improve the circulation of the cooling liquid in the vapor chamber is one of the key factors for improving the heat dissipation performance. In view of this, the present inventors have proposed the following means. Disclosure of Invention The invention aims to overcome the defects of the prior art and provides a novel soaking plate structure and a radiator. In order to solve the technical problems, the invention adopts the following first technical scheme: A novel soaking plate structure comprises a diffusion plate, a heat conducting plate and cooling liquid between the diffusion plate and the heat conducting plate, wherein a plurality of water absorbing columns which are arranged in a crossed mode are further arranged between the diffusion plate and the heat conducting plate, at least one side of each water absorbing column is an arc surface, and one side of each arc surface faces to a central heat source. In the above technical scheme, the water absorbing columns are arc-top prismatic columns, wherein one side of the arc top faces to the central heat source, and the water absorbing columns are distributed in a staggered manner in front and back rows. Furthermore, in the above technical solution, the water absorbing columns are prisms with cross sections in a droplet shape, wherein one side of the arc line is directed towards the central heat source, and the water absorbing columns are staggered in front and back rows. Furthermore, in the above technical solution, the water absorbing column is a bowl-shaped protrusion suspended on the diffusion plate or the heat conducting plate, and the bottom of the water absorbing column extends to the heat conducting plate or the diffusion plate to contact. Furthermore, in the above technical scheme, the water absorbing column is suspended on the diffusion plate in a bowl-shaped convex part, the bottom of the bowl-shaped convex part is in a column shape or a water drop shape and continuously extends to the heat conducting plate, and the bowl-shaped convex part and the column shape or the water drop shape bottom are inlaid and smoothly transited. In the a